• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.325-328
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• 2005

Bainitic microalloyed steels have drawn a lot of attention because of high strength combined with high toughness. In order to process the alloys easily , it is necessary to get the alloys of high hardenability. Mo and B were added to enhance the hardenability, which was demonstrated by TTT simulation and microstructures. It was also identified using BNCT that B, hardenability raising element, was distributed more evenly as cooling rate went up. Examination of grain coarsening temperature depending upon austenitizing temperature revealed that V and Ti effectively inhibited the grain growth up to $1000^{\circ}C\;and\;1050^{\circ}C$ respectively.

• Journal of the Korean Ceramic Society
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• v.42 no.9 s.280
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• pp.599-601
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• 2005

The coarsening process of two different $BaTiO_3$ single crystal seeds, one with a (111) double twin and the other without it, was investigated. Due to the presence of Twin Plane Reentrant Edge (TPRE), the coarsening rate of the twinned seed crystal was significantly higher than that without a twin. For the coarsening by the 2-dimensional nucleation and lateral growth, the energy barrier for nucleation at the TPRE was analyzed to be about a half compared with that at the terrace planes.

• Journal of Technologic Dentistry
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• v.34 no.4
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• pp.345-352
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• 2012

Purpose: The age-hardening mechanism of an Au-Ag-Cu-Pt-Zn alloy for crown and bridge fabrication was investigated by means of hardness test, X-ray diffraction study and field emission scanning electron microscopic observation. Methods: Before hardness testing, the specimens were solution treated and then were rapidly quenched into ice brine, and were subsequently aged isothermally at $400-450^{\circ}C$ for various periods of time in a molten salt bath and then quenched into ice brain. Hardness measurements were made using a Vickers microhardness tester. The specimens were examined at 15 kV using a field emission scanning electron microscope. Results: By the isothermal aging of the solution-treated specimen at $450^{\circ}C$, the hardness increased rapidly in the early stage of aging process and reached a maximum hardness value. After that, the hardness decreased slowly with prolonged aging. However, the relatively high hardness value was obtained even with 20,000 min aging. By aging the solution-treated specimen, the f.c.c. Au-Ag-rich ${\alpha}_0$ phase was transformed into the Au-Ag-rich ${\alpha}_1$ phase and the AuCu I ordered phase. Conclusion: The hardness increase in the early stage of aging process was attributed to the formation of lattice strains by the precipitation of the Cu-rich phase and then subsequent ordering into the AuCu I-type phase. The decrease in hardness in the later stage of aging process was due to the release of coherency strains by the coarsening of tweed structure in the grain interior and by the growth and coarsening of the lamellar structure in the grain boundary. The increase of inter-lamellar space contributed slightly to the softening compared to the growth of lamellar structure toward the grain interior.

• 연구논문집
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• s.26
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• pp.113-120
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• 1996

Age hardenable aluminium alloys show high specific strength, good thermal and electrical conductivity as well as lightness, and are typical aircraft materials. High fatigue strength and good resistancy against stress corrosion cracking are also important for aircraft aluminium alloys. Al alloy 7050 has been developed to meet the above mentioned requirements and the use of this alloy as forged aircraft part becomes more important. However, forged 7050 parts showed undersiable structures such as severe local grain coarsening in surface area and unproper metal flow that is degrading mechanical properties. In this paper, microstructural aspects of die forging in the Al alloy 7050 are investigated. Also suggested are the optimal forging conditions for microstructural control of Al alloy 7050.

