• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.386.1-386.1
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• 2014

The ionic polymer-metal composite (IPMC), a type of electro-active polymer material, has received enormous interest in various fields such as robotics, medical sensors, artificial muscles because it has many advantages of flexibility, light weight, high displacement, and low voltage activation, compare to traditional mechanical actuators. Mostly noble metal materials such as gold or platinum were used to form the electrode of an IPMC by using electroless plating process. Furthermore, carbon-based materials, which are carbon nanotube (CNT) and reduced graphene-CNT composite, were used to alter the electrode of IPMC. To form the electrode of IPMC, we employ the synthesized graphene on copper foil by chemical vapor deposition method and use the transfer process by using a support of PET/silicone film. The properties of graphene were evaluated by Raman spectroscopy, UV/Vis spectroscopy, and 4-point probe. The structure and surface of IPMC were analyzed via field emission scanning electron microscope. The fabricated IPMC performance such as displacement and operating frequency was measured in underwater.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.25-27
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• 2005

Sn-9Zn solder balls were bonded to Cu and ENIG (Electroless Nickel/Immersion Gold) pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Sn-9Zn/ENIG, the shear strength remained nearly constant in spite of aging for 1000 hours at $150^{\circ}C$. On the other hand, in the case of the Sn-9Zn/Cu, the shear strength significantly decreased after aging at $150^{\circ}C$ for 100hours and then remained constant by further prolonged aging. Therefore, the protective plating layer such as ENIG must be used to ensure the mechanical reliability of the Sn-9Zn/Cu joint.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.27-33
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• 2008

With increasing use of portable appliances such as PDA and cellular phone, changing environment of applications requires higher solder joint reliability. The ENIG (Electroless Nickel Immersion Gold) process has been widely used for fine pitch SMT (Surface Mount Technology) and BGA (Ball Grid Array) packaged devices due to its benefits including excellent solderability, high uniformity and substantial legibility throughout the packaging process. Its brittle fracture of solder, however, has received increasingly attentions. It was Down that fracture brittleness is mainly related with black pad resulting from galvanic nickel corrosion and P-enriched layer formation between the IMC (Intermetallic Compounds) and electroless nickel layer. Theoretically, smooth electroless Ni layer was blown to have a advantages in minimizing the black pad phenomenon by uniform solution exchange during immersion gold plating. Nevertheless, how to control the surface morphology of electroless Ni layer has been hardly blown. This study investigates an effect of surface morphology of Cu underlayer on surface morphology of electroless Ni layer. To obtain various kinds of surface morphology of Cu layer, two types of Cu etching chemical and a number of Cu etching treatment were applied.

• 보존과학연구
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• s.27
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• pp.129-143
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• 2006

This report is on a scientific investigation of 3 pairs of 금제태환이식 which were excavated from 황남대총 납분. 태환 is a main part of 태환이식 and it could be classified with 4 types in how to produce, especially how many the golden petal was used. In this investigation, they,3 pairs of 금제태환이식 from 황남대총 남분, were in 3 of 4 types and also I could find that this result was not on the technical progress but on the ingredient of metal. Also, In the result of ingredient assay, I could find that although they were in one pair of 태환 one piece was made in gold and silver alloy and the other piece was made in 99.5 percent of pure Ag with gold amalgam plating. And the another pair was getting red from others because of making in 33percent of Ag and 77 percent of gold, high Ag content. And All pairs of 태환 have a small quantity of Copper. As above, although they are one pair they have the difference of how to produce and the difference of volume and ingredient content, it means that these pairs of 태환 from 황남대총 남분 were made in pressure of time. From now on, if we investigate the ingredient and how to produce of 태환이식 in the local comparative analysis, namely natural science method, we can find out the metal art technique and the social aspect of the ancient times as not analogical inference but scientific basis.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.673-681
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• 1995

Surface morphology and preferred orientation of 20${\mu}{\textrm}{m}$ gold electrodeposit formed from aqueous solution of the sodium gold sulfite were studied in terms of current density, plating temperature and Au concentration. As the current density changed from 13.0mA/$\textrm{cm}^2$ to 4.6mA/$\textrm{cm}^2$, the solution temperature from 3$0^{\circ}C$ to 6$0^{\circ}C$, pH from 12.0 to 9.0, agitation speed from 0 rpm to 3200rpm and Au concentration from 10g/1 to 14 g/1, local Au concentration near the cathodic surface increased. With increasing the Au concentration, the surface morphology chanced from porous structure to fine-grained structure. Furthermore, it was observed that the preferred orentation of the Au layer changed from (111) to (220) upon the same variation In the Au concentration. The surface morphology and the preferred orientation of the Au layer were found to be closely related to each other.

