• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.1
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• pp.32-37
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• 2014

Open-cell silicon foam is difficult to cut using conventional machining processes because of its low stiffness. That is, open-cell silicon foam is easily pressed down when the tool is engaged, which makes it difficult to remove the material in the form of chip. This study proposes an advanced method of machining open-cell silicon foam by freezing the material using liquid nitrogen. Furthermore, the machining conditions are optimized to maximize the efficiency of material removal and minimize the usage of liquid nitrogen by conducting experiments under various machining conditions. The results show that open-cell silicone foam products with free surface can be successfully machined by employing the proposed method.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.278-278
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• 2011

수소 중성입자빔을 이용한 silicon etching은 기존의 silicon etching 공정 가스(Fluorine이나 Chlorine 계열의 가스) 사용 시 배출되는 유해 가스로 인한 지구 온난화 방지 및 폐기물 처리에 추가적인 비용이 발생하지 않는 친환경 etching 공정이다. 본 연구에 사용된 수소 중성입자빔을 발생시키기 위한 플라즈마 소스는 낮은 압력에서 높은 플라즈마 밀도를 발생시킬 수 있는 ECR 플라즈마 소스를 사용하였으며 중성입자빔의 에너지를 조절할 수 있는 중성화판과 플라즈마로부터의 전하손상을 방지할 수 있어 charge free 공정을 가능하게 하는 Limiter로 구성되어 있다. 본 연구에서는 플라즈마 밀도, 공정 압력 그리고, 중성입자빔의 에너지를 조절하여 수소 중성입자빔을 이용한 poly-crystal silicon과 a-Si:H 간의 etch rate와 etching selectivity를 관찰하였다.

• Proceeding of EDISON Challenge
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• 2014.03a
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• pp.485-487
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• 2014

Nitrogen이 도핑된 graphene에서의 hydrogen evolution에 대한 촉매효과에 대해서 연구를 진행하였다. Reaction free energy를 계산하기 위해서 많은 N-doped graphene 모델을 계산하였으며 pH 조건, silicon cathode의 영향 그리고 zero point energy의 효과를 고려하였다. Volcano plot에 의하면 "pyrol" like model과 N-doped armchair graphene model (aGNR-N1)이 좋은 촉매효과를 가짐을 밝혔다. 또한 free energy diagram을 통하여 "pyrol"과 "aGNR-N1"이 좋은 active site가 될 수 있음을 확인하였고 pH가 증가함에 따라 $H^+$의 에너지가 증가함에 따라 촉매 효과가 줄어듬을 확인하였다.

• Bulletin of the Korean Chemical Society
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• v.33 no.9
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• pp.3025-3032
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• 2012

Carbon microcapsules containing silicon nanoparticles (Si NPs)-carbon nanotubes (CNTs) nanocomposite (Si-CNT@C) have been fabricated by a two step polymerization method. Silicon nanoparticles-carbon nanotubes (Si-CNT) nanohybrids were prepared with a wet-type beadsmill method. A polymer, which is easily removable by a thermal treatment (intermediate polymer) was polymerized on the outer surfaces of Si-CNT nanocomposites. Subsequently, another polymer, which can be carbonized by thermal heating (carbon precursor polymer) was incorporated onto the surfaces of pre-existing polymer layer. In this way, polymer precursor spheres containing Si-CNT nanohybrids were produced using a two step polymerization. The intermediate polymer must disappear during carbonization resulting in the formation of an internal free space. The carbon precursor polymer should transform to carbon shell to encapsulate remaining Si-CNT nanocomposites. Therefore, hollow carbon microcapsules containing Si-CNT nanocomposites could be obtained (Si-CNT@C). The successful fabrication was confirmed by scanning electron microscopy (SEM) and X-ray diffraction (XRD). These final materials were employed for anode performance improvement in lithium ion battery. The cyclic performances of these Si-CNT@C microcapsules were measured with a lithium battery half cell tests.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.4 no.1
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• pp.121-131
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• 2000

