• 제목/요약/키워드: Gold thin-film

검색결과 137건 처리시간 0.025초

p-$Hg_{0.7}$$Cd_{0.3}$Te에 낮은 저항의 접촉을 얻는 방법에 대한 연구 (Low-resistance ohmic contacts to p-$Hg_{0.7}$$Cd_{0.3}$Te)

  • 김관;정한;김성철;이희철;김충기;김홍국;김재묵
    • 전자공학회논문지A
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    • 제31A권10호
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    • pp.87-93
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    • 1994
  • Ohmic contacts between Au and p-HgHg_{0.7}Cd_{0.3}Te$ with low specific contact resistance have been obtained. The contact region of the wafer is first pre-heated for 5 seconds in a rapid thermal processing equipment. The temperature reaches a maximum value of about 200$^{\circ}C$ at the end of the 5 seconds. Next, a thin Au film is formed on the contact region by immersing the sample in AuCl$_{3}$ solution. the sample is then post-annealed in the same condition as the pre-heating after Pb/In pad metals are deposited on the electroless Au contacts. The specific contact resistance measured by transmission line model is 5${\times}10^{-3}{\Omega}cm^{2}$ at 80K. RBS and differential Hall measurement data suggest that the above low resistance ohmic contact is ascribed to surface traps and increased gold diffusion rate.

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Fabrication of Hot Electron Based Photovoltaic Systems using Metal-semiconductor Schottky Diode

  • Lee, Young-Keun;Jung, Chan-Ho;Park, Jong-Hyurk;Park, Jeong-Young
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
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    • pp.305-305
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    • 2010
  • It is known that a pulse of electrons of high kinetic energy (1-3 eV) in metals can be generated with the deposition of external energy to the surface such as in the absorption of light or in exothermic chemical processes. These energetic electrons are not in thermal equilibrium with the metal atoms and are called "hot electrons" The concept of photon energy conversion to hot electron flow was suggested by Eric McFarland and Tang who directly measured the photocurrent on gold thin film of metal-semiconductor ($TiO_2$) Schottky diodes [1]. In order to utilize this scheme, we have fabricated metal-semiconductor Schottky diodes that are made of Pt or Au as a metallic layer, Si or $TiO_2$ as a semiconducting substrate. The Pt/$TiO_2$ and Pt/Si Schottky diodes are made by PECVD (Plasma Enhanced Chemical Vapor Deposition) for $SiO_2$, magnetron sputtering process for $TiO_2$, e-beam evaporation for metallic layers. Metal shadow mask is made for device alignment in device fabrication process. We measured photocurrent on Pt/n-Si diodes under AM1.5G. The incident photon to current conversion efficiency (IPCE) at different wavelengths was measured on the diodes. We also show that the steady-state flow of hot electrons generated from photon absorption can be directly probed with $Pt/TiO_2$ Schottky diodes [2]. We will discuss possible approaches to improve the efficiency of photon energy conversion.

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카복실레이트계 시멘트의 접착력에 관한 비교 연구 (COMPARATIVE STUDIES OF THE ADHESIVE QUALITIES OF POLYCARBOXYLATE CEMENTS)

  • 이한무
    • 대한치과보철학회지
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    • 제17권1호
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    • pp.23-34
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    • 1979
  • In this study, the adhesive strength of three commercial polycarboxylate cements to ten types of dental casting alloys, such as gold, palladium, silver, indium, copper, nickel, chromium, and human enamel and dentine were measured and compared with that of a conventional zinc phosphate cement. The $8.0mm{\times}3.0mm$ cylindrical alloy specimens were made by casting. The enamel specimens were prepared from the labial surface of human upper incisor, and the dentine specimens were prepared from the occulusal surface of the human molar respectively. Sound extracted human teeth, which had been kept in a fresh condition since, extraction, were mounted in a wax box with a cold-curing acrylic resin to expose the flattened area. The mounted teeth were then placed in a Specimen Cutter (Technicut) and were cut down under a water spray, and then the flat area on the all specimens were ground by hand with 400 and 600 grit wet silicone carbide paper. Two such specimens were then cemented together face-to-face with freshly mixed cement, and moderate finger pressure was applied to squeeze the cement to a thin and uniform film. All cemented specimens were then kept in a thermostatic humidor cabinet regulated at $23{\pm}2^{\circ}C.$ and more than 95 per cent relative humidity and tested after 24 hours and 1 week. Link chain was attached to each alloy specimen to reduce the rigidity of the jig assembly, and then all the specimens were mounted in the grips of the Instron Universal Testing Machine, and a tensile load was delivered to the adhering surface at a cross head speed of 0.20 mm/min. The loads to which the specimens were subjected were recorded on a chart moving at 0.50 mm/min. The adhesive strength was determined by measuring the load when the specimen separated from the cement block and by dividing the load by the area. The test was performed in a room at $23{\pm}2^{\circ}C.$ and $50{\pm}10$ per cent relative humidity. A minimum of five specimens were tested each material and those which deviated more than 15 per cent from the mean were discarded and new specimens prepared. From the experiments, the following results were obtained. 1) It was found that the adhesive strength of the polycarboxylate cement to all alloys tested was considerably greater than that of the zinc phosphate cement. 2) The adhesive strength of the polycarboxylate cements was superior to the non precious alloys, such as the copper, indium, nickel and chromium alloys, but it was inferior to the precious gold, silver and palladium alloys. 3) Surface treatment of the alloy was found to be an important factor in achieving adhesion. It appears that a polycarboxylate cement will adhere better to a smooth surface than to a rough one. This contrasts with zinc phosphate cements, where a rough helps mechanical interlocking. 4) The adhesion of the polycarboxylate cement with enamel was found superior to its adhesion with dentine.

