• 한국정밀공학회지
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• 제14권5호
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• pp.85-91
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• 1997

Air grinding time in grinding process has a great effect on its efficiency due to low feedrate. This paper presents a reduction methos of air grinding time in cylindrical plunge grinding operation. Tje reduction of air grinding time is accomplished by finding the distance between contact point and rising point of ultra- sonic signal of the grinding wheel to workpiece. It uses a variation of sound signal generated by the flow of coolant when the grinding wheel approaches to workpiece. The ultrasonic sensor with 23 kHz center fre- quency and 8 kHz bandwidth is used to find the nearest approaching point(NAP). Monitoring and control system of the grinding conditions is implemented with CNC controller to control feedrate override and ultrasonic sensor to find NAP. The experimental result shows that the ultrasonic signal is a good measure- ment to find NAP. But it needs the considerations for the effect of the relationship between flowrate of coolant and diameter of workpiece.

• 한국생산제조학회지
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• 제18권5호
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• pp.443-448
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• 2009

The roughness models have developed to describe the grinding behaviour and predict the final quality of workpiece. The model forms of the plunge grinding process are generally established with initial and steady state model form in accordance with the accumulated metal removal. The steady state roughness model form are based on the grinding condition and specific parameters are used to show the influence of it according to the grinding process such as the equivalent chip thickness and accumulated metal removal. However, the models have been developed in past are not considered the effect of changing the grinding conditions in the same batch. In this paper, the roughness model form to consider the effect of changing grinding condition is proposed and the performance of proposed model is evaluated based on the experimental results.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• 한국생산제조학회지
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• 제6권3호
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• pp.17-25
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• 1997

This paper aims to clarify the effects of grinding conditions on the grinding force, ground surface and chipping size of workpiece in surface grinding of various ferrites with the resin bond diamond wheel. The main conclusions obtained were as follows: In a constant peripheral wheel speed, the specific grinding energy is fitted by straight lines with grinding depth coefficient($\delta$) in a logarithmic graph. The effect of both depth of cut and workpiece speed on grinding energy becomes larger in the order of Mn-Zn, Cu-Ni-Zn and Sr. When using the diamond grain of the lower toughness, the roughness of the ground surface becomes lower. The ground surfaces show that the fracture process during grinding becomes more brittle in the order of Sr, Mn-Zn and Cu-Ni-Zn. The chipping size at the corner of workpiece in grinding increases with the the increases of the depth of cut and workpiece speed, and the decrease of peripheral wheel speed. The effect of both depth of cut and workpiece speed on chipping size becomes more larger in the order of Sr, Mn-Zn and Cu-Ni-Zn.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.61-65
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• 1996

This paper experimentally describes the grinding characteristic of discontinuous grinding wheels in creep-feed grinding. In creep-feed grinding, grinding temperature increases rapidly and thermal damage such as a burn occurs on a workpiece. Discontinus grinding wheel with Conventional grinding wheel shows an exellent cooling effect has been developed. The wheels have 6, 12, 24 pieces of slotted which compare with characteristics of each wheels

• International Journal of Precision Engineering and Manufacturing
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• 제6권1호
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• pp.59-64
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• 2005

This paper describes an investigation about the fluid delivering method that minimizes the generation of hydrodynamic pressure and improves the grinding accuracy. Traditionally, grinding fluid is delivered for the purpose of cooling, chip flushing and lubrication. Hence, a number of conventional investigations are focused on the delivering method to maximize fluid flux into the contact arc between the grinding wheel and the work piece. It is already known that hydrodynamic pressure generates due to this fluid flux, and that it affects the overall grinding resistance and machining accuracy. Especially in the ultra-precision mirror grinding process that requires extremely small amount of cut per pass, its influence on the machining accuracy becomes more significant. Therefore, in this paper, a new delivering method of grinding fluid is proposed with focus on minimizing the hydrodynamic pressure effect. Experimental data indicates that the proposed method is effective not only to minimize the hydrodynamic pressure but also to improve the machining accuracy.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.900-904
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• 1997

A problem in the grinding process using the machining center(MC) with a small diametric wheel is the machining error due to due to decrease of quill diameter. In this paper, a side-cut grinding is performed with a vitrified bonded CBN wheel by the MC, and the relation between grinding force and machining error for grinding conditions is investigated experimentally. It is show that the normal force has a significant effect on the machining error.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1998년도 추계연구발표회 논문개요집
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• pp.110-111
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• 1998

• International Journal of Precision Engineering and Manufacturing
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• 제4권3호
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• pp.62-67
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• 2003

The grinding force generated during the grinding process causes an elastic deformation of the workpiece, grinding wheel, and machine system. Thus, the true depth of cut is always smaller than the apparent depth of cut. This is known as machining elasticity phenomenon. The machining elasticity parameter is defined as a ratio between the true depth of cut and the apparent depth of cut. It is an important factor to understand the material removal mechanism of the grinding process. To increase productivity, the value of this machining elasticity parameter must be large. Therefore, it is essential to know the characteristics of this parameter. The objective of this research is to study the effect of the major grinding conditions, such as table speed, depth of cut, on this parameter experimentally, Through this research, it is found that this parameter value is increasing when the table speed is decreasing or the depth of cut is increasing. Also, this parameter value depends on the grinding mode (up grinding, down grinding).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1257-1260
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• 2005

Grinding process has unique characteristics compared with other machining processes. The cutting edges of the grinding wheel don't have uniformity and act differently on the workpiece at each grinding. The response surface analysis is one of various methods for optimizing and evaluating the process parameters to achieve the desired output. In this study, the effect of the grinding parameters on outcomes of the surface grinding was analyzed experimently. To predict the grinding outcomes and to select the grinding conditions before grinding, the second-order response surface models for the grinding force and the surface roughness were developed.