• 제목/요약/키워드: Free Drop

검색결과 255건 처리시간 0.027초

리플로우 횟수와 표면처리에 따른 Sn-Ag-Cu계 무연 솔더 범프의 고속전단 특성평가 (Effect of Reflow Number and Surface Finish on the High Speed Shear Properties of Sn-Ag-Cu Lead-free Solder Bump)

  • 장임남;박재현;안용식
    • 마이크로전자및패키징학회지
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    • 제16권3호
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    • pp.11-17
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    • 2009
  • 휴대폰 및 휴대기기의 낙하 충격에 대한 관심이 증가되고 있는 상황에서 솔더 볼 접합부의 낙하 충격특성은 패드의 종류와 리플로우 횟수에 영향을 받게 되어 이에 따른 신뢰성 평가가 요구된다. 이와 관련한 평 가법으로 일반적으로는 JEDEC에서 제정한 낙하충격 시험법을 사용하고 있으나 이 방법은 고 비용과 장시간이 소모되는 문제가 있어 본 연구에서는 낙하충격 특성을 간접적으로 평가하는 시험항목인 고속 전단시험을 실시하여 리플로우 횟수에 의해 성장하는 금속간 화합물 층과 OSP(Organic Solderability Preservative), ENIG(Electroless Nickel Immersion Gold) 및 ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 등 표면처리에 따른 고속 전단특성을 비교, 분석하였다. 그 결과 리플로우 횟수가 증가함에 따라 IMC 층의 성장으로 고속 전단강도와 충격 에너지 값은 점차 감소하였다. 리플로우 횟수가 1회일 때는 ENEPIG, ENIG, OSP 순으로 고속 전단강도와 충격 에너지 값이 높았고 8회일 때는 ENEPIG, OSP, ENIG 순으로 충격 에너지 값이 높게 측정되었다.

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자유낙하하는 판의 fluttering 특성 연구 (Fluttering Characteristics of Free-falling Plates)

  • 홍슬기;채석봉;김주하
    • 한국가시화정보학회지
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    • 제15권2호
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    • pp.33-40
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    • 2017
  • Abstract In the present study, the characteristics of kinematics and dynamics in the fluttering motion of free-falling plates are investigated at Reynolds number of $10^5$. We record quasi-two-dimensional trajectories of free-falling plates with and without superhydrophobic coating using high-speed camera, and compute the drag and lift forces by trajectory analysis. Translational and angular velocities are modeled as harmonic functions with specific phase differences. In particular, periodic mass elevations near turning points are explained using the suggested models. At each turning point, a sudden drop in lift and a rapid increase in drag occur simultaneously due to fast increase in angle of attack. However, the lift is increased over the buoyancy-corrected weight of plate during gliding flight, resulting in periodic mass elevations near turning points. Superhydrophobicity is shown to increase lift but to reduce drag on a fluttering plate, resulting in the decrease of mean descent speed.

Stochastic Activity Network 모델을 이용한 HNCP 홈 네트워트 성능 평가 (Performance Evaluation of HNCP Home Network Using Stochastic Activity Network Models)

  • 이재민;명관주;이감록;전요셉;권욱현
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 통신소사이어티 추계학술대회논문집
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    • pp.183-186
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    • 2003
  • In this paper, performance evaluation of HNCP home network is using stochastic activity network models is proposed. HNCP is a home network protocol for controling and monitoring home appliances using power line communication. a CSMA/CA with packet drop method is used in HNCP MAC layer. Using the proposed stochastic activity network models. performances of HNCP home networks with error-free environment and error environment are evaluated.

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유무연 용융도금 리본에 따른 결정질 실리콘 태양전지 모듈 열화거동 (Degradation Behavior of Eutectic and Pb-free Solder Plated Ribbon in Crystalline Silicon Photovoltaic Module)

  • 김주희;김아영;박노창;하정원;이상권;홍원식
    • Journal of Welding and Joining
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    • 제32권6호
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    • pp.75-81
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    • 2014
  • Usage of heavy metal element (Pb, Hg and Cd etc.) in electronic devices have been restricted due to the environmental banning of the European Union, such as WEEE and RoHS. Therefore, it is needed to develop the Pb-free solder plated ribbon in photovoltaic (PV) module. This study described that degradation characteristics of PV module under damp heat (DH, $85^{\circ}C$ and 85% R.H.) condition test for 1,000 h. Solar cell ribbons were utilized to hot dipping plate with Pb-free solder alloys. Two types of Pb-free solder plated ribbons, Sn-3.0Ag-0.5Cu (SAC305) and Sn-48Bi-2Ag, and an electroless Sn-40Pb solder hot dipping plated ribbon as a reference sample were prepared to evaluate degradation characteristics. To detect the degradation of PV module with the eutectic and Pb-free solder plated ribbons, I-V curve, electro-luminescence (EL) and cross-sectional SEM analysis were carried out. DH test results show that the reason of maximum power (Pm) drop was mainly due to the decrease fill factor (FF). It was attributed to the crack or oxidation of interface between the cell and the ribbon. Among PV modules with the eutectic and Pb-free solder plated ribbon, the PV module with SAC305 ribbon relatively showed higher stability after DH test than the case of PV module with Sn-40Pb and Sn-48Bi-2Ag solder plated ribbons.

