• 한국광학회지
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• 제10권1호
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• pp.80-86
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• 1999

비등상성 반도체 양자우물에서의 자유전자 흡수에 의한 광자의 흡수계수를 모델링하였다. Intravalley scattering과 interalley scattering에 의한 자유전자 흡수가 모두 고려되었고 양자우물내의 각각의 부밴드가 광자의 흡수에 기여하는 정도도 따로 계산되었다. 또한 이 모델의 타당성을 검증하기 위해, Si에 $\delta$-도핑을 이용하여 형성한 얀자우물에 대하여 시물레이션을 수행하고 문헌의 실현결과와 비교하여 그 적절성을 보였다.

• 폴리머
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• 제37권3호
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• pp.373-378
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• 2013

폴리카보네이트(PC) 필름을 유연기판으로 사용하기 위해서는 $SiO_x$ 증착에 의한 베리어 특성 개선이 필요하며 이때 베리어 층과 PC 계면 접착력이 매우 중요하다. 본 연구에서는 언더 코팅, UV/$O_3$ 및 저온 플라즈마와 같은 다양한 표면 처리 방법에 의하여 PC 필름 표면을 개질하여 표면의 물리적 화학적 변화가 증착된 베리어 층 계면 접착력에 미치는 영향을 살펴보았다. 표면 처리 전의 PC 필름은 표면 거칠기 및 표면 에너지가 매우 낮아 $SiO_x$ 베리어 층과의 접착력이 현저히 떨어짐을 알 수 있었다. PC 필름을 저온 플라즈마로 표면 처리한 결과, 표면의 거칠기 증가와 극성 관능기 생성에 의하여 극성 표면 에너지가 향상되는 반면 UV/$O_3$ 처리의 경우, 표면 거칠기 변화 없이 표면에 생성된 극성 관능기에 의해 극성 표면 에너지가 증가됨을 알 수 있었다. 이러한 표면의 변화는 베리어층과 PC 기판의 계면 접착력 증가에 기여함을 알 수 있었다. 표면 처리 방법으로 언더 코팅을 사용하는 경우 표면에 에너지를 가하지 않아도 코팅제의 아크릴산과 $SiO_x$의 접착력 향상에 의하여 PC 필름과의 계면 접착력이 증가되며 유무기 하이브리드 다층 구조에 의한 베리어 특성 개선이 함께 일어남을 알 수 있었다.

• 한국세라믹학회지
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• 제52권1호
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• pp.61-65
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• 2015

The effect of Sr addition on the flexural strength of bulk SiOC ceramics was investigated in polymer-derived SiOC ceramics prepared by conventional hot pressing. Crack-free, dense SiOC discs with a 30 mm diameter were successfully fabricated from commercially available polysiloxane with 1 mol% strontium isopropoxide derived Sr as an additive. Agglomerates formed after the pyrolysis of polysiloxane led to the formation of domain-like structures. The flexural strength of bulk SiOC was strongly dependent on the domain size formed and Sr addition. Both the minimization of the agglomerate size in the starting powders by milling after pyrolysis and the addition of Sr, which reinforces the SiOC structure, are efficient ways to improve the flexural strength of bulk SiOC ceramics. The typical flexural strength of bulk Sr-doped SiOC ceramics fabricated from submicron-sized SiOC powders was ~209 MPa.

• 한국재료학회지
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• 제7권2호
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• pp.145-151
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• 1997

AI-xSi/ySiC( x:6~18wt%, y: 3~9wt%, SiC 입자크기: $10~28{\mu}m$) 복합재료를 재용해한 후 항온 유지하고 응고 시킬때 SiC 입자가 몰드의 하부로 침강하는 현상을 계통적으로 조사하였다. AI-Si/SiC 복합재료 용탕을 항온으로 유지하면 입자가 없는 지역은 유지시간이 약 처음 30분 동안 빠르게 증가한다. SiC 입자가 크기가 클수록 SiC입자의 크기가 클수록 SiC입자의 침강속도가 빠르다. 또한 복합재료중 철가한 SiC 입자의 부피분율이 증가하면 입자의 침강속도는 감소한다.

• 반도체디스플레이기술학회지
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• 제7권4호
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• pp.41-44
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• 2008

NiSi is less stable than the previously-used $CoSi_2$ at high temperature. Some noble metals, such as Pd and Pt, have been added to NiSi to improve its thermal stability. We employed a first principles calculation to understand the Pd segregation at the interface. An orthorhombic structure of NiSi was used to construct an orthorhombic-NiSi/Si (010). Lattice parameters along a- and c-axes in orthorhombic-NiSi were matched with those of Si for epitaxy contact. The optimized $1\times4\times1$ orthorhombic-NiSi (010) and $1\times2\times1$ Si (010) superstructures were put together to construct the orthorhombic-NiSi/Si (010), and the superstructure was relieved in calculation to minimize its total free energy. The optimized interface thickness of the superstructure was $1.59\AA$. Pd atom was substituted in Ni and Si sites located near interface. Both Ni and Si sites located at the interface were favorable for Pd substitution.

