• Restorative Dentistry and Endodontics
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• 제45권1호
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• pp.6.1-6.8
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• 2020

Objectives: This study investigated the effects of a hydrofluoric acid (HA; solution of hydrogen fluoride [HF] in water)-based smart etching (SE) solution at an elevated temperature on yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) ceramics in terms of bond strength and morphological changes. Materials and Methods: Eighty sintered Y-TZP specimens were prepared for shear bond strength (SBS) testing. The bonding surface of the Y-TZP specimens was treated with 37% phosphoric acid etching at 20℃-25℃, 4% HA etching at 20℃-25℃, or HA-based SE at 70℃-80℃. In all groups, zirconia primers were applied to the bonding surface of Y-TZP. For each group, 2 types of resin cement (with or without methacryloyloxydecyl dihydrogen phosphate [MDP]) were used. SBS testing was performed. Topographic changes of the etched Y-TZP surface were analyzed using scanning electron microscopy and atomic force microscopy. The results were analyzed and compared using 2-way analysis of variance. Results: Regardless of the type of resin cement, the highest bond strength was measured in the SE group, with significant differences compared to the other groups (p < 0.05). In all groups, MDP-containing resin cement yielded significantly higher bond strength values than MDP-free resin cement (p < 0.05). It was also shown that the Y-TZP surface was etched by the SE solution, causing a large change in the surface topography. Conclusions: Bond strength significantly improved when a heated HA-based SE solution was applied to the Y-TZP surface, and the etched Y-TZP surface was more irregular and had higher surface roughness.

• Korean Chemical Engineering Research
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• 제44권5호
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• pp.513-519
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• 2006

본 연구에서는 유리(glass)와 석영(quartz)을 재질로 사용하여 MEMS(micro-electro mechanical systems) 공정을 통해 전기영동(electrophoresis)을 위한 microchip을 제작하였다. UV 광이 실리콘(silicon)을 투과하지 못하는 점에 착안하여, 다결정 실리콘(polycrystalline Si, poly-Si) 층을 채널 이외의 부분에 증착시킨 광 차단판(optical slit)에 의해 채널에만 집중된 UV 광의 신호/잡음비(signal-to-noise ratio: S/N ratio)를 크게 향상시켰다. Glass chip에서는 증착된 poly-Si 층이 식각 마스크(etch mask)의 역할을 하는 동시에 접합표면을 적절히 형성하여 양극 접합(anodic bonding)을 가능케 하 였다. Quartz 웨이퍼에 비해 불순물을 많이 포함하는 glass 웨이퍼에서는 표면이 거친 채널 내부를 형성하게 되어 시료용액의 미세한 흐름에 영향을 미치게 된다. 이에 따라, HF와 $NH_4F$ 용액에 의한 혼합 식각액(etchant)을 도입하여 표면 거칠기를 감소시켰다. 두 종류의 재질로 제작된 채널의 형태와 크기를 관찰하였고, microchip electrophoresis에 적용한 결과, quartz과 glass chip의 전기삼투 흐름속도(electroosmotic flow velocity)가 0.5와 0.36 mm/s로 측정되었다. Poly-Si 층에 의한 광 차단판의 존재에 의해, peak의 S/N ratio는 quartz chip이 약 2배 수준, glass chip이 약 3배 수준으로 향상되었고, UV 최대흡광 감도는 각각 약 1.6배 및 1.7배 정도 증가하였다.