• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1574-1576
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• 2003

Carbon nanotubes (CNTs) were grown on the TiN-coated silicon substrate with different thickness of Ni and Co catalysts layer at $600^{\circ}C$ using inductively coupled plasma-chemical vapor deposition (ICP-CVD). The Ni and Co catalysts were formed using the RF magnetron sputtering system with various deposition times. It was found that the growth of CNTs was strongly influenced by the surface morphology of Ni and Co catalysts. With increasing deposition time, the thickness of catalysts increased and the grain boundary size of catalysts increased. The surface morphology of catalysts and CNTs were elucidated by SEM. The Raman spectrum further confirmed the graphitic structure of the CNTs. The turn-on field of CNTs grown on Ni and Co catalysts was about 2.7V/pm and 1.9V/pm respectively. Field emission current density of CNTs grown on Ni and Co catalysts was measured as $11.67mA/cm^2$ at $5.5V/{\mu}m$ and $1.5mA/cm^2$ at $5.5V/{\mu}m$ respectively.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.15-21
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• 2019

We investigated the structural, electrical and optical properties of zinc oxide (ZnO) ultra-thin films grown at $150^{\circ}C$ by atomic layer deposition (ALD). Diethylzinc and deionized water were used as metal precursors and reactants, respectively, for the deposition of ZnO thin films. The growth rate per ALD cycle was a constant 0.21 nm/cycle at $150^{\circ}C$, and samples below 50 cycles had amorphous properties due to the relatively thin thickness at the initial ALD growth stage. With the increase of the thickness from 100 cycles to 200 cycles, the crystallinity of ZnO thin films was increased and hexagonal wurtzite structure was observed. In addition, the particle size of the ZnO thin film increased with increasing number of ALD cycles. Electrical properties analysis showed that the resistivity value decreased with the increase of the thin film thickness, which is correlated with the decrease of the grain boundary concentration in the thicker ZnO thin film due to the increase of grain size and the improvement of the crystallinity. Optical characterization results showed that the band edge absorption in the near ultraviolet region (300 nm~400 nm) was increased and shifted. This phenomenon is due to the increase of the carrier concentration with the increase of the ZnO thin film thickness. This result agrees well with the decrease of the resistivity with the increase of the thin film thickness. Consequently, as the thickness of the thin film increases, the stress on the film surface is relaxed, the band gap decreases, and the crystallinity and conductivity are improved.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.5
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• pp.377-383
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• 2016

The effect of long-term aging degradation on magnetic properties of ferritic 11Cr low-carbon steel was investigated. Coercivity and hysteresis loss measured from the hysteresis loops decreased with long-term aging time and showed that the relation was well fitted by a second order exponential function. Vickers hardness also decreased with aging time and resulted in mechanical softening. In addition, the microstructural evolution was observed by the scanning electron microscopy, backscattered electron image and X-ray diffraction. The $Cr_{23}C_6$ precipitates along grain boundary grew fast and Laves ($Fe_2W$) phase on martensitic lath boundaries in interior grains was developed. The solid solution atoms depleted in matrix and lath subgrains recovered owing to precipitate coarsening with long-term aging degradation. There was a close relation with softening of magnetic and mechanical properties.

• Journal of the Korean Ceramic Society
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• v.28 no.10
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• pp.803-809
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• 1991

Microstructure, room temperature resistivity and temperature coefficient of resistance of BaTiO3 ceramics were characterized and measured in this study. The basic composition of the BaTiO3 cremics was formed by adding 0.25 mol% Dy2O3 and 0.07 mol% MnO2 to the BaTiO3 composition. Samples of the BaTiO3 ceramics were prepared by adding various amounts of the TiO2, SiO2 and Al2O3 to the basic composition. An addition of 1 mol% TiO2, 2 mol% SiO2 and 0.5 mol% Al2O3 to the basic composition resulted both the values of the room temperature resistivity and the temperatured coefficient being maxium. Meanwhile, an addition of 1 mol% TiO2 and 1 mol% Al2O3 to the basic composition resulted the value of the room temperature resistivity maxium and the temperature coefficient minimum. The temperature coefficient showed a maximum value as well as a minimum value when the three kinds of the additives were added together to the basic composition of the BaTiO3 ceramics. Maxed phases of BaTi3O7, BaTiSiO5 and BaAl2Si2O8 were present at the grain boundary.

