• 한국안전학회지
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• 제30권6호
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• pp.40-47
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• 2015

In this study, temperature characteristics and fire damage form were analyzed to investigate flame spreading form and fire probability from ignition sources subject to drivit component materials which is finishing material in architecture. Ignition sources were limited to a gas torch and exterior panel board fire, and the size of the sample was manufacture in 30 cm length ${\times}$ 50 cm height ${\times}$ 5cm thickness size. Marble (inner wall) + 3 mm drivit (outer wall), marble (inner wall) + 4 mm plaster stone (outer wall), sandwich panel + 3 mm driver bit (outer wall), sandwich panel + 3 mm driver bit + insulation (outer wall), and gypsum board (inner wall) + 3 mm drivit (outer wall) were prepared for the sample. As result of the research for temperature characteristics, large temperature difference by each material was shown in $218^{\circ}C{\sim}995^{\circ}C$ at 30 seconds and $501^{\circ}C{\sim}1078^{\circ}C$ at 300 seconds. Especially when the inner wall was a plaster board, lowest temperature of $501^{\circ}C$ was shown at 300 seconds and marble inner wall showed the following lowest temperature of $900^{\circ}C$. Temperature rising over $1000^{\circ}C$ was shown in other materials. Regarding fire damage form, drivit or gypsum board outer wall parts exposed to fire showed combustion and carbonization to show calcination(breaking phenomenon) and influence of heat exposure was higher as calcination became more severe.

• 한국재료학회지
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• 제14권9호
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• pp.670-675
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• 2004

Glasses in the $Bi_{2}O_3-SiO_2-ZnO$ glasses system were examined as a potential replacement for lead-oxide glass frits with low firing temperature ($500\sim600^{\circ}C$) for the dielectric layer of a plasma display panel (PDP). The glasses were evaluated for glass transition temperature($T_{g}$) and thermal expansion coefficient(${\alpha}$). After forming transparent thick films by a screen-printing method, it was evaluated for the optical properties. The transmittance of thick films fired at $500-600^{\circ}C$ showed above $80\%$, which was not dependent on the firing temperature. As a result, many pores were observed at samples fired at low temperature, while the number of pores from samples prepared at high temperature decreased and the pores size increased.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 추계학술대회 논문집
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• pp.53-56
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• 1998

Electroluminescent(EL) devices based on organic materials have been of great interest due to their possible applications for large-area flat-panel displays, where they are attractive because of their capability of multicolor emission, and low operation voltage. In this study, glass substrate/ITO/Eu(TTA)$_3$(Phen)/Al(A), glass substrate/ITO/TPD/Eu(TTA)$_3$(p-hen)/Al(B) and glass substrate/ITO/TPD/Eu(TTA)$_3$(phen)/AlQ$_3$/Al(C) structures were fabricated by vacuum evaporation method. where aromatic diamine(TPD) was used as a hole transporting material, Eu(TTA)$_3$(phen) as an emitting material. and tris(8-hydroxyquinoline)Aluminum(AlQ$_3$) as an electron transporting layer. Electroluminescent(EL) and I-V characteristics of Eu(TTA)$_3$(Phen) with a various thickness were investigated. This structure shows the red EL spectrum, which is almost the same as the PL spectrum of Eu(TTA)$_3$(phen). I-V characteristics of this structure show that turn-on voltage was 9V and current density was 0.01A/$\textrm{cm}^2$ at a dc operation voltage of 9V. Electrical transporting phenomena of these structures was explained using the trapped- charge-limited current model with I-V characteristics.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1096-1099
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• 2004

The principal problems in development of dielectric paste materials for PDP(plasma display panel)are PbO free paste and low melting temperature. We prepared PbO free paste from glasses in the system BaO-ZnO-$B_2O_3$-$V_2O_5$. DTA, and XRD were used to characterize BaO-ZnO-$B_2O_3$-$V_2O_5$ glasses. In this present study, PbO free paste had thermal expansion of $74\times10^{-7}/^{\circ}C$, DTA softening point of $460^{\circ}C$, and firing condition of $520^{\circ}C$, 20min

• 한국정밀공학회지
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• 제31권9호
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• pp.831-838
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• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

• 대한기계학회논문집A
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• 제24권9호
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• pp.2371-2380
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• 2000

In this paper, we developed the proximity exposure system with the vertical structure of glass and mask stage to minimize the mask's warp caused by the pull of gravity. This system, which canirradiate the ultra violet through 1440 H 850 $\textrm{mm}^2$ and 1330X 1015 $\textrm{mm}^2$ exposure area, has the followingcharacteristics. The glass stage can be inclined by 80 degrees at vertical structure to load substrate withsafety on it. When the glass stage is the vertical state, the gap control, alignment control and exposureof ultra violet are executed. So, it enhances the pattern uniformity by minimizing the mask's warp. Theglass stage can also control the gap between the mask and the substrate by the coarse and fine motioncontrol. The mask stage can adjust the posture of photomask to the position of substrate by imageprecessing method. The galss stage for the gap control and the mask stage for the alignment aredesigned independently for each function.

