• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.81-84
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• 2004

The NiCr is an important material for present thin-film resistor application owing to its low TCR and thermal stability. In this work, the NiCr thin films were deposited on coming glass substrate by reactive magnetron sputtering and the annealing at temperatures range from 300 to $500^{\circ}C$ for 20 min in vacuum. X-ray, AFM, $R_s$(surface leakage current) have been used to study the structural and electrical properties of the NiCr thin films. The high precision NiCr thin films resistor with TCR(temperature coefficient of resistance) of less then $10\;ppm/^{\circ}C$ was obtained under in in-situ annealing at $300^{\circ}C$ on Cr buffer layer substrate. It is clear that the NiCr thin-films resistor electrical properties are low TCR related with it's annealing and buffer layer condition. NiCr thin film resistor having a good thermal stability and low TCR properties are expected for the application to the dielectric material of passive component.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.43 no.2
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• pp.66-71
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• 2011

Biocomposites were fabricated with biodegradable polymers and natural fibers. Biocomposites have benefits of low cost, low density, and biodegradability over inorganic fiber composite, and give comparable strength properties. Hydrophobic polymer used for sizing in paper industry, AKD (Akenyl Keten Dimer), was applied to natural fibers, red algae fibers (RAF) in this study, to make fiber surfaces more compatible to hydrophobic nature of matrix polymers. Composites with RAF, kenaf, glass fibers, and carbon fibers have been fabricated by a compression molding method and their thermo-mechanical properties have been studied. Also, the thermal dimensional stability test was done from at 30 to $100^{\circ}C$. The storage moduli and the thermo-mechanical stabilities of polypropylene and poly lactic acid based biocomposites were improved by reinforcing with the RAF and much more with AKD treated fibers. Dimensional stability of biocomposite was also markedly improved by AKD pretrement on RAF.

• Bulletin of the Korean Chemical Society
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• v.29 no.5
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• pp.933-938
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• 2008

2,4-Di-(2'-hydroxyethoxy)benzylidenemalononitrile (3) was prepared and polymerized with terephthaloyl chloride and adipoyl chloride to yield novel Y-type polyesters 4 and 5 containing dioxybenzylidenemalononitrile groups as NLO-chromophores, which constituted parts of the polymer backbone. The resulting polymers 4 and 5 are soluble in common organic solvents such as acetone and N,N-dimethylformamide. Polymers 4 and 5 showed thermal stability up to 300 ${^{\circ}C}$ in thermogravimetric analysis with glass-transition temperatures obtained from differential scanning calorimetry in the range 83-94 ${^{\circ}C}$. The second harmonic generation (SHG) coefficients ($d_{33}$) of poled polymer films at the 1064 nm fundamental wavelength were around $6.48\;{\times}\;10^{-9}$ esu. The dipole alignment exhibited high thermal stability even at 10 ${^{\circ}C}$ higher than $T_g$ and no significant SHG decay was observed below 105 ${^{\circ}C}$ partially due to the main-chain character of polymer structure, which is acceptable for NLO device applications.

• Bulletin of the Korean Chemical Society
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• v.31 no.6
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• pp.1509-1514
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• 2010

Methyl 3,4-di-(2'-hydroxyethoxy)benzylidenecyanoacetate (3) was prepared and condensed with terephthaloyl chloride to yield novel Y-type polyester (4) containing 3,4-dioxybenzylidenecyanoacetate groups as NLO-chromophores, which constituted parts of the polymer main chains. The resulting polymer 4 is soluble in common organic solvents such as acetone and N,N-dimethylformamide. Polymer 4 shows thermal stability up to $280^{\circ}C$ in thermogravimetric analysis with glass-transition temperature obtained from differential scanning calorimetry near $105^{\circ}C$. The second harmonic generation (SHG) coefficient ($d_{33}$) of poled polymer films at the 1064 nm fundamental wavelength is around 2.42 pm/V. The dipole alignment exhibits high thermal stability up to near $T_g$, and there is no SHG decay below $100^{\circ}C$ due to the partial main-chain character of polymer structure, which is acceptable for NLO device applications.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.48-49
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• 2006