• Economic and Environmental Geology
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• v.28 no.1
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• pp.43-51
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• 1995

The Jangsan Quartzite is a basal unit of the Cambro-Odovician sequence, in Socheon-Myeon, Bonghwa-Gun, Gyeongsangbug-Do, South Korea, was petrologically and geochemically investigated. The quartzite consists mainly of quartz and muscovite, assosiated with tourmaline and graphite. The quartzite shows white and/or gray color and various green color in hand specimens. The white and gray colored rocks have very low vanadium contents, but a dark green colored rock contains 8960 ppm vanadium. The muscovites in the quartzite show colorless and green color, of which green ones range from pale blue green to pale green. The dark green colored muscovites have above 8 wt. % vanadium and pale green ones have 1-3 wt. % vanadium. Vanadium contents in moscovite increase with decreasing $Al^{v1}$ contents. It suggests that vanadium substitutes for octahedral aluminium in moscovite. In general, it tends to large volumes of muscovite (up to 14 modal %) in deep green colored rocks, and high vanadium contents in their muscovites. Most of the moscovite flakes occur along the quartz boundaries and some are enclosed by quartz grain. The moscovite grains intergrowth each other in the former. The mouscovite aggragates are divided into two types on the basis of their intergrowth(cut) times. Two cut times and one cut time are named T type and D type, respectively. The T type is mainly distributed at western part (near of the Chunyang granite), whereas the D type is distributed from middle to estern part(near the Janggunbong) of the formation. The boundary is consistent with metamorphic isograd between andalusite and sillimanite zone by Ahn et. al. (1993).

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.35-41
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• 1999

In this study we investigated the effects of process variables on the bond strength, and its dependency upon the interfacial chemistry when the joined $ZrO_2$ toughened $Na\beta$"-alumina to $\alpha$-alumina using B$_2$$O_3$-$SiO_2$-Al$_2$$O_3$-CaO glass sealant. We observed that bond strength is mainly determined by the strength of the glass, which, in turn, depends on the glass composition established after joining reaction. Joining at $950^{\circ}C$ for 15min yielded the highest average bond strength of 66MPa. Different types of interfacial reaction seem to occur at each interface. After joining at $950^{\circ}C$ for 15min we found that Ca and Si diffuse much deeper(~15$\mu\textrm{m}$) into the $\beta$"-alumina composite than into the $\alpha$-alumina(<1$\mu\textrm{m}$) as a result of ion exchange reaction and more effective grain boundary diffusion. Thermal expansion coefficient of the glass was found to have changed more closely to those of the $\beta$"-alumina composite and $\alpha$-alumina, which put the glass under a slight compressive stress.ressive stress.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1997.10a
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• pp.7-7
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• 1997