• 한국전기전자재료학회논문지
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• 제11권10호
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• pp.871-877
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• 1998

Electroluminescent(EL) devices based on organic materials have been of great interest due to their possible applications for large-area flat-panel displays, where they are attractive because of their capability of multicolor emission, and low operation voltage. In this study, glass substrate/ITO/Eu(TTA)$_3$(phen)/Al, glass substrate/ITO/Eu(TTA)$_3$(phen)/Al and glass substrate/ITO/Eu(TTA)$_3$(phen)/AlQ$_3$/Al structures were fabricated by vacuum evaporation method, where aromatic diamine(TPD) was used as a hole transporting material, Eu(TTA)$_3$(phen) as an emitting material, and Tris(8-hydroxyquinoline) aluminu-m(AlQ$_3$) as an electron transporting layer. Electrolumescent(EL) and I-V characteristics of Eu(TTA)$_3$-(-phen) were investigated. These structures show the red EL spectra, which are almost the same at the PL spectrum of Eu(TTA)$_3$(phen). I-V characteristics of this structure show that turn-on voltage was 9V and current density was 0.01A/㎤ at a operation voltage of 9V. Electrical transporting phenomena of these structures were explained using the trapped-charge-limited current model with I-V characteristics.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.317-320
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• 1998

Electroluminescent(EL) devices based on organic materials have been of great interest due to their possible applications for large-area flat-panel displays, where they are attractive because of their capability of multicolor emission, and low operation voltage. In this study, glass substrate/ITO/Eu(TTA)$_3$(Phen)/Al(A), glass substrate/ITO/TPD/Eu(TTA)$_3$(phen)/Al(B) aNd glass substrate/ITO/TPD/Eu(TTA)$_3$(Phen)/A1Q$_3$/Al (C) structures were fabricated by vacuum evaporation method, where aromatic diamine(TPD) was used as a hole transporting material, Eu(TTA)$_3$(phen) as an emitting material, and tris(8-hydroxyquinoline) Aluminum (AlQ$_3$) as an electron transporting layer. Etectroluminescent(EL) and I-V characteristics of Eu(TTA)$_3$(phen) with a various thickness were investigated. This structure shows the red EL spectrum, which is almost the same as the PL spectrum of Eu(TTA)$_3$(phen). I-V characteristics of this structure show that turn-on voltage was 9V and current density was 0.01A/㎤ at a dc operation voltage of 9V. Electrical transporting phenomena of these structures was explained using the trapped-charge-limited current model with I-V characteristics.

• 한국태양에너지학회 논문집
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• 제33권3호
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• pp.75-81
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• 2013

In this study, we analyze the performance characteristics of Building Integrated Photovoltaic (BIPV) system of K Research Building which was designed with the aim of zero carbon building. In addition, BIPV system, which is consist of three modules; G to G(Glass to Glass), G to T(Glass to Tedlar/Crystal) and Amorphous, has 116.2kWp of total capacity, and is applied to wall, window, atrium and pagora on roof. Therefore, in this paper, our research team analyzed BIPV yield and generation characteristic. BIPV yield was 112,589kWh a year from January 2012 to December 2012. And after applying PV panels on the building, the power from the best setting angle, $30^{\circ}$, of panel was compared. In addition, when the PV was attached practically on the building, the generation power was analyzed. BIPV modules in this study the relationship between module setting angle, type of modules ect. and power characteristics plans to identify.

• 소성∙가공
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• 제32권6호
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• pp.367-375
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• 2023

Composite materials, known for their excellent mechanical properties and lightweight characteristics, are applied in various engineering fields. Recently, efforts have been made to develop an automotive battery protection panel using a plain-woven composite composed of glass fiber and polypropylene to reduce the weight of automobiles. However, excessive warpage occurs during the GF/PP compression molding process, which makes car assembly challenging. This study aims to develop a model that predicts the warpage during the compression molding process. Obtaining out-of-plane properties such as elastic or shear modulus, essential for predicting warpages, is tricky. Existing mechanical methods also have limitations in calculating these properties for woven composite materials. To address this issue, finite element analysis is conducted using representative volume elements (RVE) for woven composite materials. A warpage prediction model is developed based on the estimated physical properties of GF/PP composite materials obtained through representative volume elements. This model is expected to be used for reducing warpages in the compression molding process.