Highly conductive and transparent films of Ga-doped ZnO have been prepared by pulsed laser deposition using a ZnO target with 3 wt% ${Ga_2}{O_3}$ dopant. Films with the resistivity as low as $3.3{\times}10^{-4}{\Omega}cm$ and the transmittance above 80 % at the wavelength of 400 to 800 nm can be fabricated on glass substrate at room temperature. It is shown that a stable resistivity for the use in oxidation ambient at high temperature can be obtained for the films. Heat treatments were performed to examine the thermal stability of ZnO and GZO films at ptemperature range from $100^{\circ}C$ to $400^{\circ}C$ in $O_2$ ambient for 30 minutes. The resistivity of ZnO film annealed at $400^{\circ}C$ increased by two orders of magnitude, in case of GZO film was relatively stable up to at $400^{\circ}C$. For practical applications at high temperatures the thermal stability of resistivity of GZO thin films might become an advantage for transparent electrodes.

• Macromolecular Research
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• v.15 no.3
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• pp.234-237
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• 2007

3,4-Bis-(3,4-dicarboxyphenylcarboxyethoxy)-4'-nitrostilbene dianhydride was prepared and reacted with 4,4'-(hexafluoroisopropylidene)dianiline to yield a novel Y-type polyimide containing the 3,4-dioxynitrostilbenyl group as an NLO-chromophore, which constituted part of the polymer backbone. The resulting polyimide was soluble in polar solvents such as acetone and N,N-dimethylformamide. The polymer exhibited good thermal stability up to $370^{\circ}C$ in the thermogravimetric analysis. The glass-transition temperature ($T_g$) obtained from the differential scanning calorimetry thermogram was near to $153^{\circ}C$. The second harmonic generation (SHG) coefficient ($d_{33}$) of the poled polymer film at the fundamental wavelength of $1064\;cm^{-1}$ was around $2.15\;{\times}\;10^{-8}\;esu$ (9.01 pm/V). The dipole alignment exhibited exceptionally high thermal stability even at a temperature $30^{\circ}C$ above the $T_g$, and there was no SHG decay below $180^{\circ}C$ because of the partial main chain character of the polymer structure.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.1.1-1.1
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• 2011

Printed electronics based on the direct writing of solution processable functional materials have been of paramount interest and importance. In this talk, the synthesis of printable inorganic functional materials (conductors and semiconductors) for thin-film transistors (TFTs) and photovoltaic devices, device fabrication based on a printing technique, and specific characteristics of devices are presented. For printable conductor materials, Ag ink is designed to achieve the long-term dispersion stability and good adhesion property on a glass substrate, and Cu ink is sophisticatedly formulated to endow the oxidation stability in air and even aqueous solvent system. The both inks were successfully printed onto either polymer or glass substrate, exhibiting the superior conductivity comparable to that of bulk one. In addition, the organic thin-film transistor based on the printed metal source/drain electrode exhibits the electrical performance comparable to that of a transistor based on a vacuum deposited Au electrode. For printable amorphous oxide semiconductors (AOSs), I introduce the noble ways to resolve the critical problems, a high processing temperature above $400^{\circ}C$ and low mobility of AOSs annealed at a low temperature below $400^{\circ}C$. The dependency of TFT performances on the chemical structure of AOSs is compared and contrasted to clarify which factor should be considered to realize the low temperature annealed, high performance AOSs. For photovoltaic application, CI(G)S nanoparticle ink for solution processable high performance solar cells is presented. By overcoming the critical drawbacks of conventional solution processed CI(G)S absorber layers, the device quality dense CI(G)S layer is obtained, affording 7.3% efficiency CI(G)S photovoltaic device.