During sintering of very porous green bodies, as obtained by compaction of hard powders - such as tungsten carbide or ceramics - or by injection moulding, important shrinkage occurs. Due to heterogeneous green density field, gravity effects, friction on the support, thermal gradients, etc., this shrinkage is often non-uniform, which' may induce significant shape changes. As the ratio of compact dimension to powder size is very high, the mechanics of continuum is relevant to model such phenomena. Thus numerical techniques, such as the finite element method can be used to simulate the sintering process and predict the final shape of the sintered part. Such type of simulation has much been developed in the last decade firstly for hot isostatic pressing and next for die compaction. Finite element modelling has been recently applied to free sintering. The simulation of sintering should be based on constitutive equations describing the thermo-mechanical behaviour of the material under any state of stress and any temperature which may arise within the sintering body. These equations can be drawn either from experimental data or from micromechanical models. The experiments usually consist in free sintering and sinter-forging tests. Indeed applying more complex loading conditions at high temperature under controlled atmosphere is delicate. Micromechanical models describe the constitutive behaviour of aggregates of spheres from the deformation of two-sphere contact either by viscous flow or grain boundary diffusion. Such models are not able to describe complex microstructure and mechanisms as observed in real materials but they can give some basic information on the formulation of constitutive equations. Practically both experimental and theoretical approaches can be coupled to identify the constitutive equations. Such procedure has been performed for modelling the sintering of compacts obtained by die pressing of a mixture of tungsten carbide and cobalt powders. The constitutive behaviour of this material during sintering has been described by a linear viscous constitutive model, whose functions have been fitted from results of free sintering and sinter-forging experiments. This model has next been introduced in ABAQUS finite element code to simulate the sintering of heterogeneous green compacts of various geometries at constant temperature. Examples of simulations are shown and compared with experiments.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.2
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• pp.236-242
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• 1989

In order to investigate the effects of hot corrosion on the creep rupture properties and creep life of 304 stainless steel being used as tube materials of heavy oil fired boiler, the creep rupture tests were carried out at temperature 630.deg.C, 690.deg.C and 750.deg.C in static air for the specimens with or without coating of double layer corrosives according to the new hot corrosion test method simulating the situation commonly observed on superheater tubes of the actual boiler. The double layer corrosives are 85% V$_{2}$O$_{5}$ + 10% Na$_{2}$So$_{4}$ + 5% Fe$_{2}$O$_{3}$ as the inner layer corrosive being once melted at 900.deg. C and crushed to powder, and 10% V$_{2}$O$_{5}$ + 85% Na$_{2}$SO$_{4}$ +5% Fe$_{2}$O$_{3}$ as the outer layer corrosive. As results, in the specimen coated with the double layer corrosives, the rupture strength was extremely lowered and showed a large difference each other. The rupture ductility also lowered remarkably as a result of the brittle fracture mode due to hot corrosion. These results indicate that hot corrosion could essentially alter the creep fracture mechanism. From the metallographic observation, it was clarified that the rupture life of 304 stainless steel subjected to hot corrosion was chiefly determined by the behavior of the aggressive intergranular penetration of sulfides.des.

• Journal of Welding and Joining
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• v.28 no.4
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• pp.18-25
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• 2010

Super-duplex stainless steels (SDSS) have a good balance of mechanical property and corrosion resistance when they consist of approximately equal amount of austenite and ferrite. The SDSS needs to avoid the detrimental phases such as sigma(${\sigma}$), chi(${\chi}$), secondary austenite(${\gamma}2$), chromium carbide & nitride and to maintain the ratio of ferrite & austenite phase as well known. However, the effects of the subsequent weld thermal cycle were seldom experimentally studied on the micro-structural variation of weldment & pitting corrosion property. Therefore, the present study investigated the effect of the subsequent thermal cycle on the change of weld microstructure and pitting corrosion property at $40^{\circ}C$. The thermal history of root side was measured experimentally and the change of microstructure of weld root & the weight loss by pitting corrosion test were observed as a function of the thermal cycle of each weld layer. The ferrite contents of root weld were reduced with the subsequent weld thermal cycles. The pitting corrosion was occurred in the weld root region in case of the all pitted specimen & in the middle weld layer in some cases. And the weight loss by pitting corrosion was increased in proportional to the time exposed at high temperature of the root weld and also by the decrease of ferrite content. The subsequent weld thermal cycles destroy the phase balance of ferrite & austenite at the root weld. Conclusively, It is thought that as the more subsequent welds were added, the more the phase balance of ferrite & austenite was deviated from equality, therefore the pitting corrosion property was deteriorated by galvanic effect of the two phases and the increase of 2nd phases & grain boundary energy.