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6 MV 광자선과 6 MeV 전자선 하에서 TLD 기판 위에 얹힌 금속 박막의 효과 (The Effects of Metal Plate loaded on TLD chip in 6 MV Photon and 6 MeV Electron Beams)

  • Kim, Sookil;Byungnim Min
    • 한국의학물리학회지:의학물리
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    • 제10권1호
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    • pp.41-46
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    • 1999
  • 본 실험은 의료용 가속기로부터 나오는 6MV 광자선과 6 MeV 전자선을 고체 팬텀위의 LiF 열형광 선량계 (TLD-l00)에 쪼여서 수행하였다. TLD-l00의 방사선 반응감도를 증가시키기 위해 TLD-l00 기판 (표면적 3.2 $\times$ 3.2 $\textrm{mm}^2$) 위에 같은 면적의 금속박막 (주석 혹은 금)을 얹어서 실험하였다. SSD l00cm, 방사선장의 크기 10$\times$10 $\textrm{cm}^2$의 조건 하에서 표면 흡수선량을 측정하였다. 측정결과 각 금속들로 인하여 TLD-l00 의 신호강도가 증강된 것이 관측되었다. 그리고 표면 흡수선량이 방사선량에 따라서 매우 선형적인 값을 가지는 것으로 나타났다 .6 MV 광자선의 경우 1 mm 의 금속박막을 TLD-l00 에 얹은 결과 표면 흡수선량이 각 각 14%, 56% 증가되었다 .6MeV의 전자선의 경우에는 금박막은 TL 반응감도가 13% 증가되었으나 주석의 경우에는 전혀 변화가 없었다. 금속박막을 얹은 TLD-l00의 방사선량 반응감도는 금속박막의 전자 입자밀도에 따라 증가하는 것으로 관측되었다. 이것은 TLD-l00보다 큰 전자밀도를 가진 부가물질(금속박막 )로부터 TLD-l00으로 산란전자가 유입되는 데 기인하는 것으로 보인다. 이 결과로부터 금속박막을 얹은 TL 선량계가 치료광자선용 증폭 선량계로서의 역할을 할 수 있을 것임을 시사한다. 즉 금속박막으로 인해서 TLD-l00 의 방사선 량 반응감도가 증가되었으므로 높은 감도의 보다 작은 TL 선량계의 개발이 가능하게 되었다.

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살모넬라와 면역글로블린(hIgG)의 항원-항체반응 감지를 위한 표면 플라즈몬 공명형 센서시스템의 특성 (Characteristics of Constructed SPR (Surface Plasmon Resonance) Sensor System for the Detection of Salmonella and hIgG Antigen-Antibody Reaction.)

  • 엄년식;고광락;함성호;김재호;이승하;강신원
    • 센서학회지
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    • 제7권4호
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    • pp.263-270
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    • 1998
  • 본 연구에서는 특정한 생물학적 의미를 갖는 물질들간의 결합 및 분리과정을 실시간에 측정하기 위해 빠른 응답특성과 높은 감도를 갖는 표면 플라즈몬 공명 (Surface Plasmon Resonance, SPR) 현상을 이용한 센서 시스템을 제작하였다. SPR 시스템의 프리즘 표면에 일정 두께의 금 박막이 진공증착된 센서칩을 두고 이 아래에 위치한 시료충전셀에 살모넬라 (salmonella) 항체를 주입시켜 항체가 센서칩 표면에서 자기집합 (self-assembly) 함에 따라 공명각이 변화하는 현상을 측정하였다. 이후 분석대상물질인 살모넬라 항원을 주입하여 항체와의 결합 상태를 일정 시간 간격을 두고 공명각의 변화로서 측정하고 이 결과를 분석하였다. 또한 human Immunglobulin G (hIgG)를 항원으로 한 항원-항체 반응 역시 살모넬라의 경우와 같은 방법으로 측정하였다. 그 결과 살모넬라의 항체는 센서칩 표면에서 약 10분 동안 자기집합하고 반응이 포화됨을 공명각의 변화를 통해 볼 수 있었으며, hIgG의 항체의 경우는 약 60분 동안 반응을 하고 포화됨을, 그리고 살모넬라와 hIgG의 항원 (분석대상물질) 은 모두 각각의 항체에 대해서 약 1분 이내에 결합하고 포화됨을 볼 수 있었다.

