• Title/Summary/Keyword: Functional film

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Measurements and methods for analyzing zeta potential of the external surface of hollow fiber membranes (중공사막 외부표면의 제타전위 측정방법 고찰)

  • Lee, Taeseop;Lee, Sangyoup;Lee, Joohee;Hong, Seungkwan
    • Journal of Korean Society of Water and Wastewater
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    • v.23 no.3
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    • pp.353-362
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    • 2009
  • A new method and equipment for measuring the zeta potential of the external surface of hollow fiber (HF) membranes is reported. An existing commercial streaming potential analyzer in conjunction with home-made test cells was used to determine the electrokinetic surface characteristics of various HF membranes. It was shown that measurements of the external surface of HF membrane using the home-made test cells designed in this study were easy and reliable. The zeta potential values were quite accurate and reproducible. By varying the physical shape of the test cells to adjust hydrodynamics inside the test cells, several upgrade versions of home-made test cells were obtained. It was shown that the zeta potential of the external surface of HF membranes was most influenced by membrane materials as well as the way of surface modification. However, the overall surface charge of tested HF membranes were much less than that of commercial polyamide thin-film-composite (TFC) reverse osmosis (RO) membranes due to the lack of surface functional groups. For the HF membranes with the same material, the effect of pore size on the zeta potential was not significant, implying the potential of accurate zeta potential measurements for various HF membranes. The results obtained in this study are expected to be useful for better understating of electrokinetic surface characteristics of the external surface of HF membranes.

Enhanced Adhesion and Transmittance Uniformity in Laminated Polymer-Dispersed Liquid Crystal Films

  • Yoo, Seong-Hyeon;Park, Min-Kyu;Park, Ji-Sub;Kim, Hak-Rin
    • Journal of the Optical Society of Korea
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    • v.18 no.6
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    • pp.753-761
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    • 2014
  • We propose a two-step UV irradiation procedure to fabricate polymer-dispersed liquid crystal (PDLC) films by lamination. During the first UV treatment, before lamination, the UV-curable monomers coated on one film substrate are solidified through photo-polymerization as the phase separation between the liquid crystals and the monomers. Introducing an adhesion-enhancement layer on the other plastic substrate and controlling the UV irradiation conditions ensure that UV-induced cross-linkable functional groups remain on the surfaces of the photo-polymerized layers. Thereby, the adhesion stability between the top and bottom films is much improved during a second (post-lamination) UV treatment by further UV-induced cross-linking at the interface. Because the adhesion-enhancement and PDLC layers prepared by the bar-coating process are solidified before lamination, the PDLC droplet distribution and the cell gap between the two plastic substrates remain uniform under the lamination pressure. This ensures that the voltage-controlled light transmittance is uniform across the entire sample.

Carbon nanotube / silane hybride film for highly efficient field emitter

  • Jeong, Hae-Deuk;Kim, Ho-Young;Jeong, Hee-Jin;Han, Joong-Tark;Lee, Geon-Woong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.181-181
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    • 2010
  • Few-walled carbon nanotubes (FWNTs)-based field emitters with long term stability are fabricated by using a spray method. Tetraethylorthosilicate (TEOS) sol as a binder was mixed with dispersed solution of FWNTs to enhance the adhesion of FWNTs on the cathode substrate. Due to the strong intermolecular interaction of TEOS to the functional groups attached on CNTs and substrate, CNTs are tightly adhered to the cathode electrode when heat treatment is performed at $150^{\circ}C$ for 1 hour, resulting in a stable electron emission of CNT emitters for long time. Excellent field emission characteristics were exhibited, with a large field enhancement factor and low turn-on voltage, comparable to those of CNT emitters fabricated by a screen printing of CNT paste. Therefore, FWNTs / TEOS hybrid films could be utilized as an alternative for the efficient and reliable field emitters.

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Monte Carlo Simulation of Small Photon Beam Measurements by Beam Intensity Scanner System(BISS)

  • Park, Kwangyl;Vahc, Young-Woo;Ohyun Kwon;Park, Kyung-Ran;Lee, Yong-Ha;Yi, Byung-Yong;Kim, Sookil
    • Proceedings of the Korean Society of Medical Physics Conference
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    • 2002.09a
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    • pp.282-284
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    • 2002
  • We have developed and used BISS as a radiation detector to verify patient dose and determine the physical characteristics of beams used in Stereotatic Radio Surgery(SRS) and Intensity Modulated Radiation Therapy(IMRT). In order to confirm the function and accuracy of our BISS, we simulate our measurements by BISS under the radiation of 6MV photons from a Varian Clinac 21EX equipped with a 60 leaf pairs MLC. For the simulation based on the Monte Carlo algorithm, which remains the most comprehensive and accurate theoretical method to verify beam profiles, we use the BEAM code. Compared with the measurements by BISS, our simulation of variously shaped phantom measurements show good agreements. Our simulation results can be used as a theoretical standard to compare and confirm measurements by BISS and other dosimeters such as ultramicro cylindrical ionization chamber(UCIC) and radiographic film.

