• International Journal of Precision Engineering and Manufacturing
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• v.9 no.4
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• pp.22-25
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• 2008

The dynamic response of the head arm assembly (HAA) of a hard disk drive to an impact load was obtained from a 3D non-linear finite element model using ANSYS/LS-DYNA and from experiments using a modified levitation mass method (LMM). In the finite element model, the impact load was created by modeling the mass as a rigid body and making it collide with the HAA. The velocity, displacement, acceleration, and inertial force of the mass were then obtained from the time history data of the finite element analysis. In the LMM, a mass that was levitated with an aerostatic linear bearing, and hence encountered negligible friction, was made to collide with the actuator arm, resulting in a dynamic bending test for the arm. During the collision, the Doppler frequency shift of the laser beam reflected from the mass was accurately measured with an optical interferometer. The velocity, displacement, acceleration, and inertial force of the mass were accurately calculated from the measured time-varying Doppler frequency shift. A good correlation between the experimental data and FEA results was observed. The FEA was also used to investigate the dynamic response of the HAA to impact by different masses.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.8
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• pp.760-766
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• 2009

In the manufacturing process of HDD, ball swaging method is commonly used to joint the Head Gimbal Assembly(HGA) with the arm of the actuator. The hub on the HGA is placed into the hole of the actuator arm, and the hub and arm is bonded by the pressure of steel ball. The pressure for plastic deformation on the baseplate causes the undesirable deformation on HGA, such as tilting, flying height change of head. After obtaining the key parameters that have large sensitivity on the swaging process, the optimal shape of baseplate is proposed to increase the static performance during swaging process. Contribution of the proposed design for the swaging performance is verified by contact simulation with elasto-plastic deformation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.6
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• pp.29-34
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• 2017

This study analyzed automobile lower arm assembly structure and fatigue to identify configuration changes to enhance structural safety. Parts connected to the car body were fixed and 500 N load was applied at the lower arm head. Maximum equivalent stress and maximum total deformation were minimized for model 1 ( MPa and 0.10315 mm, respectively). Fatigue analysis using extreme SAE bracket history fatigue loads showed model 1 also improved fatigue life ($3.3693{\times}10^5cycles$). This study provides important inputs to improve lower arm durability by modifying the arm configuration.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.2
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• pp.281-289
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• 1992

In an attempt to simulate the flows in the computer hard disk storage system, flow visualization and quantification by image processing technique were applied. Model geometry was constructed while the dynamic similitude was maintained. Circumferential velocities were mapped out in the transient spin-up phase. During the spin-up phase, fluid close to the rotating inner hub approached the solid body rotation, while the fluid in the outer region showed the velocity deficit compared to the rotating speed of the disks. Effects of presence of read/write head arm assembly between the gap were studied by changing the location of the head. The experimental results could serve as a benchmark for the alidation of numerical codes.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.23 no.9
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• pp.1192-1200
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• 1999

The present study investigates flow characteristics in a cavity with one rotating disk and co-rotating disks for application to HDD. The experiments are conducted for rotating Reynolds numbers of $5.5{\times}104$ to $1.10{\times}105$ and for gap ratios of 0.059 to 0.175 in a single rotating and 0.047 to 0.094 in co-rotating disk. Time-resolved velocity components and turbulence intensity on the rotating disks are obtained by using LDA measurements. Detailed Knowledge of the flow characteristics is essential to analyze flow vibration and heat transfer and to design head-arm assembly and hub height in HDD. The results indicate that the velocity field in HDD is changed largely by the rotating Reynolds numbers and hub height of the disk.

• Journal of Technology Innovation
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• v.26 no.3
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• pp.37-68
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• 2018

Since the 20th century, automobiles, which are the most common means of transportation, have been evolving as the use of electronic control devices and automotive semiconductors increases dramatically. Automotive semiconductors are a key component in automotive electronic control devices and are used to provide stability, efficiency of fuel use, and stability of operation to consumers. For example, automotive semiconductors include engines control, technologies for managing electric motors, transmission control units, hybrid vehicle control, start/stop systems, electronic motor control, automotive radar and LIDAR, smart head lamps, head-up displays, lane keeping systems. As such, semiconductors are being applied to almost all electronic control devices that make up an automobile, and they are creating more effects than simply combining mechanical devices. Since automotive semiconductors have a high data rate basically, a microprocessor unit is being used instead of a micro control unit. For example, semiconductors based on ARM processors are being used in telematics, audio/video multi-medias and navigation. Automotive semiconductors require characteristics such as high reliability, durability and long-term supply, considering the period of use of the automobile for more than 10 years. The reliability of automotive semiconductors is directly linked to the safety of automobiles. The semiconductor industry uses JEDEC and AEC standards to evaluate the reliability of automotive semiconductors. In addition, the life expectancy of the product is estimated at the early stage of development and at the early stage of mass production by using the reliability test method and results that are presented as standard in the automobile industry. However, there are limitations in predicting the failure rate caused by various parameters such as customer's various conditions of use and usage time. To overcome these limitations, much research has been done in academia and industry. Among them, researches using data mining techniques have been carried out in many semiconductor fields, but application and research on automotive semiconductors have not yet been studied. In this regard, this study investigates the relationship between data generated during semiconductor assembly and package test process by using data mining technique, and uses data mining technique suitable for predicting potential failure rate using customer bad data.