• The Journal of Advanced Prosthodontics
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• v.3 no.4
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• pp.196-203
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• 2011

PURPOSE. This study evaluated marginal fit of glass infiltrated alumina cores fabricated using two techniques and their marginal stability after firing cycles of veneering porcelain. MATERIALS AND METHODS. Fifteen standardized all-ceramic crowns were fabricated on a metal die using each technique: slip cast technique of VITA In-Ceram sprint Alumina (Group A as control) and plastic foil matrix technique of Turkom-Cera fused alumina core system (Group B). Copings were compared between groups and within groups at coping stage and after firing each layer of veneering porcelain. A device was used to standardize seating of copings on the metal die and positioning of the specimens under the microscope after each stage of fabrication. The specimens were not cemented and marginal gap was measured using an image analyzing software (Imagepro Express) on the photographs captured under an optical microscope. Two tailed unpaired 't test' was used to compare marginal gaps in two groups and one way ANOVA was used to analyze marginal distortion within each group at 95% confidence interval. RESULTS. The marginal gap was smaller at the coping stage in group B ($60+30{\mu}M$) than group A ($81+21{\mu}M$) with statistical significance. After firing of veneering porcelain the difference was insignificant. At the final stage, both groups exhibited lower mean marginal gaps than at the initial coping stage with the difference of $11.75{\mu}M$ for group A and $11.94{\mu}M$ for group B, but it was statistically insignificant due to high value of standard deviation. CONCLUSION. Within the limitations of this study, it was concluded that both techniques produced copings with comparable and acceptable marginal fit and marginal stability on firing veneering porcelain.

• Journal of the Korean Ceramic Society
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• v.32 no.11
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• pp.1269-1275
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• 1995

Effects of GeO2 addition on the thermal and structural stabilities of PbO-Bi2O3-Ga2O3 glasses were studied. Thermal stabilities, as assessed by the weighted thermal stability factors [(Tx-Tg)/Tg], increased with GeO2 concentraton from 0.097 to 0.210 with the addition of 20 mol% GeO2. Increasing GeO2 content resulted in the decrease of apparent density, molar volume, refractive index and thermal expansion. On the other hand, IR transmission cut-off (λT=50%) moved from 6.73${\mu}{\textrm}{m}$ for the ternary PbO-Bi2O3-Ga2O3 glass to shorter wavelength side, 5.98${\mu}{\textrm}{m}$ for a glass containing 20mol% GeO2. There were little change with GeO2 content, however, in the activation energies for the viscous flow of approximately 140 kcal/mole within the temperature interval of 300~50$0^{\circ}C$. Addition of GeO2 to PbO-Bi2O3-Ga2O3 glasses enhanced the thermal and structural stabilities significantly at the expense of their infrared transmittance. An appropriate compsomise between these two opposite trends should be made following the specifications of the final applications.

• Polymer(Korea)
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• v.26 no.4
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• pp.501-507
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• 2002

In this work, diglycidylether of bisphenol-S (DGEBS) epoxy resin was prepared by alkaline condensation of bisphenol-S (BPS) with epichlorohydrin (ECH) in the presence of NaOH catalyst. The structure of the synthesized DGEBS epoxy resin was confirmed by IR, NMR spectra, and elemental analysis. The curing reaction and glass transition temperature ($T_g$) of DGEBS epoxy resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) at curing agents were studied by dynamic differential scanning calorimetry (DSC). The thermal stability of the cured specimen was investigated by thermogravimetric analysis (TGA). As a result, the activation energy ($E_a$) of DGEBS/PA system was higher than that of DGEBS/THPA system, whereas $T_g$, initial decomposed temperature (IDT), and decomposition activation energy ($E_t$) of DGEBS/PA were lower than those of DGEBS/THPA. This was probably due to the fact that the crosslinking density of DGEBS/THPA was increased by ring strain of curing agent.