Melt flow, heat and mass transfer of oxygen have been analyzed numerically in the process of Czochralski single crystal growth of silicon under the influence of misaligned cusp magnetic fields. Since the silicon melt in a crucible for crystal growth is of high temperature and of highly electrical-conducting, experimentation method has difficulty in analyzing the behavior of the melt flow. A set of simultaneous nonlinear equations including Navier-Stokes and Maxwell equations has been used for the modelling of the melt flow which can be regarded as a liquid metal. Together with the melt flow which forms the Marangoni convection, a flow circulation is observed near the comer close both to the crucible wall and the free surface. The melt flow tends to follow the magnetic lines instead of traversing the lines. These flow characteristics helps the flow circulation exist. Mass transfer characteristics influenced by the melt flow has been analyzed and the oxygen absorption rate to the crystal has been calculated and turned out to be rather uniform than in the case of an aligned magnetic field.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.171-171
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• 2012

Neutral beam assisted chemical vapor deposition (NBa-CVD) process has been developed as a nove,l room temperature deposition process for the light-soaking free nano-crystalline silicon (nc-Si) thin films including intrinsic and n-type doped thin film. During formation of nc-Si thin films by the NBa-CVD process with silicon reflector at room temperature, the energetic particles enhance doping efficiency and crystalline phase in nc-Si thin films without additional heating at substrate. The effects of incident NB energy controlled by the reflector bias have been confirmed by Raman spectra analysis. Additionally, TEM images show uniform nc-Si grains which imbedded amorphous phase without incubation layer. The nc-Si films by the NBa-CVD are hardly degenerated by light soaking; the degradations of photoconductivity were just a few percents before and after light irradiation.

• Bulletin of the Korean Chemical Society
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• v.34 no.11
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• pp.3451-3455
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• 2013

Single-crystalline silicon nanowires (SiNWs) were fabricated by using an electroless metal-assisted etching of bulk silicon wafers with silver nanoparticles obtained by wet electroless deposition. The etching of SiNWs is based on sequential treatment in aqueous solutions of silver nitrate followed by hydrofluoric acid and hydrogen peroxide. SEM observation shows that well-aligned nanowire arrays perpendicular to the surface of the Si substrate were produced. Free-standing SiNWs were then obtained using ultrasono-method in toluene. Alkyl-derivatized SiNWs were prepared to prevent the aggregation of SiNWs and obtained from the reaction of SiNWs and dodecene via hydrosilylation. Optical characterizations of SiNWs were achieved by FT-IR spectroscopy and indicated that the surface of SiNWs is terminated with hydrogen for fresh SiNWs and with dodecyl group for dodecyl-derivatized SiNWs, respectively. The main structures of dodecyl-derivatized SiNWs are wires and rods and their thicknesses of rods and wire are typically 150-250 and 10-20 nm, respectively. The morphology and chemical state of dodecyl-derivatized SiNWs are characterized by scanning electron microscopy, transmission electron microscopy, and X-ray photoelectron spectroscopy.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Korean Journal of Optics and Photonics
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• v.16 no.2
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• pp.113-120
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• 2005

Luminous efficiency and uniformity in a LCD-BLU are mainly determined by fine scattering patterns formed on the light guide panel. We propose a novel fabrication method of 3-dimensional scattered patterns based on anisotropic etching of silicon wafers. Micro-pyramid patterns with 70.5 degree apex-angle and micro-prism patterns with 109.4 degree apex-angle can be self-constructed by the wet, anisotropic etching of (100) and (110) silicon wafers, respectively, and those patterns are easily duplicated by the PDMS replica process. Experimental results on spatial and angular distributions of irradiation from the light guide panel with the micro-pyramid patterns were very consistent with the calculation results. Surface roughness of the silicon-based micro-patterns is free from any artificial defects since the micro-patterns are inherently formed with silicon crystal surfaces. Therefore, we expect that the silicon based micro-patterning process makes it possible to fabricate perfect 3-dimensional micro-structures with crystal surface and apex angles, which may guarantee mass-reproduction of the light guide panels in LCD-BLU.

• Current Photovoltaic Research
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• v.5 no.2
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• pp.59-62
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• 2017

Surface texturing is affected the uniformity and size of pyramid with saw mark defect density. To analysis the influence of the saw mark defect density, we textured various si wafer. When the texturing process proceeds without the saw mark removal, silicon wafer of low-saw mark defect density showed small pyramid size of $3.5{\mu}m$ with the lowest average value of the reflectance of 10.6%. When texturing carried out after removal of the saw mark using the TMAH solution, we obtained a reflectance of about 11% and the large pyramid size of $5{\mu}m$. As a result, saw mark wafers showed a better pyramid structure than saw mark-free wafer. This result showed that saw mark can take place more smooth etching by the KOH solution and saw mark-free wafer is determined to be a factor that have a higher reflectance and a large pyramid.