• Tribology and Lubricants
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• v.36 no.1
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• pp.39-46
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• 2020

Air stages are usually applied to precision engineering in sectors such as the semiconductor industry owing to their excellent performance and extremely low friction. Since the productivity of a semiconductor depends on the acceleration and deceleration performance of the air stage, many attempts have been made to improve the speed of the stage. Even during sudden start or stop sequences, the stage should maintain an air film to avoid direct contact between pad and the rail. The purpose of this study is to quantitatively predict the dynamic behavior of the air stage when acceleration and deceleration occur. The air stage is composed of two parts; the stage and the guide-way. The stage transports objects to the guideway, which is supported by an externally pressurized gas bearing. In this study, we use COMSOL Multiphysics to calculate the pressure of the air film between the stage and the guide-way and solve the two-degree-of-freedom equations of motion of the stage. Based on the specified velocity conditions such as the acceleration time and the maximum velocity of stage, we calculate the eccentricity and tilting angle of the stage. The result shows that the stiffness and damping of the gas bearing have non-linear characteristics. Hence, we should consider the operating conditions in the design process of an air stage system because the dynamic behavior of the stage becomes unstable depending on the maximum velocity and the acceleration time.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.46 no.2
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• pp.124-132
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• 2018

In this paper, landing stability evaluation of lunar lander considering various landing conditions was performed. The status of landing stability of the lunar lander is classified into stable landing, conditionally stable landing due to sliding and unstable landing due to tip-over. In particular, the quasi-static tip-over equation was rearranged considering the phenomena of lowering the center of gravity and extension of foot-pad interval of the landing gear. These results were compared by finite element model analysis results using a commercial software ABAQUS and its validity and accuracy were verified. The verified finite element model was used for examining the tendency of various environmental variables such as landing conditions, friction coefficient, lateral speed and slope of ground.

• Tribology and Lubricants
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• v.35 no.6
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• pp.376-381
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• 2019

Surface texturing is widely applied to reduce friction and improve the reliability of machine elements. Despite extensive theoretical studies to date, most research has been limited to parallel thrust bearings, mechanical face seals, piston rings, etc. However, most sliding bearings have a convergent film shape in the sliding direction and the hydrodynamic pressure is mainly generated by the wedge action. The results of surface texturing on inclined slider bearings are largely insufficient. This paper is the first part of a recent study focusing on the effect of the groove position on the lubrication performances of inclined slider bearings. We model a slider bearing with one rectangular groove on a fixed pad and analyze the continuity and Navier-Stokes equations using a commercial computational fluid dynamics (CFD) code, FLUENT. The results show that the film convergence ratio and the groove position have a significant influence on the pressure and velocity distributions. There are groove positions to maximize the supporting load with the film convergence ratio and the groove reduces the frictional force acting on the slider. Therefore, the proper groove position not only improves the load-carrying capacity of the slider bearings but also reduces its frictional loss. The present results apply to various surface-textured sliding bearings and can lead to further studies.

• Design & Manufacturing
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• v.11 no.2
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• pp.37-41
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• 2017

With light vehicle weight gradually becoming ever more importance due to tightened exhaust gas regulations, hot-stamping processing using boron alloyed steel is being applied more and more by major automobile OEMs since process assures both moldability and a high strength of 1.5 GPa. Although laser trimming is generally applied to the post-processing of the hot-stamped process with high strength, there have been many studies of in-die hot trimming using shear dies during the quenching of material in order to shorten processing times. As such, this study investigated the effects of the Shear rate and Shear mechanism on shear processes during the quenching process of hot-stamping material. In case of pad variable, padding force is very weak compared with shear force, so it does not affect the shear surface. In case of shear rate, the higher the shear at high temperatures and the higher the friction effect. As a result the rollover and the fracture distribution decreased, and the burnish distribution increased. Therefore, it is considered that the shear quality is guaranteed when high shear rate is applied in high temperature shear process.

• Tribology and Lubricants
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• v.35 no.5
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.