• Proceedings of the Korean Ceranic Society Conference
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• 2000.04a
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• pp.94.2-94.2
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• 2000

• Journal of Welding and Joining
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• v.27 no.4
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• pp.73-78
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• 2009

Characterization of the microweld CCFL electrode for the TFT-LCD backlight unit was carried out in terms of the glass beading heat treatment conditions. We evaluate the weld zone and parent metal of the microweld CCFL electrodes that were exposed to simulated glass beading heat treatment. The CCFL electrode was composed of the cup made with pure Ni, the pin made with pure Mo and the lead wire made with Ni-Mn alloy. Each part of the electrode was assembled together by micro spot welding process and then the assembled electrodes were exposed to simulated glass beading temperatures of $700^{\circ}C,\;750^{\circ}C$ and $800^{\circ}C$. The microstructures of the microweld CCFL electrode were observed by using optical microscope, scanning electron microscope and EDS. Micro-tensile and microhardness test were also carried out. The results indicated that the grain coarsening in the HAZs(heat affected zones) for both the cup-pin weld and pin-lead wire were exhibited and the grain coarsening of the HAZ for the cup and the lead wire was more obvious than the HAZ of the pin. The micro-tensile test revealed that the fracture occurred at the cup-pin weld zone for all test conditions. The fracture surface could be classified into two parts such as pin portion and cup portion including weld nugget. The failure was seemed to be initiated from the boundary between nugget and pin through the weld joint. The result of the microhardness measurement exhibited that the relatively low hardness value, about 105HV was recorded at the HAZ of the cup. This value was about 50% less than that of the original value of the cup. The reduction of the microhardness was considered as the cause of the grain coarsening due to welding process. It was also appeared that there was no change in electric resistance for the standard electrodes and heat treated electrodes.

• Journal of the Korean Society for Heat Treatment
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• v.23 no.2
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• pp.90-95
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• 2010

The effects of grain size on the corrosion resistance of 429EM ferritic stainless steels for automobile exhaust system were investigated. Using specimens held at maximum service temperature of $950^{\circ}C$ for 10~70 hours, electrochemical polarization tests were conducted. While corrosion current density, $I_{corr}$, was influenced little by grain size, pitting potential, $E_p$, was increased with an increase of grain size. Sensitizaton at grain boundary occurred when the specimen were held at $950^{\circ}C$ for above 50 hours because of the dissolution of precipitates and grain coarsening.

• Proceedings of the Korean Nuclear Society Conference
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• 1999.10a
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• pp.236-236
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• 1999

• Journal of Ocean Engineering and Technology
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• v.11 no.1
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• pp.10-15
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• 1997

Copper and its alloy had been used widely because of its pronouncing characteristics on their high thermal and electrical conductivity. Various fusion welding methods, such as SMAW, SAW, GTAW, GMAW, Electroslag welding amd so on are applied to weld copper and its alloy. But fusion welding of copper has so many welding problems. THe most serious problems were poor penetration amd high thermal contration stress due to its high thermal conductivity and porosity could be formed by rapid cooling rate of fusion welding. In order to avoid such fusion welding problems, preheating, peering and heat treatment must be applied to obtain sound weld joint of copper. But preheating induce another welding problem such as grain coarsening of weld heat affected zone. This grain coarsening reduces ductility and strength of weld joint. In this view of point, friction welding of copper is triedm to obtain sound weld joint of copper by reducing metallurgical problems. This study introduced new concept of heat input for evaluating the friction weldability of copper. As a result, weldability of copper could be evaluated by this new concept of heat input.

• Korean Journal of Materials Research
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• v.19 no.1
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• pp.7-12
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• 2009

TFT-LCD is the most popular type of flat display panel in the information technology field. The back light unit is a main part of the structure of a TFT-LCD panel. Occasionally, studies have shown that failures of the CCFL of the BLU occur due to the poor weld characteristics of these materials. The aim of this study was to prepare some technical data and to characterize a microjoined electrode for the CCFL. Microstructure examinations, microhardness measurements, resistance measurements and microtensile tests of the microjoined electrode were carried out. The result indicates that a large amount of grain coarsening exists in the heat-affected zone (HAZ) of the weld between the cup and the pin. This grain coarsening of the HAZ between the cup and pin is caused by the welding cycle, which may have an influence on the lowest microhardness values. Fracturing of the microjoined electrode also occurred at the HAZ close to the cup between the weld holding the cup and the pin. Additionally, no specific changes of the electrical resistance among the cup, pin, and lead wire themselves or in the microjoined electrode were observed.