• 상하수도학회지
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• 제23권3호
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• pp.353-362
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• 2009

A new method and equipment for measuring the zeta potential of the external surface of hollow fiber (HF) membranes is reported. An existing commercial streaming potential analyzer in conjunction with home-made test cells was used to determine the electrokinetic surface characteristics of various HF membranes. It was shown that measurements of the external surface of HF membrane using the home-made test cells designed in this study were easy and reliable. The zeta potential values were quite accurate and reproducible. By varying the physical shape of the test cells to adjust hydrodynamics inside the test cells, several upgrade versions of home-made test cells were obtained. It was shown that the zeta potential of the external surface of HF membranes was most influenced by membrane materials as well as the way of surface modification. However, the overall surface charge of tested HF membranes were much less than that of commercial polyamide thin-film-composite (TFC) reverse osmosis (RO) membranes due to the lack of surface functional groups. For the HF membranes with the same material, the effect of pore size on the zeta potential was not significant, implying the potential of accurate zeta potential measurements for various HF membranes. The results obtained in this study are expected to be useful for better understating of electrokinetic surface characteristics of the external surface of HF membranes.

• Journal of the Optical Society of Korea
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• 제18권6호
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• pp.753-761
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• 2014

We propose a two-step UV irradiation procedure to fabricate polymer-dispersed liquid crystal (PDLC) films by lamination. During the first UV treatment, before lamination, the UV-curable monomers coated on one film substrate are solidified through photo-polymerization as the phase separation between the liquid crystals and the monomers. Introducing an adhesion-enhancement layer on the other plastic substrate and controlling the UV irradiation conditions ensure that UV-induced cross-linkable functional groups remain on the surfaces of the photo-polymerized layers. Thereby, the adhesion stability between the top and bottom films is much improved during a second (post-lamination) UV treatment by further UV-induced cross-linking at the interface. Because the adhesion-enhancement and PDLC layers prepared by the bar-coating process are solidified before lamination, the PDLC droplet distribution and the cell gap between the two plastic substrates remain uniform under the lamination pressure. This ensures that the voltage-controlled light transmittance is uniform across the entire sample.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.181-181
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• 2010

Few-walled carbon nanotubes (FWNTs)-based field emitters with long term stability are fabricated by using a spray method. Tetraethylorthosilicate (TEOS) sol as a binder was mixed with dispersed solution of FWNTs to enhance the adhesion of FWNTs on the cathode substrate. Due to the strong intermolecular interaction of TEOS to the functional groups attached on CNTs and substrate, CNTs are tightly adhered to the cathode electrode when heat treatment is performed at $150^{\circ}C$ for 1 hour, resulting in a stable electron emission of CNT emitters for long time. Excellent field emission characteristics were exhibited, with a large field enhancement factor and low turn-on voltage, comparable to those of CNT emitters fabricated by a screen printing of CNT paste. Therefore, FWNTs / TEOS hybrid films could be utilized as an alternative for the efficient and reliable field emitters.

• 한국의학물리학회:학술대회논문집
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• 한국의학물리학회 2002년도 Proceedings
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• pp.282-284
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• 2002

We have developed and used BISS as a radiation detector to verify patient dose and determine the physical characteristics of beams used in Stereotatic Radio Surgery(SRS) and Intensity Modulated Radiation Therapy(IMRT). In order to confirm the function and accuracy of our BISS, we simulate our measurements by BISS under the radiation of 6MV photons from a Varian Clinac 21EX equipped with a 60 leaf pairs MLC. For the simulation based on the Monte Carlo algorithm, which remains the most comprehensive and accurate theoretical method to verify beam profiles, we use the BEAM code. Compared with the measurements by BISS, our simulation of variously shaped phantom measurements show good agreements. Our simulation results can be used as a theoretical standard to compare and confirm measurements by BISS and other dosimeters such as ultramicro cylindrical ionization chamber(UCIC) and radiographic film.

