• Title/Summary/Keyword: Grinding Tool

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CNC 공구 연삭기의 개발 및 성능향상에 대한 연구

  • 김성청;이근찬
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1993.04b
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    • pp.272-276
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    • 1993
  • We made to develop CNC Tool Grinding Machine automating the linear motion of X,Y,Z axis of table, and thetilting and rotation of tool holding vice by using Encorder to increase the efficiency of tool grinding for the Conventional Tool Grinding Machine. We did not consider the part of static, dynamic and thermal behavior that must necessary consider when wedesign, because we used existing Conventional Tool Grinding Machine as it is. We investigated simulation to make existing Conventional Tool Grinding Machine like CNC. We also designed it, and we compared the capability of existing Conventional Tool Grinding and CNC Tool Grinding Machine, and we investigated, too.

Establishment Method of Optimum Grinding Conditions Considered with Machine Tool Characteristics (공작기계 특성을 고려한 최적연삭조건 설정방법)

  • Kim, Gun-Hoi
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.7 no.5
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    • pp.59-65
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    • 1998
  • In order to utilize the information of well-know grinding database or grinding machine characteristics, a database needs to be designed by considering the delicate property of the machine tools for the high precision and quality of the demanding specification. Among the machine tools for the high precision and quality of the demanding specification. Among the machine tools, machining conditions of the grinding are various and knowledge repeatance obtained form the grinding process are less credable. therefore it is desirable for database, which is used to set the grinding conditions, to utilize the maximum machine tool capability. The present paper studied on the occurance limit of chatter vibration and burn considering the characteristics of machine tool. And also basic experiments were performed to establish the optimum grinding conditions which could maximize the grinding efficiency.

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Establishment Method of Optimum Grinding Conditions Considering with Machine Tool Characteristics (공작기계 특성을 고려한 최적연삭조건 설정)

  • 김건희;이재경;최창용
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.8-13
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    • 1997
  • In order to utilize the information of well-known grinding data or grinding machine, a database needs to be designed by considering the delicate property of the machine tools for the high precision and quality of the demanding specification. Among the machine tools, machining conditions of the grinding are various and knowledge repeatance obtained form the grinding process are less credable.Therefore it is desirable for D/B, which is used to set the grinding conditions, to utilize the maximum machine tool capability. The present paper studied occurance limit of chatter vibration and burn considering the characteristics of machine tool. And also basic experiments were performed to establish optimum grinding canditions which can maximize the machining efficiency.

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Comparison of 3 Typical methods for ultra-precision grinding (가공방식에 따른 초정밀 연삭의 비교)

  • Park, Soon-Sub;Lee, Ki-Young;Kim, Hyoung-Mo;Lee, Jae-Seol
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.6 no.3
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    • pp.9-15
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    • 2007
  • Three methods for grinding: cross grinding, slanted tool axis grinding and parallel grinding, were carried out to study the machinability of tungsten carbide mold for glass formed aspherics lens. In our research, the optimum grinding conditions were investigated in terms of feed-rate, relative velocity of wheel and work piece, tool marks and surface roughness. It is shown that cross grinding are most effective in removal ratio but poor in surface roughness. In addition, tool marks of each method were differentiated on direction and shape.

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A Study on a Ultrasonic Vibration Assisted Grinding of Alumina Ceramic with Diamond Grinding Tool (초음파 진동을 하는 다이아몬드 연삭공구의 알루미나 세라믹 연삭 가공에 관한 연구)

  • Choi, Young-Jae;Song, Ki-Hyeong;Park, Kyung-Hee;Hong, Yun-Hyuck;Kim, Kyeong-Tae;Lee, Seok-Woo;Choi, Hon-Zong
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.1
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    • pp.13-19
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    • 2012
  • In this study, ultrasonic vibration tool designed and made by using FEM analysis. And machining test was carried out in various machining conditions using ultrasonic vibration capable CNC machine. For work material, alumina ceramic ($Al_2O_3$) was used while for tool material diamond electroplated grinding wheel was used. To evaluate ultrasonic vibration effect, grinding test was performed with and without ultrasonic vibration in same machining condition. In ultrasonic mode, ultrasonic vibration of 20kHz was generated by HSK 63 ultrasonic actuator. The two grinding speeds, 1.67m/s and 3.35m/s, were applied. On the other hand, grinding forces were measured by KISTLER dynamometer.