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Simultaneous Transfer and Patterning of CVD-Grown Graphene with No Polymeric Residues by Using a Metal Etch Mask

  • 장미;정진혁;;이내응
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.642-642
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    • 2013
  • Graphene, two dimensional single layer of carbon atoms, has tremendous attention due to its superior property such as high electron mobility, high thermal conductivity and optical transparency. Especially, chemical vapor deposition (CVD) grown graphene has been used as a promising material for high quality and large-scale graphene film. Unfortunately, although CVD-grown graphene has strong advantages, application of the CVD-grown graphene is limited due to ineffective transfer process that delivers the graphene onto a desired substrate by using polymer support layer such as PMMA(polymethyl methacrylate). The transferred CVD-grown graphene has serious drawback due to remaining polymeric residues generated during transfer process, which induces the poor physical and electrical characteristics by a p-doping effect and impurity scattering. To solve such issue incurred during polymer transfer process of CVD-grown graphene, various approaches including thermal annealing, chemical cleaning, mechanical cleaning have been tried but were not successful in getting rid of polymeric residues. On the other hand, lithographical patterning of graphene is an essential step in any form of microelectronic processing and most of conventional lithographic techniques employ photoresist for the definition of graphene patterns on substrates. But, application of photoresist is undesirable because of the presence of residual polymers that contaminate the graphene surface consistent with the effects generated during transfer process. Therefore, in order to fully utilize the excellent properties of CVD-grown graphene, new approach of transfer and patterning techniques which can avoid polymeric residue problem needs to be developed. In this work, we carried out transfer and patterning process simultaneously with no polymeric residue by using a metal etch mask. The patterned thin gold layer was deposited on CVD-grown graphene instead of photoresists in order to make much cleaner and smoother surface and then transferred onto a desired substrate with PMMA, which does not directly contact with graphene surface. We compare the surface properties and patterning morphology of graphene by scanning electron microscopy (SEM), atomic force microscopy(AFM) and Raman spectroscopy. Comparison with the effect of residual polymer and metal on performance of graphene FET will be discussed.

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안경렌즈코팅용 소형 Sputter Coating System 설계 및 제작에 관한 연구 (Design and Fabrication of Sputter Coating System for Ophthalmic Lens)

  • 박문찬;정부영;김응순;이종근;주경복;문희성
    • 한국안광학회지
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    • 제13권1호
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    • pp.53-58
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    • 2008
  • 목적: 안경렌즈용 소형 suptter coating system을 설계하고 제작하고자 한다. 방법: sputter system의 target 설계에 있어서 Essential Macleod thinfilm design software를 이용해 AR 코팅과 mirror 코팅이 동시에 설계 가능한 Si target 을 결정하였으며. 그 후 sputtering 장비를 제작하였다. 결과: $SiO_2$$Si_3N_4$의 5층 박막으로 구성되는 AR 코팅의 최적조건은 [air|$SiO_2$(81.3)|$Si_3N_4$(102)|$SiO_2$(19.21)|$Si_3N_4$(15.95)| $SiO_2$(102)|glass] 이였다. Mirror 코팅의 경우, blue color 코팅의 최적조건은 [air|$SiO_2$(56.61)|$Si_3N_4$(135.86)|$SiO_2$(67.64)| $Si_3N_4$(55.4)|$SiO_2$ (53.53)|$Si_3N_4$(51.28)|glass] 이고, green color 코팅의 최적조건은 [air|$SiO_2$(66.2)|$Si_3N_4$(22.76)|$SiO_2$(56.58)| $Si_3N_4$(140.35) |$SiO_2$(152.35)|$Si_3N_4$(70.16)|$SiO_2$(121.87)|glass] 이였으며, gold color 코팅의 최적조건은 [air|$SiO_2$(83.59)|$Si_3N_4$(144.86) |$SiO_2$(11.82)|$Si_3N_4$(129.93)|$SiO_2$(90.01)|$Si_3N_4$(88.37)|glass] 이였다. 결론: 코팅 시간을 줄여 안경단가를 줄이기 위하여 안경렌즈 코팅 시 렌즈의 전 후면을 동시에 코팅을 해야 하기 때문에 sputtering장비 설계를 할 때 안경렌즈 전면과 후면에 동일하게 Si target을 갖춘 cathode를 사용하였고, 렌즈의 곡률을 고려하여 각 층이 동일하게 코팅이 되어야 하기 때문에 target-substrate 간의 간격은 12.5 cm에서 20 cm로 가변할 수 있도록 설계하고 제작하였다. 고품질의 안경렌즈 코팅을 위하여 고진공 펌프로 turbo pump를 이용하였으며, 코팅박막의 균일함을 얻기 위해서 치구를 회전할 수 있도록 설계하고 제작하였다.

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