• 한국의류학회지
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• 제25권1호
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• pp.154-161
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• 2001

We have treated polyester fabric with $CF_4,\;C_2F_6,\;SF_6\;and\;C_3F_6$ glow discharge plasmas to develop functional fabrics which preserve moisture transportation and water proofing nature. Modified properties were evaluated by water vapor permeation rate and breakthrough water pressure. The change of surface morphology was observed by SEM. Fiber interstice of the plasma treated fabric was calculated as $0.32{\mu}{\textrm}{m}$, and this value was sufficiently ideal as water repellent material. The moisture transportation of ${CF_4}-treated$ fabric was good as much as untreated fabric, and those of $C_2$F(sub)6-treated, SF(sub)6-treated fabrics were reduced by 1~3%, and that of ${C_3F_6}-treated$ fabric was reduced by 15%. The best treatment condition were 0.06 torr 120 seconds in $CF_4$, 0.05 torr 30 seconds in $SF_6$, 0.08~0.15 torr 90 seconds in $SF_6$ and 0.1 torr 45 seconds in $C_3F_6$ respectively. The grade of moisture transportation effect was $CF_4>C_2F_6>SF_6>>C_3F_6$, and water proofing effect was $C_2F_6{\approx}CF_4>C_3F_6>SF_6$. It was observed by SEM that the thin film was formed on the surface of the treated substrate by the fluorocarbon plasma treatment.

• Journal of Welding and Joining
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• 제32권3호
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• 대한기계학회논문집 C: 기술과 교육
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• 제1권2호
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• pp.187-192
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• 2013

노즐을 이용한 인쇄 기법은 주로 전자 소자의 봉지를 위한 접착제의 인쇄분야에 적용되어 왔다. 노즐 인쇄를 통한 기능성 물질의 필름 형성은 커다란 도전이 될 수 있다. 본 논문에서는 노즐을 이용한 유기 잉크의 인쇄 특성을 실험을 통하여 알아보았다. 본 연구의 노즐 인쇄 실험에서 패턴을 형성하기 위한 잉크는 유기 발광 물질인 TAPC를 사용하였다. 인쇄된 패턴 폭은 잉크 공급 유량의 증가와 기판의 온도의 상승에 따라 증가하였다. 또한 인쇄된 패턴은 건조 후 커피링 형상을 나타내었다.

• 감성과학
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• 제18권2호
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• pp.55-64
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• 2015

The aim of the study was to investigate the neural substrates associated with processing anger among young males with alcohol use disorders (AUDs) using functional magnetic resonance imaging (fMRI). Eighteen individuals with AUD and 15 demographically similar non-abusers participated in the study. Participants were scanned on their brain functioning while they viewed an audio-visual film clip that was previously designed specifically to induce anger emotion, followed by anpsychological assessment. Greater brain activities were detected in the left inferior frontal gyrus (IFG) and dorsal anterior cingulate cortex (dACC) among subjects with AUD compared to the controls during the exposure to anger-provoking stimuli. Despite the same level of subjective anger during anger induction, the greater activations both in the IFG and dACC regions may suggestthat individuals with AUD have a greater propensity to undergo cognitive control and self-regulation while experiencing anger.

• 한국정밀공학회지
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• 제28권10호
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• pp.1153-1158
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• 2011

Roll-to-roll process is an emerging mass production method for printed and flexible electronics such as touch screen panel, RFID tag, thin film solar cell, and flexible display due to its high throughput. High precision in printing and coating is required to apply functional materials onto substrate. For such reason, every part of the roll-to-roll equipment needs to be precisely fabricated and to retain its precision under regular operation. In this article, the precision of cantilever type idler roller and a novel method to mitigate its deflection under web tension loading are discussed and the method is verified using both the numerical and the experimental works. The proposed method improves the structural rigidity of cantilever type roller whose advantages, such as low capital cost and high web path configurability, are maintained.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.287-287
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• 2010

We report a new direct patterning method, called liquid bridge-mediated nanotransfer molding (LB-nTM), for the formation of two- or three-dimensional structures with feature sizes between tens of nanometers and tens of micron over large areas. LB-nTM is based on the direct transfer of various materials from a mold to a substrate via a liquid bridge between them. This procedure can be adopted for automated direct printing machines that generate patterns of functional materials with a wide range of feature sizes on diverse substrates. Arrays of TIPS-PEN TFTs were fabricated on 4" polyethersulfone (PES) substrates by LB-nTM using PDMS molds. An inverted staggered structure was employed in the TFT device fabrication. A 150 nm-thick indium-tin oxide (ITO) gate electrode and a 200 nm-thick SiO2dielectric layer were formed on a PES substrate by sputter deposition. An array of TIPS-PEN patterns (thickness: 60 nm) as active channel layers was fabricated on the substrate by LB-nTM. The nominal channel length of the TIPS-PEN TFT was 10 mm, while the channel width was 135 mm. Finally, the source and drain electrodes of 200 nm-thick Ag were defined on the substrate by LB-nTM. The TIPS-PEN TFTs can endure strenuous bending and are also transparent in the visible range, and therefore potentially useful for flexible and invisible electronics.