• 한국정밀공학회지
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• 제10권1호
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• pp.62-69
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• 1993

The accuracy of machine tools is the major factor concerned with the acuracy of the processed work. The feed errors of feed system in machine tool, therfore, make the machining errors of work directly on processing. In this point, this study focused on the generative elements of feed errors in CNC cylindrical grinding machine, such as supporting method of ball screw, the effect of pitch and yaw error and the position detecting method in servo system when operating its shaft of grinding wheel head. Furthermore, in order to improve the driving accuracy of this machine tool, feed errors are measured by a laser interferometer. Results obtained in this study provide some useful informations to attain high accuracy of CNC machine tool.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1997년도 춘계학술대회 논문집
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• pp.30-35
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• 1997

CNC Grinding Center is developed to improve the flexibility of grinding process and to obtain the high machine accuracy in grinding processes. It consists of a built-in type spindle with max. 25,000 rpm, ATC(automatic tool changer) for quick and reliable loading/unloading of tools, a rotary dresser for trueing, dressing, and personal computer based CNC controller, etc. This research concentrates on the machine structure, the evaluation of efficiency, and the machining technology of the developed prototype

• 한국정밀공학회지
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• 제13권6호
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• pp.52-58
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• 1996

This paper described on the effect of residual stocks in internal grinding of tungsten carbide materials in order to improve the grinding efficiency as well as grinding accuracy. Through the fundamental investigation is carried out for tungsten carbide materials using electroplated diamond wheel, the residual stock after grinding process is effective to the grinding efficiency. The obtained results are as follows: (1) Under the depth of cut(t) is constant and decreasing the workpiece velocity(Vw), the residual stock after grinding is increased, but the difference is little less than the difference by table speed. (2) Increasing the wheel velocity, the residual stock after grinding is decreased. Therefore in order to minimize the residual stock, the wheel velocity should be increased as far as possible. (3) The surface roughness and out-of roundness increased with depth of cut and table speed, and decreased with wheel velocity, but it may as well adopt as much as possible under the dimensional tolerance which is required for high efficiency grinding. (4) In order to remove residual stock, the spark-out grinding shoule be done, and it also can be improved about 20~25% throughout spark-out grinding, and the number of optimal spark-out times were within 10 times.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1993년도 한국자동제어학술회의논문집(국내학술편); Seoul National University, Seoul; 20-22 Oct. 1993
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• pp.1024-1030
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• 1993

In manufacturing press die with free surface, grinding operation is an important post process for surface finish and dimensional accuracy. With the advancement of NC technology. surface grinding operation is increasingly replaced by the gantry type manipulator. As the mechanics for grinding operation is different from machining operation, conventional CAM system for machining operation is hard to apply. In this. paper, we develop a five-axis CAM system by which an efficient gantry trajectory can be planned and verified. The developed system consists of four conceptual modules; namely CAD, PROCESS. CAM, and ANALYSIS. In the CAD module, the machined surface is represented by CL-data or surface modeler, and process parameters are specified by the PROCESS module. Then, the CAM module generates a series of grinding paths based on the grinding mechanics together with process databases for tool spaces and grinding conditions. The generated paths are verified via ANALYSIS module. Validation via real experiments is left for further study.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.405-409
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• 2003

We explored a new rough grinding technique on optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and range of diamond resin bond wheel. The grinding parameters such as workpiece rotation speed depth of cut and feed rate were altered while grinding the workpiece surfaces of 20m in diameter. Surface roughness is measured by Form Talysurf series2. Our target is to define grinding conditions producing the surface roughness better than 0.02${\mu}{\textrm}{m}$ Ra and the form accuracy of around 0.2${\mu}{\textrm}{m}$ PV.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.39-43
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• 1996

This paper described on the effect of residual stocks in internal grinding of tungsten carbide materials in order to improve the grinding efficiency as well as grinding accuracy. Though the fundamental investigation is carried out for tungsten carbide materials using electroplated diamond wheel, the residual stock after grinding process is effective to the grinding effciiency. The obtained results are as follows: (1) Under the depth of cut(t) is constant and decreasing the workpiece velocity(Vw), the resiudal stock after grinding is increased, but the difference is little less than the difference by table speed. (2) Increasing the wheel velocity, the residual stock after grinding is decreased. Therefore in order to minimize the residual stock, the wheel velocity should be increased as far as possible. (3) The surface foughness and out-of roundness increased with depth of cut and table speed, and decreased with wheel velocity, but it may as well adopt as much as polssible under the dimensional tolerance which is required for high efficiency grinding. (4) In order to remove residual stock, the spark-out grinding shoule be done, and it also can be improved about 20 .approx. 25% throughout spark-out grinding, and the number of optimal spark-out times were within 10 times.

• 한국정밀공학회지
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• 제19권3호
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• pp.59-65
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• 2002

In the grinding process, the degree of the sharpness in wheel grain affects the surface roughness and the dimensional accuracy. If a wheel with dull grains is used, te grinding force will be increased and the surface roughness deteriorated. To produce a precision component, the magnitude of parameters related to the wear amount of a grinding wheel has to be limited. In this study, a variation of the grinding force and the surface roughness were measured to seek the machining characteristics of the WA and CBN wheels. From the wear amount of the grinding wheel and the removal rate of workpiece, the grinding ratio was calculated. And also the wheel life was determined at a rapid decreasing point of the grinding ratio. The difference between the surface of wheel-workpiece before grinding and after wheel life was clearly verified with a microscopic photo.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• 한국기계가공학회지
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• 제21권3호
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• pp.77-85
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• 2022

In this study, to diagnose the grinding state of a micro drill bit, a sensor attachment location was selected through random vibration analysis of the grinding unit of the micro drill-bit grinding system. In addition, the vibration data generated during the drill bit grinding were collected from the grinding unit for the grinding wheels under the steady and worn conditions, and data feature extraction and dimension reduction were performed. The wear of the micro-drill-bit grinding wheel was diagnosed by applying KNN, a machine-learning algorithm. The classification model showed excellent performance, with an accuracy of 99.2%. The precision, recall and f1-score were higher than 99% in both the steady and wear conditions.

• International Journal of Precision Engineering and Manufacturing
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• 제4권3호
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• pp.48-54
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• 2003

This paper deals with mirror grinding of a small-sized aspherical lens by a resin bonded diamond spherical wheel. Up to now, a spherical lens has been used for the lens of the optical communication optical part. However, recently, aspherical optical parts are mainly used in order to attempt the improvement in image quality and miniaturization of the optical device. It is possible to manufacture the aspherical lens which is presently being used in optical instrument through ultra-precision machining technology. Also, to realize compactness, efforts are being made to produce a micro aspherical lens, fur which the development of a high-precision, micro molding die is inevitable. Therefore, extensive research is being done on methods of producing a micro aspherical surface by high-precision grinding. In this paper, the spherical wheel was trued by cup-shaped truer and tool path was calculated by the radius of curvature of the wheel after truing and dressing. Then in the aspherical grinding experiment, WC material which is used as a melding die for the small-sized aspherical lens was ground. The results showed that a form accuracy of 0.1918 $\mu\textrm{m}$ P-V and a surface roughness of 0.064 $\mu\textrm{m}$ Rmax could be achieved.