• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.10a
• /
• pp.757-758
• /
• 2012

• Journal of the Korean Society for Precision Engineering
• /
• v.24 no.4 s.193
• /
• pp.36-43
• /
• 2007

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2012.10a
• /
• pp.490-491
• /
• 2012

• Proceedings of the Korean Ceranic Society Conference
• /
• 2003.10a
• /
• pp.161.2-161
• /
• 2003

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.49 no.1
• /
• pp.70-72
• /
• 2000

In this paper, a spacer process for FED(Field Emission Display) was developed with the glass to glass anodic bonding technology using Al film as an interlayer and a 3.5 inch monochromatic type FED was fabricated. Holder to dislocate spacers vertically was designed with (110) Si wafer by bulk etching. Spacers, $100\mum\; width\; and\; 1000\mum$ height, were formed on anode panel by spacer to glass anodic bonding and the fabricated FED was operated for emission at 1㎸ anode voltage.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.208-210
• /
• 2008

We have developed a LCD Panel that form storage capacitance for pixels between pixel electrode of bottom glass and common electrode of top glass. This method could make higher transmission and higher production yield than before by removing storage electrode line and capacitance on the bottom glass by simplifying bottom pixel structure.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.359-361
• /
• 2008

Glasses in the $SnO_2-(50-x)P_2O_5-xB_2O_3$ system were examined as potential replacement for the PbO glass frits with low firing temperature for component materials of a plasma display panel. The glasses were evaluated for their structural and the thermal expansion coefficient, glass transition and glass softening temperatures and Vickers hardness as a function of the $B_2O_3$ content.

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.3
• /
• pp.25-29
• /
• 2002

Single ion exchange process was used, and the ion exchange behavior and mechanical properties were investigated in substrate glass for flat panel display. In order to study the effects of ion exchange, ion exchange behavior with ion penetration depth, amount of ion exchange, density and thermal expansion was measured according to the time and temperature. The mechanical properties were evaluated by the three point bending test and curvature change, and then the fracture patterns were investigated by optical microscope.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.196.1-196.1
• /
• 2016

TCO(Transparent Conducting Oxide) on flat glass is used in thin-film photovoltaic cell, flat-panel display. Nowadays, Corning(R) Willow Glass(R), known as flexible substrate, has attracted much attention due to its many advantages such as reliable roll-to-roll glass processing, high-quality flexible electronic devices, high temperature process. Also, it can be an alternative to flexible polymer substrates which have their poor stability and degradation of electrical and optical qualities. For application on willow glass, the flexibility, electrical, optical properties can be greatly influenced by the TCO thin film thickness due to the inherent characterization of thin film in nanoscale. It can be expected that while thick TCO layer causes poor transparency, its sheet resistance become low. Also, rarely reports were focusing on the influence of flexible properties by varying TCO thickness on flexible glass. Therefore, it is very important to optimize TCO thickness on flexible Willow glass. In this study, Ti-ZnO thin films, with different thickness varied from 0 nm to 50 nm, were deposited on the flexible willow glass by atomic layer deposition (ALD). The flexible, electrical and optical properties were investigated, respectively. Also, these properties of Ti-doped ZnO thin films were compared with un-doped ZnO thin film. Based on the results, when Ti-ZnO thin films thickness increased, resistivity decreased and then saturated; transmittance decreased. The Figure of Merit (FoM) and flexibility was the highest when Ti-ZnO thickness was 40nm. The flexible, electrical and optical properties of Ti-ZnO thin films were better than ZnO thin film at the same thickness.

• Korean Journal of Materials Research
• /
• v.19 no.11
• /
• pp.613-618
• /
• 2009

We designed new compositions for lead free and low temperature sealing glass frit of $ZnO-V_2O_5-P_2O_5$ system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The $ZnO-V_2O_5-P_2O_5$ system can be used as a sealing material at temperatures even lower than 430$^{\circ}C$. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added $TiO_2$ as a promoter for bonding strength. We examined the effect of $TiO_2$ addition on sealing behaviors of $ZnO-V_2O_5-P_2O_5$ glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of $ZnO-V_2O_5-P_2O_5$ system glasses were improved with $TiO_2$ addition, but showed a maximum value at 5 mol% $TiO_2$ addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.