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Water Repellent Finish of Polyester Fabric Using Glow Discharge Treatment (글로우방전을 이용한 폴리에스테르 직물의 투습방수성 개질)

  • 김태년
    • Journal of the Korean Society of Clothing and Textiles
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    • v.25 no.1
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    • pp.154-161
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    • 2001
  • We have treated polyester fabric with $CF_4,\;C_2F_6,\;SF_6\;and\;C_3F_6$ glow discharge plasmas to develop functional fabrics which preserve moisture transportation and water proofing nature. Modified properties were evaluated by water vapor permeation rate and breakthrough water pressure. The change of surface morphology was observed by SEM. Fiber interstice of the plasma treated fabric was calculated as $0.32{\mu}{\textrm}{m}$, and this value was sufficiently ideal as water repellent material. The moisture transportation of ${CF_4}-treated$ fabric was good as much as untreated fabric, and those of $C_2$F(sub)6-treated, SF(sub)6-treated fabrics were reduced by 1~3%, and that of ${C_3F_6}-treated$ fabric was reduced by 15%. The best treatment condition were 0.06 torr 120 seconds in $CF_4$, 0.05 torr 30 seconds in $SF_6$, 0.08~0.15 torr 90 seconds in $SF_6$ and 0.1 torr 45 seconds in $C_3F_6$ respectively. The grade of moisture transportation effect was $CF_4>C_2F_6>SF_6>>C_3F_6$, and water proofing effect was $C_2F_6{\approx}CF_4>C_3F_6>SF_6$. It was observed by SEM that the thin film was formed on the surface of the treated substrate by the fluorocarbon plasma treatment.

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TSV Filling Technology using Cu Electrodeposition (Cu 전해도금을 이용한 TSV 충전 기술)

  • Kee, Se-Ho;Shin, Ji-Oh;Jung, Il-Ho;Kim, Won-Joong;Jung, Jae-Pil
    • Journal of Welding and Joining
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    • v.32 no.3
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    • pp.11-18
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    • 2014
  • TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

A Study on Solution Processed Organic Ink by Nozzle Printing Technique (노즐 인쇄기법을 이용한 유기 잉크 용액 공정 연구)

  • Kim, Myong-Ki;Lee, Jungmin;Sung, Dug-Hyung;Kim, Ju-Tae;Kang, Kyungtae
    • Transactions of the KSME C: Technology and Education
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    • v.1 no.2
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    • pp.187-192
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    • 2013
  • Nozzle printing technology has been usually used for adhesive patterning to encapsulate electronic devices. Film formation of functional materials by nozzle printing is a great challenge. The characteristics of nozzle printing of organic ink were investigated systematically in this paper. TAPC as an organic emitting material was used as an ink for nozzle printing experiment to form the patterns in this study. Printed pattern width was increased as the ink flow rate and the printed substrate temperature were increased. The patterns showed a coffee-ring shape.

Altered patterns of brain activity during transient anger among young males with alcohol use disorders: A preliminary study

  • Park, Mi-Sook;Sohn, Sunju;Seok, Ji-Woo;Kim, Eun-Hye;Sohn, Jin-Hun
    • Science of Emotion and Sensibility
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    • v.18 no.2
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    • pp.55-64
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    • 2015
  • The aim of the study was to investigate the neural substrates associated with processing anger among young males with alcohol use disorders (AUDs) using functional magnetic resonance imaging (fMRI). Eighteen individuals with AUD and 15 demographically similar non-abusers participated in the study. Participants were scanned on their brain functioning while they viewed an audio-visual film clip that was previously designed specifically to induce anger emotion, followed by anpsychological assessment. Greater brain activities were detected in the left inferior frontal gyrus (IFG) and dorsal anterior cingulate cortex (dACC) among subjects with AUD compared to the controls during the exposure to anger-provoking stimuli. Despite the same level of subjective anger during anger induction, the greater activations both in the IFG and dACC regions may suggestthat individuals with AUD have a greater propensity to undergo cognitive control and self-regulation while experiencing anger.

Cantilever Type Idler Roller in Roll-to-roll Process for Printed Electronics (인쇄전자용 롤투롤 공정의 외팔보 형식 아이들 롤러)

  • Yoon, Deok-Kyun;Lee, Seung-Hyun;Kang, Jeong-Sik;Cho, Byung-Oh
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.10
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    • pp.1153-1158
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    • 2011
  • Roll-to-roll process is an emerging mass production method for printed and flexible electronics such as touch screen panel, RFID tag, thin film solar cell, and flexible display due to its high throughput. High precision in printing and coating is required to apply functional materials onto substrate. For such reason, every part of the roll-to-roll equipment needs to be precisely fabricated and to retain its precision under regular operation. In this article, the precision of cantilever type idler roller and a novel method to mitigate its deflection under web tension loading are discussed and the method is verified using both the numerical and the experimental works. The proposed method improves the structural rigidity of cantilever type roller whose advantages, such as low capital cost and high web path configurability, are maintained.

Organic Thin-Film Transistors Fabricated on Flexible Substrate by Using Nanotransfer Molding

  • Hwang, Jae-Kwon;Dang, Jeong-Mi;Sung, Myung-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.287-287
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    • 2010
  • We report a new direct patterning method, called liquid bridge-mediated nanotransfer molding (LB-nTM), for the formation of two- or three-dimensional structures with feature sizes between tens of nanometers and tens of micron over large areas. LB-nTM is based on the direct transfer of various materials from a mold to a substrate via a liquid bridge between them. This procedure can be adopted for automated direct printing machines that generate patterns of functional materials with a wide range of feature sizes on diverse substrates. Arrays of TIPS-PEN TFTs were fabricated on 4" polyethersulfone (PES) substrates by LB-nTM using PDMS molds. An inverted staggered structure was employed in the TFT device fabrication. A 150 nm-thick indium-tin oxide (ITO) gate electrode and a 200 nm-thick SiO2dielectric layer were formed on a PES substrate by sputter deposition. An array of TIPS-PEN patterns (thickness: 60 nm) as active channel layers was fabricated on the substrate by LB-nTM. The nominal channel length of the TIPS-PEN TFT was 10 mm, while the channel width was 135 mm. Finally, the source and drain electrodes of 200 nm-thick Ag were defined on the substrate by LB-nTM. The TIPS-PEN TFTs can endure strenuous bending and are also transparent in the visible range, and therefore potentially useful for flexible and invisible electronics.

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