• Title/Summary/Keyword: GDDR5

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Matrix type CRC and XOR/XNOR for high-speed operation in DDR4 and GDDR5 (DDR4/GDDR5에서 고속동작을 위한 matrix형 CRC 및 XOR/XNOR)

  • Lee, JoongHo
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.8
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    • pp.136-142
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    • 2013
  • CRC features have been added to increase the reliability of the data in memory products for high-speed operation, such as DDR4. High-speed memory products in a shortage of internal timing margin increases for the CRC calculation. Because the existing CRC requires many additional circuit area and delay time. In this paper, we show that the matrix-type CRC and a new XOR/XNOR gate could be improved the circuit area and delay time. Proposed matrix-type CRC can detect all odd-bit errors and can detect even number of bit errors, except for multiples of four bits. In addition, a single error in the error correction can reduce the burden of re-transmission of data between memory products and systems due to CRC errors. In addition, the additional circuit area, compared to existing methods can be improved by 57%. The proposed XOR gate which is consists of six transistors, it can reduce the area overhead of 35% compared to the existing CRC, 50% of the gate delay can be reduced.

Real-time Matrix type CRC in High-Speed SDRAM (고속 SDRAM에서 실시간 Matrix형 CRC)

  • Lee, Joong-Ho
    • Journal of IKEEE
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    • v.18 no.4
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    • pp.509-516
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    • 2014
  • CRC feature in a high-speed semiconductor memory devices such as DDR4/GDDR5 increases the data reliability. Conventional CRC method have a massive area overhead and long delay time. It leads to insufficient internal timing margins for CRC calculation. This paper, presents a CRC code method that provides error detection and a real-time matrix type CRC. If there are errors in the data, proposed method can alert to the system in a real-time manner. Compare to the conventional method(XOR 6 stage ATM-8 HEC code), the proposing method can improve the error detection circuits up to 60% and XOR stage delay by 33%. Also the real-time error detection scheme can improve the error detection speed to agerage 50% for the entire data bits(UI0~UI9).

A 5.4Gb/s Clock and Data Recovery Circuit for Graphic DRAM Interface (그래픽 DRAM 인터페이스용 5.4Gb/s 클럭 및 데이터 복원회로)

  • Kim, Young-Ran;Kim, Kyung-Ae;Lee, Seung-Jun;Park, Sung-Min
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.2
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    • pp.19-24
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    • 2007
  • With recent advancement of high-speed, multi-gigabit data transmission capabilities, serial links have been more widely adopted in industry than parallel links. Since the parallel link design forces its transmitter to transmit both the data and the clock to the receiver at the same time, it leads to hardware's intricacy during high-speed data transmission, large power consumption, and high cost. Meanwhile, the serial links allows the transmitter to transmit data only with no synchronized clock information. For the purpose, clock and data recovery circuit becomes a very crucial key block. In this paper, a 5.4Gbps half-rate bang-bang CDR is designed for the applications of high-speed graphic DRAM interface. The CDR consists of a half-rate bang-bang phase detector, a current-mirror charge-pump, a 2nd-order loop filter, and a 4-stage differential ring-type VCO. The PD automatically retimes and demultiplexes the data, generating two 2.7Gb/s sequences. The proposed circuit is realized in 66㎚ CMOS process. With input pseudo-random bit sequences (PRBS) of $2^{13}-1$, the post-layout simulations show 10psRMS clock jitter and $40ps_{p-p}$ retimed data jitter characteristics, and also the power dissipation of 80mW from a single 1.8V supply.