• 한국세라믹학회지
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• 제49권4호
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• pp.363-368
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• 2012

Nitriding and post-sintering behavior of powder mixture compacts were investigated. As mixture compacts are different from simple Si compacts, the fabrication of a sintered body with a mixture composition has engineering implications. In this research, in specimens without a pore former, the extent of nitridation increased with $Si_3N_4$ content, while the highest extent of nitridation was measured in $Si_3N_4$-free composition when a pore former was added. Large pores made from the thermal decomposition of the pore former collapsed, and they were filled with a reaction product, reaction-bonded silicon nitride (RBSN) in the $Si_3N_4$-free specimen. On the other hand, pores from the decomposed pore former were retained in the $Si_3N_4$-added specimen. Introduction of small $Si_3N_4$ particles ($d_{50}=0.3{\mu}m$) into a powder compact consisting of large silicon particles ($d_{50}=7{\mu}m$) promoted close packing in the green body compact, and resulted in a stable strut structure after decomposition of the pore former. The local packing density of the strut structure depends on silicon to $Si_3N_4$ size ratio and affected both nitriding reaction kinetics and microstructure in the post-sintered body.

• 한국세라믹학회지
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• 제31권10호
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• pp.1169-1175
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• 1994

Five Al2O3/SiC/metal composites with four different particle sizes of green SiC abrasive grains are grown by the directed oxidation of an commercially available Al-alloy. Oxidation was conducted in air at 100$0^{\circ}C$, 96 hours long. Slip casted SiC-fillers were placed on the alloy or SiC powder deposited up to the required layer thickness. Their microstructures are described and measurements of density, elastic constants, frexural strength, fracture toughness and work of fracture are reported. The results are compared with those of commercial dense sintered Al2O3. The properties of produced materials have a strong relationship to not only the properties of Al2O3, SiC, Al and Si but also to the phase share and phase distribution. The composite materials are dense (0.5% porosity), tough (KIC = 3.4~6.4 MPa{{{{ SQRT { m} }}), strong ({{{{ sigma }}B = 170~345 MPa) and reasonably shrinkage free producible. The reinforcements is attained mainly through the plastic deformation of ductile metal phase.

• Journal of Korean Vacuum Science & Technology
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• 제2권1호
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• pp.25-31
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• 1998

The reliability of fluorine doped silicon oxide (SiOF) films for intermetal dielectrics in multilevel interconnections of ultra-large scale integrated circuits (ULSIs) is investigated. SiOF films were deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition (ECRPECVD) using H-free source gases, i.e., SiF4 and O2. The effect of post plasma treatment on the moisture absorption and dielectric properties of SiOF films was carried out I terms of air exposure time, The reliability test of Cu/TiN/SiOF/Fi specimen was carried out in terms of temperature by rapid thermal annealing (RTA) in N2 ambient. After O2 plasma treatment,, no appreciable peak directly related to moisture absorption was detected. The capacitance-voltage (C-V) characteristics of the O2 plasma treated SiOF film showed that the film remained to hold the sound dielectric properties even after boiling treatment. The Cu/TiN/SiOF/Si system was found to be reliable up to $600^{\circ}C$.

• 한국세라믹학회지
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• 제29권8호
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• pp.617-622
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• 1992

In order to study on the effect of SiC whisker in flexural strength characterization of macro defect-free (MDF) cement composites, which composed of high alumina cement and polyvinyl alcohol, microstructural characterization of the composite specimens fabricated by the addition of SiC whiskers was investigated. Microproes are created around the SiC whisker, MDF cement didn't react with the SiC whisker. However, flexural strength of the composites have been improved. Fracture morphology of the composites, presents mainly intergranular type fracture passing around the unhydrated particles and siC whiskers, and partially transgranular type fracture. The main strengthening mechanisms of the MDF cement composites reinforced with SiC whiskers are characterized by crack deflection, microcracking, and bridging of cracks.

• Bulletin of the Korean Chemical Society
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• 제18권9호
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• pp.1002-1006
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• 1997

1H NMR spectra of D2O solutions containing 2,2-dimethylaziridine (1) or 2-methylaziridine (2) and [SiW11COⅡO39]6- (SiW11Co) or [SiW11NiⅡO39]6- (SiW11Ni) exhibit separate signals for the free ligand and the complex, indicating that the ligand exchange is slow on the NMR time scale. Identified are two linkage isomers with the methyl group of 2 at trans or cis position with respect to the metal. The isotropic shifts of 1 and 2 coordinated to SiW11Ni originate mainly from the contact shifts, and they agree reasonably with the relative values reported for similar ligands coordinated to bis(2,4-pentanedionato)nickel(Ⅱ). The isotropic shifts for the SiW11Co complexes were separated into contact and pseudocontact contributions. The pseudocontact shifts show that (χ∥-χ⊥) is positive, while that for the SiW11Co complexes of pyridine derivatives is negative. This result indicates that the ordering of dxy and dxz, dyz orbitals in SiW11Co complexes can be reversed by ligands.