• Transactions of the Korean Society of Automotive Engineers
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• v.2 no.6
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• pp.38-49
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• 1994

In this study, grindability of some representative engineering ceramics are experimentally investigated using resin bond diamond wheel with conventional surface grinding machine, and proper grinding conditions which can be obtained from various experimental results are established also for mechanical components which are proper to domestic circumstances with high reliability. And through the results of experiment, it is confirmed that grinding energies of the ceramics, especially in the case of $Al_2O_3$, are lower than steel with same machining condition in the conventional grinding because of their fine-brittle fracture mode type removal process, though the ceramics are well-known to unmachinable materials. And moreover, the total pass numbers needed for spark-out process to be completed are depend on their mechanical properties because that grinding stiffness is different from each other. The grinding force, ginding power and ground surface roughness are also measured and compared. Furthermore, the experiments carried out in this study, some useful results are obtained with can guide to grind engineering ceramics with conventional surface grinding machine.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.11
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• pp.55-63
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• 2003

In this study, an experimental research of grinding characteristics using super-abrasives for surface carburized and heat treated SCM415 materials, which were usually used to make a linear motion guide block and were comparatively hard-to-machine materials, was carried out. In order to conduct a high efficiency and a accuracy grinding of such materials, grinding processes using CBN (Cubic boron nitride) and 38P grinding wheels have been attempted on a surface grinding machine. The grindability according to each grinding conditions was evaluated by means of a grinding force, a surface roughness and a residual stress. The experimental methods and results were presented in this paper. And also, from a proposed truing method the CBN wheels that combined a copper and a break truer gave a full scope to the wheel's performance.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1-5
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• 2005

The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1996.10a
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• pp.91-95
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• 1996

One must observe abrasive grain of grinding wheel and know their behaviors to understand the grinding mechanism. The behaviors of abrasive grain on the wheel surface. such as shapes distributions and changes were studied to make the grinding mechanism clear but the behaviors of abrasive grains on CBN wheel are not known enough. From this paper the working surface of a grinding wheel is observed by photography in which a picture of a wheel surface is taken by the camera through the microscope on the grinding machine and analyzed with the computer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.563-564
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• 2006

In silicon wafer manufacturing process, the grinding process has been adopted to improve the flatness of water. The grinding of wafer is usually used by the infeed grinding machine. Grinding conditions are spindle speed, feed speed, rotation speed, grinding stone etc. But grinding condition selection and analysis is so difficult in grinding machine. In the intelligent grinding system based on knowledge many researchers have studied expert system, neural network, fuzzy etc. In this paper we deal grinding condition selection method, Taguchi method and Genetic Analysis.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.1517-1518
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• 2015

The paper deals with the real time sensing of a chatter vibration in grinding machine line of automobile bearings using machine black box. The chatter vibration plays bad role in machining quality such as high roughness as well as tool life and machine failure. In this paper, the vibration signals of the automobile hub bearing in the grinding process are shown in the time domain and frequency domain. Through the vibrational signals, chatter vibration badness is detected using machine black box. Therefore, machine black box can be applied to the real time detection of the grinding process in engineering fields.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.04a
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• pp.30-35
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• 1997

CNC Grinding Center is developed to improve the flexibility of grinding process and to obtain the high machine accuracy in grinding processes. It consists of a built-in type spindle with max. 25,000 rpm, ATC(automatic tool changer) for quick and reliable loading/unloading of tools, a rotary dresser for trueing, dressing, and personal computer based CNC controller, etc. This research concentrates on the machine structure, the evaluation of efficiency, and the machining technology of the developed prototype

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.498-501
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• 1999

Grinding machine rotating at high speed express the unbalance by the spindle and the weight of grinding wheel. Therefore, the parts requiring a precision processing for grinding machine need acutely to establish of automatic balancer. But the more wheel speed increases the more vibration amplitude increases, surface roughness show the satisfactory according to increase of the wheel speed. Surface roughness of the occasion installing the automatic balancer made better than an occasion no installing the automatic balancer.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.3
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• pp.19-27
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• 2011

A weaving machine for texture industry uses a lot of needles and the nib of these needles is necessary to be kept with sharp edge. The re-grinding of the needle by a special purpose of the grinding wheel can be selected for achieving this aim. This study focused on the manufacture and performance assessment the special grinding wheel. A forming mold for the grinding wheel was designed and a sintering process for furnace process control was established. Manufactured wheels were tested for determining suitable grade of the wheel. The selection of optimal grinding conditions was achieved by a response surface method and a genetic algorithm.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.405-409
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• 2003

We explored a new rough grinding technique on optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and range of diamond resin bond wheel. The grinding parameters such as workpiece rotation speed depth of cut and feed rate were altered while grinding the workpiece surfaces of 20m in diameter. Surface roughness is measured by Form Talysurf series2. Our target is to define grinding conditions producing the surface roughness better than 0.02${\mu}{\textrm}{m}$ Ra and the form accuracy of around 0.2${\mu}{\textrm}{m}$ PV.