• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.2
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• pp.119-126
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• 2016

In this study we investigated the effects of symmetrically arranged heat sources on the heat release performances of extruded-type heat sinks through experiments and thermal fluid simulations. Also, based on the results we suggested a high-efficiency and cost-effective heat sink for a solar inverter cooling system. In this parametric study, the temperatures between heaters on the base plate and the heat release rates were investigated with respect to the arrangements of heat sources and amounts of heat input. Based on the results we believe that the use of both sides of the heat sink is the preferred method for releasing the heat from the heat source to the ambient environment rather than the use of a single side of the heat sink. Also from the results, it is believed that the symmetric arrangement of the heat sources is recommended to achieve a higher rate of heat transfer. From the results of the thermal fluid simulation, it was possible to confirm the qualitative agreement with the experimental results. Finally, quantitative comparison with respect to mass flow rates, heat inputs, and arrangements of the heat source was also performed.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.1
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• pp.183-191
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• 2023

This study was conducted experimentally to investigate the surface temperature of the heat sink, the air temperature in the flow channel and the sample temperature by changing the channel number of channel type heat sink and the air flow rate when heating and cooling the bio sample. The target temperature of the sample was 15℃ or less as the minimum value and 82℃ or more as the maximum value. In this study, the channel number of the heat sink(N = 1, 2, 4, 5, 10) and the air flow rate(Q=25, 42, 54m³/min) were varied. The bio sample was replaced with water, and the volume of water is 4mL. The size of the heat sink is 80x73x150mm and the material is aluminum. When cooling the sample, the surface temperature, the air temperature and the sample temperature were highly dependent on the number of channels and the flow rate. However, when the sample is heated, the surface temperature, air temperature and sample temperature do not depend on the number of channels and the flow rate. It was found that the conditions for satisfying the minimum temperature of 15℃ or less when cooling the sample were the number of channels N≥5 and the flow rate Q≥42m³/min. When heating the sample, the conditions to satisfy the maximum temperature of 82℃ or more are the number of channels N≤5 and the air flow rate Q≤42m³/min.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.12
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• pp.986-993
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• 2007

The microchannel heat sink is promising heat dissipation method far high density electronic devices. The cross-sectional shape of MEMS based microchannel heat sink is limited to triangular, trapezoidal, and rectangular due to their fabrication method. And heat is added to one side surface of heat source. Therefore, those specific conditions make some complexity of heat transfer in microchannel heat sink. Though many previous research of conjugate heat transfer in microchannel was conducted, most of them did not consider heat loss. In this study, numerical investigation of conjugate heat transfer in rectangular microchannel was conducted. The method of heat loss evaluation was verified numerically. Heat distribution was different for each wall of rectangular microchannel due to thermal conductivity and distance from heat source. However, the ratio of heat from each channel wall was correlated. Therefore, the effective area correction factor could be proposed to evaluate accurate heat flux in one side heating condition.

• Journal of Mechanical Science and Technology
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• v.18 no.6
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• pp.1026-1035
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• 2004

An immersed boundary method for solving the Navier-Stokes and thermal energy equations is developed to compute the heat transfer over or inside the complex geometries in the Cartesian or cylindrical coordinates by introducing the momentum forcing, mass source/sink, and heat source/sink. The present method is based on the finite volume approach on a staggered mesh together with a fractional step method. The method of applying the momentum forcing and mass source/sink to satisfy the no-slip condition on the body surface is explained in detail in Kim, Kim and Choi (2001, Journal of Computational Physics). In this paper, the heat source/sink is introduced on the body surface or inside the body to satisfy the iso-thermal or iso-heat-flux condition on the immersed boundary. The present method is applied to three different problems : forced convection around a circular cylinder, mixed convection around a pair of circular cylinders, and forced convection around a main cylinder with a secondary small cylinder. The results show good agreements with those obtained by previous experiments and numerical simulations, verifying the accuracy of the present method.

• International Journal of Aerospace System Engineering
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• v.1 no.1
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• pp.44-47
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• 2014

This study proposes a development for the nano silver adhesive, which is applicable to high efficiency LED(light-emitting diode) light. The important issue of LED light is heat exhaust from LED. Generally, the middle area of LED light is increased up to 380K. Therefore, the bottleneck between LED chip and heat sink are caused by high temperature. In this work, the adhesive material between LED Chip and heat sink was newly developed for improvement of bottleneck. The nano silver was adopted to solve heat problem of chip on board package for LED light. In order to evaluate the performance of the nano silver adhesive, the thermal analysis was performed. Moreover both adhesive performance and heat exhaust were verified through the prototype test. From the experimental test results, it is found that the developed nano silver adhesive has the high performance.

