• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.90-95
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• 2005

To perform the finish outside-diameter grinding process of ferrules which are widely used as fiber optic connectors, a high-precision centerless grinding machine is necessary. In this study, the thermal characteristics of the high-precision centerless grinding machine such as the temperature distribution, temperature rise and thermal deformation, are estimated based on the virtual prototype of the grinding machine and the heat generation rates of heat sources related to the machine operation conditions. The reliability of the predicted results is demonstrated by the temperature characteristics measured from the physical prototype. Especially, the predicted and measured results show the fact that the high-precision centerless grinding machine consisted of the hydrostatic GW and RW spindle systems, hydrostatic RW feeding mechanism, RW swivel mechanism, on-machine GW and RW dressers, and concrete-filled steel bed, has very stable thermal characteristics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.516-519
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• 2004

As the optical communication industry is developed, the demand of optical communication part is increasing. ZrO$_2$ ceramic ferrule is very important part which can determines the transmission efficiency and information quality to connect the optical fibers. In general ZrO$_2$ ceramic ferrule is manufactured by grinding process because the demands precision is very high. And the co-axle grinding process of ZrO$_2$ ceramic ferrule is to make its concentricity all of uniform before centerless grinding. This paper deals with the analysis of the process parameters such as grinding wheel speed, grinding feedrate and regulating wheel speed as influential factors, on the concentricity and surface finish developed based on Taguchi's experimental design methods. Taguchi s tools such as orthogonal array, signal-to-noise ratio, factor effect analysis, etc. have been used for this purpose optimal condition has been found out. Thus, if possible be finding highly efficient and quality grinding conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.870-873
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• 2000

This investigation reports the grinding characteristics of quartz. Grinding experiments were performed at various grinding conditions including wheel mesh, table speed and depth of cut. The grinding forces and specific grinding energies were measured to compare the grindability of quartz with those of structural ceramics such as A1$_2$O$_3$, SiC, Si$_3$N$_4$ and ZrO$_2$. Surface roughness was also measured with tracer and the ground surfaces were observed with SEM. The chip formation energy of quartz was about 6J/㎣, which is quite smaller than those of structural ceramics. Although plastic flows are occured in Si$_3$N$_4$ and ZrO$_2$, micro/macro cracks are occured in ground surface of quartz like in A1$_2$O$_3$ and SiC.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.80-84
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• 1996

This paper aims at reviewing the Possibility application over normal or abnormal, detection used by AE and the wear characteristics of grinding process. In this study, when diamond bur in dentistry with chosen grinding conditions were tuned at grinding. The variation of grinding resistance and hE signal is detected by the use of AE measuring system. The tests are carried out in accordance with diamond burs and workpiece; arcyl and bovine. According to the experiment results, the following can be expected; AE has the possibility to detect the state normality and abnormality. However, the grinding resistance measuring can find it difficult to detect it. It can be accurately excerpted from AE occurrence pattern in contact start point of diamond bur and bovine, grinding condition and derailment point. It is known that AE$\_$rms/ is well compatible with grinding resistance. According to the increase of the material removal rate, the specific energy of the diamond bur is inclined to decrease and the grinding resistance has a tendency to increase.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.70-73
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• 2002

Using zirconium ceramics makes the ferrule, which is the part of optical communications. The quality of optical communications is directly affected by the concentricity of the optic ferrule. The products of optic ferrule should be meet the following general conditions which are the outer diameter of 2.5mm and the inner diameter of 0.125mm, and high quality conditions which are the concentricity of 0.1~$0.3\mu\textrm{m}$, the form accuracy of $0.2\mu\textrm{m}$, the roundness and the cylindricity of $0.1\mu\textrm{m}$ and the surface roughness of 10nm. Generally, the diamond wheel is used for the high efficiency and precision grinding of the materials. It is good for keeping the shape as it has little wear. Because of the loading phenomena, however, it is difficult to keep the fresh surface of the wheel. In grinding process, grinding fragments resemble fine powders rather than chips. It can easily get attached to the wheel surface and thus cause a loading. The loading takes place, in which the impurities stick to the wheel surface, and the grinding characteristics of wheel is deteriorated. To prevent all of these, a suitable dressing method should be used for the wheel. In this research, the dressing system fur co-axial grinding machine was designed and produced for the machining of ferrule, which is a high performance part. The performance of the developed dressing system was evaluated by measuring the form accuracy of ferrule, which is machined by the dressed wheel in developed dressing system.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.422-427
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• 2003

Sapphire have been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing Process.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.71-76
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• 2001

In general, it is known that the wear rate of the abrasive and the removal rate of the metal bond of the grinding wheel should be balanced to maintain the depth of the insulating surface layer to an appropriate level. In order to accomplish, the high quality ELID grinding, therefore, it is necessary to measure the depth of the insulating layer in real-time and then to control the electrolytic conditions to keep the depth to a certain level. In this study, an in-process measurement system of the insulated layer using two gap sensors - a capacitor type and an eddy current type - developed and the change of the status of the insulated layer during ELID grinding is detected. And from the experimental data, we have chosen the best mathematical model to predict the depth of the insulating layer.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.5
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• pp.64-71
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• 2009

Cylindrical lens core for optical transceiver was designed and machined. With the lens design data, WC asymmetric core surface data were generated for non-revolutional ultra-precision grinding. Grinding process for optimum machining conditions of target surface was studied in terms of surface roughness and form profile. We used experimental results to optimize turbine speed, feed-rate and depth of cut with durable grinding wheel wear. Ground WC cores were measured contact type profilers and verified.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.2
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• pp.30-36
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• 2007

In order to estimate the maximum undeformed chip thickness in grinding operation, it is necessary to obtain the successive cutting point spacing. In the past it was obtained by experiments. In this paper, the average successive cutting point spacing has been obtained using the given grinding input conditions and it is possible to estimate the maximum undeformed chip thickness without using any experimentally obtained data. The validity of the proposed analysis has been verified based on two sets of grinding scratch tests using WA and CBN grinding wheels.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.3-7
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• 1995

Force generated during grinding process causes elastic defomation. The effect of this deforms a workpiecs. So grinding system is explainable using the concept of macining elasticity phenomenon. Machining elasticity is defined as ratio between the true depth of c ut, and an importnat factor to affect material removal mchanism and productivity. Generally, to produce accurate surface and dimensionally precise components operators depend on their experiences. Because of these, productivity is reduced and time is wasted. The objective of this reserch is to study the effect of grinding conditions, such as table speed, depth of cut on the machining elasticity parameter.