• Journal of Microbiology and Biotechnology
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• v.30 no.11
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• pp.1706-1719
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• 2020

The objective of this study was to optimize the conditions for enhancing the antioxidant properties of sword bean (Canavalia gladiata) as a coffee substitute in two processing methods, roasting and grinding. The optimum conditions for removing off-flavor of the bean and maximizing functionality and efficiency were light roasting and cryogenic grinding (< 53 ㎛). In these conditions, extraction yield was 16.75%, total phenolic content (TPC) was 69.82 ± 0.35 mg gallic acid equivalents/g, and total flavonoid content (TFC) was 168.81 ± 1.64 mg quercetin equivalents/100 g. The antioxidant properties were 77.58 ± 0.27% for DPPH radical scavenging activity and 58.02 ± 0.76 mg Trolox equivalents/g for ABTS radical scavenging activity. The values for TFC and ABTS radical scavenging activity were significantly higher (p < 0.05) than in other conditions, and TPC and DPPH radical scavenging activity were second highest in lightly roasted beans, following raw beans. HS-SPME/GC-MS analysis confirmed that the amino acids and carbohydrates, which are the main components of sword bean, were condensed into other volatile flavor compounds, such as derivatives of furan, pyrazine, and pyrrole during roasting. Roasted and cryogenically ground (cryo-ground) sword beans showed higher functionality in terms of TFC, DPPH, and ABTS radical scavenging activities compared to those of coffee. Overall results showed that light roasting and cryogenic grinding are the most suitable processing conditions for enhancing the bioactivity of sword beans.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.1
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• pp.68-73
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• 2016

In this paper, the grinding characteristics in internal grinding methods(plunge, thrust) were studied with vitreous CBN wheels using machining center. Grinding experiments were performed according to the same material removal rate conditions such as a wheel speed, depth of cut and workpiece speed. And the grinding force, machining error and grinding ratio were investigated though these experiments. Based on the experimental results, the grinding characteristics on internal grinding methods were compared.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.4
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• pp.118-122
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• 2001

In this study, the variation of surface roughness was tested in surface grinding for the three working materials SM45C, heat-treated SM45C, and gray cat iron. IT was performed for the various grinding wheels with two grain size #60, #100, and three grade I, O, R and various grinding depths and feeds, The fractural grinding depths which were obtained when the grinding wheels were destructed in surface grinding works, were examined and compared with the calculated value sug-gested in this study, The results showed that the surface roughness was decreased by decreasing grinding depth, and feed, and increasing grain size and grades. The fracture grinding depths were increased by increasing grain size, grade and feed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.613-616
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• 2000

This paper deals with monitoring of grinding wheel wear in surface grinding process. A laser scanning micrometer is used to measure the circumferential shape as well as the axial shape of grinding wheel. The monitoring system is applied to two kinds of grinding methods: plunge and traverse grinding. Through experiments, it is found that measurement of grinding wheel wear reveals information of roughness of ground surface and the adequate dressing time. In addition, monitoring of grinding wheel wear makes it possible to identify abnormal grinding conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.20-23
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• 2002

In silicon wafer manufacturing process, the grinding process has been adopted to improve the quality of wafer such as flatness, roughness and so on. This paper describes the effect of grinding process on the surface quality of wafer. The experiments are carried out by high precision in fred grinder with air bearing spindle. The relationship between the inclination of chuck table and the flatness of wafer is investigated, and the effect of grinding conditions including wheel speed, table speed, and feed rate on damage depth and roughness of wafer is also investigated. The experimental results show that there is close relationship between the inclination of the chuck table and the flatness of wafer, and the grinding conditions within this paper little affect the flatness of wafer and relatively high affect the damage depth of wafer.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.54-59
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• 2004

A measure for good products manufactured by grinding process is the surface roughness that is affected by a lot of operating parameters such as types of abrasive, grain size, bond material, wheel speed, table speed, depth of cut, hardness of workpiece and stiffness of grinding machine. In this study, an application of the design of experiments was tried for evaluating the effect of operating parameters on the surface roughness. The workpiece was a high speed tool steel(SKH51) and the surface grinding was conducted. In order to obtain the best surface roughness within constraints of the working range, the optimal grinding conditions were selected. The usefulness of this method was evaluated by the statistical strategy.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.519-524
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• 1999

To manufacture alumina products, sintering and grinding process are needed. In Al2O3 grinding, macro/micro surface fracture and cracks are easily occurred on the ground surface because of its high brittleness. In view point of fatigue fracture, surface profile produced by grinding is considered as notches. Therefore, it was reasonable that magnitudes and shapes of surface profiles effects on fatigue strength and life. Particularly, surface finish of Al2O3 which have high hardness and brittleness have an effect on fatigue strength. In this paper, some experiments are carried out to examine influence of grinding conditions to magnitude and shape of surface profile as well as the relationships of Ra, Rmax, Rmax/Ra, and Ku. Through the experimental results, It is found that Ra and Rmax was affected by grinding conditions, but Rmax/Ra and Ku was not. There are linear relations between Ra and Rmax, and between Rmax/Ra and Ku.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.6
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• pp.440-444
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• 2016

Owing to the introduction of various IT devices with emphasis on portability and design, the TFT (thin film transistor liquid crystal display) panel applied to IT devices has the same shape as the product, and the portability requirement of IT devices has resulted in a need for panels with higher rigidity. In this study, the effect of grinding conditions such as the feed rate and edge speed of edge grinding on the surface roughness and chipping of the machined surface is investigated using a metal bond wheel. During edge grinding of alkari-free glass, weak mechanical property of glass results in big chipping owing to generation of tensile stress at the end of grining operation. The results of this study show that the grinding characteristics of alkali-free glass are obtained and meet industry requirements.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.5
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• pp.73-79
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• 2016

In this paper, the grinding characteristics in thrust internal grinding have been studied using vitreous CBN wheels with a machining center. Grinding experiments have been performed according to grinding conditions such as wheel feed speed, cut depth, workpiece speed, rate of grinding width and number of grinding passes. The machining error, shape of machined surfaces, grinding force, and surface roughness have been investigated though these experiments. Based on the experimental results, the grinding characteristics on the machined surface in the internal thrust grinding are discussed.