• 한국생산제조학회지
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• 제18권5호
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• pp.443-448
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• 2009

The roughness models have developed to describe the grinding behaviour and predict the final quality of workpiece. The model forms of the plunge grinding process are generally established with initial and steady state model form in accordance with the accumulated metal removal. The steady state roughness model form are based on the grinding condition and specific parameters are used to show the influence of it according to the grinding process such as the equivalent chip thickness and accumulated metal removal. However, the models have been developed in past are not considered the effect of changing the grinding conditions in the same batch. In this paper, the roughness model form to consider the effect of changing grinding condition is proposed and the performance of proposed model is evaluated based on the experimental results.

• 한국안전학회지
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• 제8권4호
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• pp.194-200
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• 1993

Al합금 7075에 대해서 공작물 이송속도, 연삭깊이 및 유제 공급방법이 잔류응력에 미치는 영향을 실험적으로 행하였다. 가공 변질층에 형성된 잔류응력을 측정하기 위해 X선 회절법을 사용하였다. 개발된 노즐 공급방법 (Guide noazle)은 인장 잔류응력 및 연삭저항, 표면조도 부분에서 기존 노즐보다 좋은 효과를 가져 왔다. 연삭깊이 및 공작물 이송속도를 감속시키고 아울러 스파크 아웃을 행하면 잔류응력 및 표면 조도를 감소시킬 수 있다.

• 한국정밀공학회지
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• 제8권2호
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• pp.106-113
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• 1991

A diamond grinding wheel is generally used to grind hard and brittle materials, such as advanced ceramics. It is, however, quite difficult to dress a diamond grinding wheel efficiently because of its high degree of hardness. In this study, some investigations are carried out to increase dressing efficiecy of resinoid bonded diamond grinding wheel. Dressing forces are measured over a wide range of dressing conditions, and SEM observation of a grinding wheel is carried out. Special attention is paid to comparison between stick method and rotary brake method. Results obtained in this study provide useful information determining reguired dressing time, and for choosing efficient dressing condition for diamond grinding wheel.

• 한국정밀공학회지
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• 제12권6호
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• pp.37-44
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• 1995

Grinding is used for machining high precision parts with high additional value. However, the grinding operation needs high skill and long experience of an operator because of a lack of the scientific knowledge and engineering principles. Also, the wheel and grinding conditions affect grinding results. For these reasons, it is difficult to construct computer integrated manufacturing system(CIMA). Therefore, it is necessary for Expert System to be informed of qualitative knowledge of grinding expert's skills and experiences. In this research, the Grinding Expert System is constructed by Fuzzy Decision Making Algorithm. Using this system, unskilled workers will be able to use the knowledge and experience of an expert.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.660-665
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

• 한국정밀공학회지
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• 제14권5호
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• pp.85-91
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• 1997

Air grinding time in grinding process has a great effect on its efficiency due to low feedrate. This paper presents a reduction methos of air grinding time in cylindrical plunge grinding operation. Tje reduction of air grinding time is accomplished by finding the distance between contact point and rising point of ultra- sonic signal of the grinding wheel to workpiece. It uses a variation of sound signal generated by the flow of coolant when the grinding wheel approaches to workpiece. The ultrasonic sensor with 23 kHz center fre- quency and 8 kHz bandwidth is used to find the nearest approaching point(NAP). Monitoring and control system of the grinding conditions is implemented with CNC controller to control feedrate override and ultrasonic sensor to find NAP. The experimental result shows that the ultrasonic signal is a good measure- ment to find NAP. But it needs the considerations for the effect of the relationship between flowrate of coolant and diameter of workpiece.

• 한국식생활문화학회지
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• 제16권2호
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• pp.170-179
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• 2001

Green Tea consists of 15-30% catechins (a type of polyphenol), which act as super antioxidants, inhibitory action against aging process. Antioxidants fight radical-free oxygen, an agent which can begin the process of cancer by damaging essential body chemicals and harming DNA. This study was peformed to develop the elderly diet using Green Tea as an inhibitory action against aging process. Nokchaborijook (Baley gruel added rice powder and Green Tea) was manufactured by various levels of Green Tea(1, 4, 7%) and the grinding period(15, 30, 45 sec). The optimum levels of added Green Tea and grinding periods on Nokchaborijook were determined with the results of sensory evaluation by response surface methodology and analysis of composition. The Anti-oxidant Vitamin A, C, E and Flavonoid were increased with increased levels of Green Tea and grinding periods be decreased. As the levels of Green Tea and grinding periods were increased, the green color and penetrated force became stronger. Among the sensory attributes, Bitterness, Green Tea Flavor and Hashness were greater depending on increasing Green Tea. Jujube flavor was greater relying on decreasing Green Tea. Greenness and spreadability of particles were increased as both the amounts of Green Tea and the grinding period were increased. This result was used to determine the optimum conditions of adding levels of Green Tea and grinding periods. The optimum conditions of Nokchaborijook was established as adding of 5.8% Green Tea grinded for 15 seconds.

• 한국정밀공학회지
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• 제19권8호
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• pp.141-146
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• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding conditions of ceramic materials in the grinding with diamond wheel by design of experiments. The load on wheel by varying the feed rate was related with the surface roughness due to the minute destruction phenomenon of grains for the $Si_3\;N_4\;and\;ZrO_2$. The depth of cut is related with the surface roughness because the grinding is carried out by grain shedding process due to the brittle fracture phenomenon for the $A1_2\;O_3$. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiments using design of experiments.

• 한국생산제조학회지
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• 제6권3호
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• pp.17-25
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• 1997

This paper aims to clarify the effects of grinding conditions on the grinding force, ground surface and chipping size of workpiece in surface grinding of various ferrites with the resin bond diamond wheel. The main conclusions obtained were as follows: In a constant peripheral wheel speed, the specific grinding energy is fitted by straight lines with grinding depth coefficient($\delta$) in a logarithmic graph. The effect of both depth of cut and workpiece speed on grinding energy becomes larger in the order of Mn-Zn, Cu-Ni-Zn and Sr. When using the diamond grain of the lower toughness, the roughness of the ground surface becomes lower. The ground surfaces show that the fracture process during grinding becomes more brittle in the order of Sr, Mn-Zn and Cu-Ni-Zn. The chipping size at the corner of workpiece in grinding increases with the the increases of the depth of cut and workpiece speed, and the decrease of peripheral wheel speed. The effect of both depth of cut and workpiece speed on chipping size becomes more larger in the order of Sr, Mn-Zn and Cu-Ni-Zn.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy