• 한국생산제조학회지
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• 제6권3호
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• pp.17-25
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• 1997

This paper aims to clarify the effects of grinding conditions on the grinding force, ground surface and chipping size of workpiece in surface grinding of various ferrites with the resin bond diamond wheel. The main conclusions obtained were as follows: In a constant peripheral wheel speed, the specific grinding energy is fitted by straight lines with grinding depth coefficient($\delta$) in a logarithmic graph. The effect of both depth of cut and workpiece speed on grinding energy becomes larger in the order of Mn-Zn, Cu-Ni-Zn and Sr. When using the diamond grain of the lower toughness, the roughness of the ground surface becomes lower. The ground surfaces show that the fracture process during grinding becomes more brittle in the order of Sr, Mn-Zn and Cu-Ni-Zn. The chipping size at the corner of workpiece in grinding increases with the the increases of the depth of cut and workpiece speed, and the decrease of peripheral wheel speed. The effect of both depth of cut and workpiece speed on chipping size becomes more larger in the order of Sr, Mn-Zn and Cu-Ni-Zn.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• 한국기계가공학회지
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• 제15권5호
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• pp.73-79
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• 2016

In this paper, the grinding characteristics in thrust internal grinding have been studied using vitreous CBN wheels with a machining center. Grinding experiments have been performed according to grinding conditions such as wheel feed speed, cut depth, workpiece speed, rate of grinding width and number of grinding passes. The machining error, shape of machined surfaces, grinding force, and surface roughness have been investigated though these experiments. Based on the experimental results, the grinding characteristics on the machined surface in the internal thrust grinding are discussed.

• 한국정밀공학회지
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• 제17권9호
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• pp.45-52
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• 2000

To reduce two preprocess operations to one in the surface grinding operation the laminated grinding wheel was introduced and its availability has already been investigated in the cylindrical grinding process. Thus in this study the experiment was carried out to attempt to prove that the laminated grinding wheel can be used in the surface grinding process with respect to the roughness and grinding force.

• 한국정밀공학회지
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• 제19권5호
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• pp.95-102
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• 2002

The grinding operation is an important machining process for machining of final surface. However, grinding process has inevitable troubles such as loading and glazing for grinding wheel. It is, therefore, an essential research theme to determine the wheel life and the dressing time for efficient grinding. In this study, AE signals (AEavg) generated in the grinding operation were measured and the dressing time was determined from the analysis of the AEavg value. To verify the propriety of the obtained result, the AE signals measured on the grinding and the dressing operation were compared with the grinding force signals and the dressing force which were measured at same time. From the obtained result, it was confirmed that the determination of the wheel life and the dressing tilde by the AE measurement technique proposed in this study can be practically used.

• 제어로봇시스템학회논문지
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• 제12권11호
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• pp.1088-1094
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• 2006

In this paper, an auto path generation and an active compliance grinding control using 3-axis farce sensor are presented. These control algorithms enable the grinding robot to follow unknown path of various workpiece shape pattern. The robot is able to go grinding along unknown paths by position controller managing tangential direction angle and cutting speed, with only information about the start position and the end position. Magnitude and direction of normal force are calculated using force data that go through low pass filter. Moreover, normal and tangential directions are separated for force control and velocity control, respectively.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.862-865
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• 2000

The surface grinding of STD-11 was attempted on the machining center. Grinding experiments were performed at the various grinding conditions and the grinding force, machining error, grinding ratio, and surface roughness were measured. The experimental results indicate that the grinding ratio decreases as the table speed and depth of cut increase. The surface roughness of ground surface was not affected by the change of depth of cut. The surface roughness values obtained on the experiments were 0.02 ～ 0.03${\mu}{\textrm}{m}$ which are fairy good and acceptable for ground surface.

• 한국정밀공학회지
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• 제24권6호
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• pp.51-57
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• 2007

Creep-feed grinding is an effective technology processes to increase the productivity and efficiency in form grinding. This method has, however, some problems which the progress of abrasive wear around the cutting edge is remarkable, grinding force become intense and burn marks on the ground surface occur frequently. In order to solve this problems, it is proposed in this study to dress the grinding wheel continuously during the grinding process. The purpose of this research is. therefore, that CNC creep-feed grinding machine which has a continuous dressing device developed and some grinding experiments for determination of dressing conditions carried out.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.623-624
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• 2012

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.700-705
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• 2003

In this paper, an extended process model is proposed for the application of flexible belt grinding equipment as utilized in robotic grinding. The analytical and experimental results corresponding to grinding force, material removal rate (MRR) and contact area in the robotic grinding shows the difference between the conventional grinding and the flexible robotic grinding. The process model representing the relationship between the material removal and the normal force acting at the contact area has been applied to robotic programming and control. The application of the developed model in blade grinding demonstrates the effectiveness of proposed process model.