• Journal of the Korean Society for Precision Engineering
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• v.26 no.11
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• pp.35-40
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• 2009

This paper presents the geometrical analysis of an inclined ultra-precision grinding technology using simulations about grinding point locus for micro lens manufacturing. Simulation results show the relationship between radius ratios ($R_1/R_2$) and wheel center locus. Furthermore, the critical grinding wheel radius ($R_1$) can be calculated from work-piece radius ($R_2$) and inclined angle ($\theta=-45^{\circ}$). These achievements could be applied to calculate CNC data in ultra-precision grinding and give insight for wheel wear and compensation grinding.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.6
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• pp.42-48
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• 1998

This paper is concerned with the heat flux distribution and energy partition for creep-feed grinding. From measurements of transient grinding temperatures in the workpiece sub-surface using an embedded thermocouple, the overall energy partition to the workpiece was estimated from moving heat source theory for a triangular heat flux distribution as 3.0% for down grinding and 4.5% for up grinding. The higher energy partition for up grinding can be attribute to the need to satisfy thermal compatibility at the grinding zone. The influence of cooling outside the grinding zone can be analytically taken into account by specifying convective heat transfer coefficients on the workpiece surface ha ahead of the heat source (grinding zone) and hb behind the heat source. The smaller energy partition together with slightly lower grinding power favors down grinding over up grinding.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.11
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• pp.1121-1128
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• 2013

Ultrasonic grinding system is that the ultrasonic vibration by ultrasonic actuator is applied on conventional grinding system during grinding process. The Ultrasonic vibration with a frequency of over 20kHz can reduce grinding forces and increase surface quality, material removal rate (MRR) and grinding wheel life. In addition, ultrasonic vibration assisted grinding can be used for the materials that are difficult to cut. In this paper, methodology for ultrasonic tools is studied based on finite element method, and in turn the ultrasonic tools are designed and fabricated. It is found that the ultrasonic tool can vibrate with a frequency of 20kHz and amplitude of $25{\mu}m$. In order to verify the machining performance, the grinding experiment is performed on titanium alloy. By applying ultrasonic vibration, the grinding force and temperature are reduced and MRR is increased compared with the conventional grinding.

• International Journal of Precision Engineering and Manufacturing
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• v.2 no.1
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• pp.81-86
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• 2001

This paper deals with the monitoring of grinding wheel wear in surface grinding process. A monitoring system, which makes use of a laser scanning micrometer, is developed to measure the circumferential shape as well as the axial profile of grinding wheel. The monitoring system is applied to surface grinding processes. The experimental results show that the developed monitoring system is useful not only for monitoring the amount of wear in grinding wheel but also for evaluation the quality of ground surface and determining proper derssing time for the grinding wheel.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.5
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• pp.59-65
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• 1998

In order to utilize the information of well-know grinding database or grinding machine characteristics, a database needs to be designed by considering the delicate property of the machine tools for the high precision and quality of the demanding specification. Among the machine tools for the high precision and quality of the demanding specification. Among the machine tools, machining conditions of the grinding are various and knowledge repeatance obtained form the grinding process are less credable. therefore it is desirable for database, which is used to set the grinding conditions, to utilize the maximum machine tool capability. The present paper studied on the occurance limit of chatter vibration and burn considering the characteristics of machine tool. And also basic experiments were performed to establish the optimum grinding conditions which could maximize the grinding efficiency.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.2
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• pp.138-143
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• 2000

The establishment of a practical ultra-precision grinding technique using Diamond and CBN wheels is one of the major key technolo-gies to improve production techniques for machine-to-difficult materials without finishing process such as lapping and polishing. But the special efficient dressing technique for ultra-fine grit type grinding wheels to stabilize the grinding ability was not developed. Recently electrolytic in-process dressing technique is proposed to ultra-fine grit type metal bonded diamond wheels to protrude abra-sives continuously from the tool surface. This technology can be widely used to surface grinding and cylindrical grinding but cannot be used efficiently to internal grinding because of the electrode attachment trouble. This paper describes the effect of interval type electrolytic dressing as proposed newly to cast iron bonded diamond wheel for efficient internal grinding with mirror type high quality ground surface.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.5
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• pp.165-171
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• 2000

To get smoother ground surface, it is required to replace the grinding wheel with a finer-grit wheel. When the operator replaces the grinding wheel, the balancing and dressing of the wheel surface are necessary. So this replacement has a lot of problems like inconvenience to operators, delays in the operation time, and ineffectiveness in the production process. Therefore, a laminated grinding wheel, which consists of three layers, is provided. The side layers are coarse grits and the middle layer is made up of fine grits. To show the effectiveness of the laminated grinding wheel, experiments on the surface roughness and the material removal rate were performed respectively. As a result, it was found that the grinding process using a laminated grinding wheel can generate smoother ground surface in shorter time.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.6
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• pp.65-70
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• 2000

Although the net-shape molding of composites is generally recommended, molded composites frequently requires cutting or grinding due to the dimensional inaccuracy for precision machine elements. During the composite machining operations such as cutting and grinding, the temperature at the grinding area may increase beyond the allowed limit due to the low thermal conductivity of composites, which might degrade the matrix of composite. Therefore, in this work, the temperature at the grinding point during surface grinding of carbon fiber epoxy composite was measured. The grinding temperature and surface roughness were also measured to investigate the surface grinding characteristics of the composites. The experiments were performed both under dry and wet grinding conditions with respect to cutting speed, feed speed, depth of cut and stacking angle. From the experimental investigation, the optimal conditions for the composite surface grinding were suggested.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.05a
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.46-51
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• 2002

A grinding technology is very essential to finish the surface of IT and BT industrial application parts such as wafer, optical connection part and lenses etc. However the finding machine has bead depended on imports. Especially, it is completely imported for machining high precision part relevant to domestic electric and communicational industries. The amount to import grinding machine is about $110milions. It takes about 35% of total import amount of all the machine tools. A domestic finder manufacturer is a very small-scaled bussinessman and research facilities is poor. Recently, it is increasing to demand high speed and precision grinding technology because it brings cost down and value added up. Its further study will be something related to inteligent grinding system fur value added and high precision part. It will make domestic grinding technology to its advanced country level.