Ultrasonically Assisted Grinding for Mirror Surface Finishing of Dies with Electroplated Diamond Tools

  • Isobe, Hiromi;Hara, Keisuke;Kyusojin, Akira;Okada, Manabu;Yoshihara, Hideo
    • International Journal of Precision Engineering and Manufacturing
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    • v.8 no.2
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    • pp.38-43
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    • 2007
  • This paper describes ultrasonically assisted grinding used to obtain a glossy surface quickly and precisely. High-quality surfaces are required for plastic injection molding dies used in the production of plastic parts such as dials for cellular phones. Traditionally, in order to finish the dies, manual polishing by a skilled worker has been required after the machining processes, such as electro discharge machining (EDM), which leaves an affected layer, and milling, which leaves tooling marks. However, manual polishing causes detrimental geometrical deviations of the die and consumes several days to finish a die surface. Therefore, a machining process for finishing dies without manual polishing to improve the surface roughness and form accuracy would be extremely valuable. In this study, a 3D positioning machine equipped with an ultrasonic spindle was used to conduct grinding experiments. An electroplated diamond tool was used for these experiments. Generally, diamond tools cannot grind steel because of excessive wear as a result of carbon atoms diffusing into bulk steel and chips. However, ultrasonically assisted grinding can achieve a fine surface (roughness Rz of $0.4{\mu}m$) on die steel without severe tool wear. The final aim of this study is to realize mirror surface grinding for injection molding dies without manual polishing. To do this, it is necessary to fabricate an electroplated diamond tool with high form accuracy and low run-out. This paper describes a tool-making method for high precision grinding and the grinding performance of a self-electroplated tool. The ground surface textures, tool performance and tool life were investigated A ground surface roughness Rz of 0.14 um was achieved Our results show that the spindle speed, feed rate and cross feed affected the surface texture. One tool could finish $5000mm^2$ of die steel surface without any deterioration of the ground surface roughness.

A Study on Electro-deposited Multi-layered Diamond Tool for Grinding Sapphire Wafers (사파이어 절삭용 다층 전착 다이아몬드 공구에 대한 연구)

  • Lim, Goun;Song, William;Hong, Joo Wha
    • Journal of the Korean Society for Heat Treatment
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    • v.30 no.5
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    • pp.222-226
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    • 2017
  • Recently sapphire wafer has expected as smart phone cover material, however, brittle nature of sapphire needed edge grinding processes to prevent early initiation of cracks. Electro-deposited multi-layered groove tools with $35{\mu}m$ diamond particles were studied for sapphire wafer grinding. Solid particle flow behaviors in agitated electrolyte was studied using PIV(Particle Image Velocimetry), and uniform particle distribution in Ni bond were obtained when agitating impeller was located lower part of electrolyte. Hardness values of $400{\pm}50Hv$ were maintained for retention of diamond particles in electro-deposited bond layer. Sapphire wafer edge grinding test was carried out and multi-layered $160{\mu}m$ thick diamond tool showed much greater grinding capabilities up to 2000 sapphire wafers than single-layered $50{\mu}m$ thick diamond electro-deposited tools of 420 wafers. The reason why 3 times thicker multi-layered tools than single-layered tools showed 5 times longer tool lives in grinding processes was attributed to self-dressed new diamond particles in multi-layered tools, and multi-layered diamond tools could be promising for sapphire grinding.

Force-Reflecting Teleoperation for Grinding Work

  • Choo, Jung-Hoon;Lee, Jae-Yong;Lee, Jae-Won
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.824-828
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    • 2003
  • This paper explains problems of force-reflecting teleoperation grinding work and proposes some methods to solve those. For stable contact between robot tool(grindstone) and contact surface the mechanical impedance force control is used. The sliding phenomenon of grindstone has been appeared at the contact surface during the grinding work. The sliding problems caused by friction and rotation of grindstone are eliminated by using tangential direction sliding compensation control. The rotation force of grindstone makes the tool move to tangential direction along the surface suddenly even though an operator pushes the tool only in normal direction to the surface. Normal direction force control is applied for grinder not to roll and fracture on the grinding surface. Vibration problem of grindstone is decreased by second order low-pass filter. Therefore we can precise grinding work at the grinding surface and feel the reality

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Tool Locus Analysis of Ultra-precision Inclined Grinding (초정밀 경사축 연삭가공에서의 공구 궤적 해석)

  • Hwang, Yeon;Park, Soon-Sub;Lee, Ki-Yong;Won, Jong-Ho;Kim, Hyun-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.11
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    • pp.35-40
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    • 2009
  • This paper presents the geometrical analysis of an inclined ultra-precision grinding technology using simulations about grinding point locus for micro lens manufacturing. Simulation results show the relationship between radius ratios ($R_1/R_2$) and wheel center locus. Furthermore, the critical grinding wheel radius ($R_1$) can be calculated from work-piece radius ($R_2$) and inclined angle ($\theta=-45^{\circ}$). These achievements could be applied to calculate CNC data in ultra-precision grinding and give insight for wheel wear and compensation grinding.

A study on the deburring process using brush grinding (브러시 연삭을 이용한 공작물의 면취 가공에 대한 연구)

  • 백재용
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2000.04a
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    • pp.507-512
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    • 2000
  • Due to increasing demand toward improving product quality, various methodologies have been introduced. A brush type grinding tool is one of the most frequently used one to facilitate required process. In order to produce consistent burr shape, various machining conditions have been combined applied to disk grinding process. It has been observed that the burr dimension(shape and width) depends on the inclination angle between grinding disk and workpiece. Drastic increase of tool Wear has been also observed along the inclination angle variation. Various burr shapes have been captured and analyzed using image processing technique.

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