• Journal of Conservation Science
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• v.37 no.2
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• pp.144-153
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• 2021

Gwanghwadang-Wonsam was designated as National Folklore Cultural Heritage No. 52 in 1979, it is in good condition. However, a problem is the attached a phoenix insignia badge that did not exist when it was designated recently. As it became known as the only purple Wonsam artifact with "phoenix insignia", raising the need for its conservation. In this regard, scientific analysis was required to correct misinformation about designated cultural assets and restore the original designated state by analyzing the history of the Gwanghwadang-Wonsam, other relics of the phoenix insignia and its making design patterns. An X-ray fluorescence analysis was used to confirm that the Phoenix insignia's metal threads were titanium-plated silver. Phoenix insignia using titanium-plated gold thread was not identified in Gwanghwadang-Wonsam photographs in 1986, and the TiN-type membrane plating method was used in various industries in the 1990s, which can be estimated to be attached in the early and mid-1990s. Especially, the scientific analysis results from the X-ray fluorescence analysis in this study provide key evidence for conservation processing. This study demonstrates the importance of investigating relics and similar artifacts in the conservation process of inherited relics and as a precedent for restoration that corrects misinformation about designated cultural properties.

• Korean Journal of Heritage: History & Science
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• v.39
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• pp.243-280
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• 2006

At the Bujang-ri Site, Seosan, South Chungcheong Province, around 220 archaeological features, including semi-subterranean houses and pits of Bronze Age and semi-subterranean houses, pits, and burials of Baekje period had been identified and investigated. In Particular, mound burials No. 5 of 13 of Baekje mound burials yielding a gilt-bronze cap along with other valuable artifacts drew international scholarly attention. The gilt-bronze cap from the mound burial No. 5 is a significant archaeological data not only in the study of Baekje archaeology but also in the study of international affairs and exchange at that time. At the time of exposure, the gilt-bronze cap was already broken into a number of pieces and seriously damaged by corrosion, and hardening and urethane foam were necessary in the process of collecting its pieces. Ahead of main conservational treatments on cap, X-ray photograph and CT(computerizes tomography) were taken in order to examine interior structure of the cap and to decide appropriate treatments. In the five layers identified in the profile of cap, a textile layer was set between a metal and a layerof bark of paper birch for avoiding direct contact of the metal and the bark of paper birch. Analyses were executed for examining textile layer and a layer of fibroid material. According to microscopic analysis, while the textile layer consisted of the simplest plain fabric with one fold among three kinds of textile structures, the layer of fibroid material was mixed with two or three kinds of fibers. A comparative analysis with standard sample using FT-IR (Fourier Transform Infrared Spectroscopy) announced that both textiles and fabrics were hemp. Analysis of kind of the paper birch resulted in barks of paper birch with 15 fold. A metallographic microscope, SEM, and WDS were used for the analysis of microscopic structures of plated metal pieces. While amalgam plating was treated as a plating method, the thickness of the plated layer, a barometer of plating technique, was ranged from $1.72{\mu}m$ to $8.67{\mu}m$. The degree of purity of gold (Au) used in plating was 98% in average, and less than 1% of silver (Ag) was included.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.2
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• pp.155-161
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• 2013

In this study, a metal-plated polycarbonate was adopted as a material for bipolar plates in a polymer electrolyte membrane fuel cell (PEMFC). The coated layers included 40-${\mu}m$-thick copper, 10-${\mu}m$-thick nickel, and 0.3-${\mu}m$-thick gold that respectively played the roles of current conduction, adhesion between copper and gold, and minimization of surface corrosion. The maximum power of the air-breathing PEMFC with polycarbonate bipolar plates was $120mW/cm^2$, which was similar to that of graphite bipolar plates. Finally, the maximum power of a 12-cell stack of polycarbonate bipolar plates was $132.7mW/cm^2$, and it had an operating time of 12 h. Therefore, this was considered a suitable material for bipolar plates in PEMFCs.

• Polymer(Korea)
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• v.36 no.2
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• pp.169-176
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• 2012

Based on our experience in developing resistive humidity sensor, interdigital gold electrodes with different fingers and gaps have been fabricated on a glass epoxy (GE) substrate using screen printing techniques. The basic structure of the electrode consisted of a 3-, 4- and 5-fingers with gaps of 310 and 460 ${\mu}m$. Gold electrode/GE was prepared by first printing silver nanopaste, followed by consecutive electroless plating of Cu, Ni and then Au. Copolymer of [2-(methacryloyloxy)ethyl] dimethyl benzyl ammonium chloride (MDBAC) and methyl methacrylate (MMA) was used as a humidity-sensing polyelectrolyte, which was fabricated by a screen printing method on the Au electrode/GE substrate. The flexible humidity sensor showed acceptable linearity between logarithmic impedance and relative humidity in the range of 20-95%RH, low hysteresis of 1.5%RH, good response and recovery time of 75 sec at 1 V, 1 kHz, and $25^{\circ}C$. Electrode construction had a significant influence on the humidity-sensing characteristics of polymeric humidity sensors. The activation energy between electrode and ion conducting polyelectrolyte plays an important role in explaining the differences of humidity sensing characteristics such as temperature dependence, sensitivity, linearity and hysteresis.