• Fire Science and Engineering
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• v.10 no.2
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• pp.28-39
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• 1996

A recently developed electro-thermal simulation methodology is used to analyze the behavior of a PWM(Pulse-Width-Modulated) voltage source inverter which uses IGBT(Insulated Gate Bipolar Transistor) as the switching devices. In the electro-thermal network simulation methdology, the simulator solves for the temperature distribution within the power semiconductor devices(IGBT electro-thermal model), control logic circuitry, the IGBT gate drivers, the thermal network component models for the power silicon chips, package, and heat sinks as well as the current and voltage within the electrical network. The thermal network describes the flow of heat form the chip surface through the package and heat sink and thus determines the evolution of the chip surface temperature used by the power semiconductor device models. The thermal component model for the device silicon chip, packages, and heat sink are developed by discretizing the nonlinear heat diffusion equation and are represented in component from so that the thermal component models for various package and heat sink can be readily connected to on another to form the thermal network.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.6
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• pp.586-591
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• 2015

This study discusses numerically-explored thermal performances of hybrid fin heat sinks (HF HSs) for lightweight thermal management of LED modules under natural convection. A hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS) are proposed as HF HSs. A 3-D CFD analysis has been carefully conducted to obtain reliable numerical results. The 3-D CFD study investigates the effects of both fin spacing and an internal channel diameter on performances of the HHF HS and the SHF HS. The study results show that the mass-based thermal resistance of the HHF HS is 20~32% smaller compared with the pin fin heat sink (PF HS). The results also show that the mass-based thermal resistance of the HHF HS decreases with the increase of the channel diameter. These results are mainly due to coupled effects of the mass reduction and heat pumping through an internal channel. Considerably superior mass-based thermal performances of the HHF HS to the conventional PF HS suggest the feasible application for the lightweight thermal management of the LED modules under natural convection.

• Journal of Energy Engineering
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• v.26 no.2
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• pp.64-72
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• 2017

The performance analysis of the 70 W class LED lighting system suitable for the Middle East environment was performed using the lumped parameter model. The LED light is composed of a heating substrate, a heat pipe, and a heat sink. We divided the LED lights into four objects and applied energy equilibrium to each of them to establish four lumped nonlinear differential equations. The solution of the simultaneous equations was obtained by the Runge-Kutta method. Convective heat transfer coefficients of the lumped model were obtained by multidimensional CFD analysis. As a result of comparison with experiment, it was found that the heating substrate had an error of $1.5^{\circ}C$ and the upper heat sink had an error of $1.8^{\circ}C$ and the relative error was about 0.6 %. Using this model, temperature distribution analysis was performed for normal operating conditions with an ambient temperature of $55^{\circ}C$, with sunlight only, with abnormal operating conditions with sunlight, and without an upper heat sink.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.4
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• pp.733-737
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• 2007

The object of this paper is to propose a method to solve resulting heat in using numerous modulized watt-class LEDs in MCPCB as lighting device. To use LED for lighting, the chip needs to have a large capacity, resulting in extra heat in P-N connection area. To solve this problem, a Pottier Module, heat-sink panel and a fan was installed to measure variations in the temperature. Additionally, temperature variation characteristics were observed according to the heat conductor panel connecting cooling module and heat-sink panel, insulator and thermal grease. As a result, the type and amount of heat-sink panel was the most important facto. The fan would effect the temperature by max. $18[^{\circ}C]$ while other materials affected the temperature by $2{\sim}3[^{\circ}C]$, showing significant difference.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.1
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• pp.172-181
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• 1993

Pseudo-Brayton cycle is defined as an ideal Brayton cycle admitting the difference between heat capacities of working fluid during heating and cooling processes. The endo-pseudo-Brayton cycle which is a pseudo-Brayton cycle with heat transfer processes is analyzed with the consideration of maximum power conditions and the results were compared with those of the endo-Carnot cycle and endo-Brayton cycle. As results, the maximum power is an extremum with respect to the cycle temperature and the flow heat capacities of heating and cooling processes. At the maximum power condition, the heat capacity of the cold side is smaller than that of heat sink flow. And the heat capacity of endo-Brayton cycle is always between those of heat source and sink flows and those of the working fluids of pseudo-Brayton cycle. There is another optimization problem to decide the distribution of heat transfer capacity to the hot and cold side heat exchangers. The ratios of the capacies of the endo-Brayton and the endo-pseudo-Braton cycles at the maximum power condition are just unity. With the same heat source and sink flows and with the same total heat transfer caqpacities, the maximum power output of the Carnot cycle is the least as expected, but the differences among them were small if the heat transfer capacity is not so large. The thermal efficiencies of the endo-Brayton and endo-Carnot cycle were proved to be 1-.root.(T$_{7}$/T$_{1}$) but it is not applicable to the pseudo-Brayton case, instead it depends on comparative sizes of heat capacities of the heat source and sink flow.w.