• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.3
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• pp.185-191
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• 2017

Cadmium compounds with one dimension (1D) nanostructures have attracted attention for their excellent electrical and optical properties. In this study, vertically aligned CdTe-Si nanostructures with high density were synthesized by several simple chemical reactions. First, l D Te nanostructures were synthesized by silver assisted chemical Si wafer etching followed by a galvanic displacement reaction of the etched Si nanowires. Nanowire length was controlled from 1 to $25{\mu}m$ by adjusting etching time. The Si nanowire galvanic displacement reaction in $HTeO_2{^+}$ electrolyte created hybrid 1D Te-branched Si nanostructures. The sequential topochemical reaction resulted in $Ag_2Te-Si$ nanostructures, and the cation exchange reaction with the hybrid 1D Te-branched Si nanostructures resulted in CdTe-Si nanostructures. Wet chemical processes including metal assisted etching, galvanic displacement, topochemical and cation exchange reactions are proposed as simple routes to fabricate large scale, vertically aligned CdTe-Si hybrid nanostructures with high density.

• Bulletin of the Korean Chemical Society
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• v.29 no.2
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• pp.445-449
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• 2008

Micrometer-sized copper (mCu) powders are weakly surface-enhanced Raman scattering (SERS) active by the excitation at 632.8 nm, but nearly ineffective as a SERS substrate at 514.5 nm excitation. The SERS activity of mCu powders at both excitation wavelengths can be increased dramatically by a simple method of the galvanic exchange reaction with AgNO3 in aqueous medium. In this work, the SERS activity of the Ag-exchanged Cu powders (mCu@Ag) has been evaluated by taking a series of Raman spectra using benzenethiol (BT) as the probe molecule. It is clearly confirmed by field emission scanning electron microscopy and X-ray diffractometry that the SERS activity of mCu@Ag powders is, in fact, highly dependent on the extent of galvanic reaction.

• Journal of Advanced Marine Engineering and Technology
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• v.26 no.1
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• pp.99-107
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• 2002

Recently all kinds of structural materials are subjected to the severe corrosive environment. Especially corrosion problems of heat exchanger such as galvanic corrosion, erosion and cavitation raised by both contaminated solution and high velocity of fluid to increase cooling effect of heat exchanger have been frequently reported in these days. In this study two kinds of sheet materials and five kinds of tube materials are used for galvanic corrosion characteristics and their corrosion current density calculation. The tube materials having the most galvanic corrosion resistance between tube and sheet of heat exchanger were Al Brass(68700) and Al Brass(C6872TS) and although Ti tube predominantly indicated the highest individual corrosion resistance among those five tube materials. it appeared that Ti tube can be allowed as sheet materials to get galvanic corrosion easily. However it is considered that Cu-Ni tube materials is not only easy to produce galvanic corrosion significantly between tube and sheet regardless of kinds of sheet materials but also is appeared considerably its own high corrosion current density

• Journal of the Korean institute of surface engineering
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• v.48 no.5
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• pp.227-232
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• 2015

Corrosion characteristic of the duplex Al-Mg-Si alloys with low, commercial and high solute contents were studied using an anodic polarization test in 1M NaCl solution at room temperature. Polarization range condition of the experiment were form .0.3V to .1.3V with a 0.2 mV scanning speed. The exchange current density means corrosion rate of the low solute alloy was low as about $16.29{\mu}A/cm^2$, and that of the high solute alloy was high as $84.92{\mu}A/cm^2$. The difference was mainly attributed to the inter-granular precipitates $Mg_2Si$ and Si which could make a galvanic corrosion on the aluminum base. The amount of precipitates was greater in high solute alloy at mainly in grain boundary. While, the extruded alloys had better corrosion resistance than the cast alloy because the silicon precipitates become coarse during the extrusion process.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.27-33
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• 2008

With increasing use of portable appliances such as PDA and cellular phone, changing environment of applications requires higher solder joint reliability. The ENIG (Electroless Nickel Immersion Gold) process has been widely used for fine pitch SMT (Surface Mount Technology) and BGA (Ball Grid Array) packaged devices due to its benefits including excellent solderability, high uniformity and substantial legibility throughout the packaging process. Its brittle fracture of solder, however, has received increasingly attentions. It was Down that fracture brittleness is mainly related with black pad resulting from galvanic nickel corrosion and P-enriched layer formation between the IMC (Intermetallic Compounds) and electroless nickel layer. Theoretically, smooth electroless Ni layer was blown to have a advantages in minimizing the black pad phenomenon by uniform solution exchange during immersion gold plating. Nevertheless, how to control the surface morphology of electroless Ni layer has been hardly blown. This study investigates an effect of surface morphology of Cu underlayer on surface morphology of electroless Ni layer. To obtain various kinds of surface morphology of Cu layer, two types of Cu etching chemical and a number of Cu etching treatment were applied.

• Journal of the Korean Institute of Gas
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• v.5 no.3 s.15
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• pp.45-50
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• 2001

Open rack vaporizer (ORV) has been used in liquefied natural gas (LNG) receiving terminal in order to vaporize LNG into natural gas (NG) by heat exchange with seawater The U-type ORV which had been operated with seawater for 14 years is one of the important utilities of the gas production and the weld part of tube connected with header_ pipe had experienced many corrosion problems. To elucidate the cause of corrosion at weld part of vaporizer tube, corrosion potentials were compared by parts. This study concerns on the measurement of corrosion pit depth using non-destructive method and the evaluation of stress distribution in an aspect of safety with finite element analysis. In order to confirm the reliability of galvanic corrosion between weld parts and base metal, the measurement of corrosion potential by parts was conducted for 20 minutes in 3.5$\%$(wt.) NaCl solution. Many non-destructive methods were tried to measure the remaining thickness of vaporizer tube at fields. For general corrosion, tangential radiography test was confirmed as an effective method. In case of a fine corrosion pit, the shape of corrosion pit was reproduced using surface replication method. From collected data, stress distributions were quantitatively evaluated with 2-dimensional finite element method and the diagnostic evaluation on internal pressure of the U-type vaporizer could be made.