• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1911-1915
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• 2003

Today optical communication industry is developed; demand of optical communication part is increased. ZrO$_2$ ceramic ferrule is very significant part which determines transmission efficiency and quality of information in the optical communication part by connector of optical fibers. Being different from metal grinding, material removal through brittle fracture plays an important role in ZrO$_2$ ceramic grinding. Most of ZrO$_2$ ceramic ferrule processes are grinding which request high processing precision. Particularly, concentricity and cylindricity of inner and outer diameter are very important. The co-axle grinding process of ZrO$_2$ ceramic ferrule is to make its concentricity all of uniform before centerless grinding. Surface integrity of ZrO$_2$ ceramic ferrule is affected by grinding conditions, and equipment. In this study, surface integrity of workpiece according to such as a change of grinding wheel speed, feed rate, regulating wheel speed and grinding force is investigate to improve the concentricity and roundness of ZrO$_2$ ceramic ferrule from many experiments. Thus, if possible be finding highly efficient and quality grinding conditions.

• 한국정밀공학회지
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• 제14권5호
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• pp.85-91
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• 1997

Air grinding time in grinding process has a great effect on its efficiency due to low feedrate. This paper presents a reduction methos of air grinding time in cylindrical plunge grinding operation. Tje reduction of air grinding time is accomplished by finding the distance between contact point and rising point of ultra- sonic signal of the grinding wheel to workpiece. It uses a variation of sound signal generated by the flow of coolant when the grinding wheel approaches to workpiece. The ultrasonic sensor with 23 kHz center fre- quency and 8 kHz bandwidth is used to find the nearest approaching point(NAP). Monitoring and control system of the grinding conditions is implemented with CNC controller to control feedrate override and ultrasonic sensor to find NAP. The experimental result shows that the ultrasonic signal is a good measure- ment to find NAP. But it needs the considerations for the effect of the relationship between flowrate of coolant and diameter of workpiece.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1997년도 춘계학술대회 논문집
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• pp.30-35
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• 1997

CNC Grinding Center is developed to improve the flexibility of grinding process and to obtain the high machine accuracy in grinding processes. It consists of a built-in type spindle with max. 25,000 rpm, ATC(automatic tool changer) for quick and reliable loading/unloading of tools, a rotary dresser for trueing, dressing, and personal computer based CNC controller, etc. This research concentrates on the machine structure, the evaluation of efficiency, and the machining technology of the developed prototype

• 한국정밀공학회지
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• 제23권1호
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• pp.97-104
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• 2006

ELID(Electrolytic In-process Dressing) grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP(Magnetic Assisted Polishing) has been used as polishing method due to its high polishing efficiency and to its resulting in a superior surface quality. This study is describing an effective fabrication method combining ELID and MAP of nano-precision mirror grinding for glass-lens molding mould. It also presents some techniques for achieving the nanometer roughness of the hard metals, such as WC-Co, which are extensively used in precision tooling material.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• 한국정밀공학회지
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• 제21권10호
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• 한국정밀공학회지
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• 제24권10호
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• pp.31-36
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• 2007

• 한국정밀공학회지
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• 제7권4호
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• pp.40-54
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• 1990

Recently, Fine Ceramics have been concerned significantly with some excellent properties and many functions as new industrial materials to the industry at alrge. For the manufacture of Fine Ceramics, sintering is essential process. Thus the most of a Fine Ceramics used for precision parts are in need of machining proces. It is, however, very difficult to manufacture the Advanced Ceramics with high efficiency because they have not only high strength and brittl- eness but also high hardness. In present research, experiments are carried out to obtain the basic knowledge of Fine Ceramics grinding with high efficiency. Representative advanced ceramics, such as A1/sub 2/0/sub 3/, Z/sub r/O/sub 2/SiC snd Si/sub 2/N/sub 4/are ground with diamond wheels using conventional surface grinding machine. This research is carried out for the purpose of saving machining technology required for manufactiring Fine Ceramics parts

• 한국정밀공학회지
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• 제10권1호
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• pp.42-51
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• 1993

Recently, WC-Co have some excellent properities as the material for the mechanical component such as metallic moulding parts, ball dies parts, and punch parts. This paper describes the surface roughness and grinding force caused by experimental study on the surface grinding of WC-Co with ultra-precision like a mirror shape using diamond wheel. Also, some investigations are carried out using WA grinding wheel to increase improved ground surface roughness such as polishing, lapping effect. Some important results obtained here are summarized as follow. 1) Within this experimental grinding condition, we can be obtained $R_{max}.\;2\mu\textrm{m}\;R_a\;0.3\mu\textrm{m}$ whichare the most favourable ground surface roughness using #140 diamond wheel, and improved surface roughness values about 20 .approx. 25% throughout 5 times sparkout grinding 2) The value of surface roughness is Rmax. $0.49\mu\textrm{m},\;R_a\;0.06\mu\textrm{m}$ using #600 diamond wheel. 3) The area of no rack zone is less than $F_{n}$ 0.27N/mm, Ft 0.009N/mm