케비테이션 제트 유동을 이용한 발전 시스템 (A Power-Generation System using Cavitation jet flow)

  • 나정수;이강주;이봉렬;주남식
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.162.1-162.1
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    • 2010
  • Cavitation phenomenon has long been a difficult problem that regarded as negative event to fluid machines or industrial facilities. In the latest, however, some engineers became to understand the power of cavitation and use it to cleaning wall after developing cavitation nozzle. In this paper, we introduce new concept for power-generation system using cavitation jet flow maid by nozzle and impulse turbine in vacuum condition. The vacuum needed to make cavitation is generated naturally by Torricelli's vacuum, 10.23m effective head drop without additional power. We analyzed water's boiling and the steam's mean free path according to vacuum purity levels for nozzles and turbine blades. The nozzles make water accelerate in the neck and boil in expansion section of the nozzles. The shape of the impulse turbine is designed for absorption of the molecule's kinetic energy of the steam.

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CSF 모델을 이용한 자유표면 유동 해석 (A method for incompressible free surface flow including surface tension using CSF model)

  • 홍인철;백제현
    • 한국전산유체공학회:학술대회논문집
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    • 한국전산유체공학회 2004년도 추계 학술대회논문집
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    • pp.15-18
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    • 2004
  • A numerical method for simulating two-phase flows including surface force is presented. The method is based on fractional step method of finite volume formulation and the interface is tracked with PLIC VOF method. In the CSF model, as color function, f, representing the location of interface varies steeply in the interface region, we need to use smoothed function f to get accurate unit normal and the curvature. Peskin kernel is used to get smoothed function f. A spherical drop in static equilibrium and three-dimensional merging of gas bubble are tested, resulting in the validation of this method

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WATER INDUCED MECHANICAL EFFECT ON THE DENTAL HARD TISSUE BY THE SHORT PULSED LASER

  • Kwon,Yong-Hoon;Kim, You-Young
    • Journal of Photoscience
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    • 제5권1호
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    • pp.33-37
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    • 1998
  • One macroscopic effect in the free-running Er:YAG laser is an accumulation of microscopic effects. Understanding of the exogenous water induced mechanical effect on the dental hard tissue by the Qswitched Er:YAG laser has an important impact on the further understanding of the free-running Er:YAG laser ablation on the dental hard tissue. The Q-switched Er:YAG laser (1-$\mu$s-long pulse width) was used in the recoil pressure measurement with an aid of water-jet system and a pressure transducer. The amplitude of the recoil pressure depends on the tooth surface conditions (dry and wet) and the volume of the water upon it. Wet surfaces yielded higher recoil pressure than that of dry, surface, and as the volume of the exogenous water drop increased, the amplitude of the recoil pressure increased also.

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유처리제용 양이온 계면찰성제의 임계미셀농토에서 온도의 효과 (The Effect of Temperature on the Critical Micelle Concentration of Cationic Surfactant for Chemical Dispersants)

  • 김영찬
    • 해양환경안전학회지
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    • 제14권2호
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    • pp.145-148
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    • 2008
  • 화장품과 유처리제 등에 응용할 수 있는 양이온 계면활성제인 N-octadecyl pyridinium bromide를 사용하여 온도 $40{\sim}60^{\circ}C$ 범위에서 적하법을 이용한 임계미셀농도를 적용 미셀형성에 따른 열역학적 특성(자유에너지, 엔탈피, 엔트로피, 열용량)을 조사하였다. 그 결과 자유에너지 변화는 온도가 증가함에 따라 감소함을 알 수 있었다.

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전해도금 Cu와 Sn-3.5Ag 솔더 접합부의 Kirkendall void 형성과 충격 신뢰성에 관한 연구 (A Study of Kirkendall Void Formation and Impact Reliability at the Electroplated Cu/Sn-3.5Ag Solder Joint)

  • 김종연;유진
    • 마이크로전자및패키징학회지
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    • 제15권1호
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    • pp.33-37
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    • 2008
  • Kirkendall void는 전해도금 Cu/Sn-Ag 솔더 접합부에서 형성되었으며 Cu 도금욕에 함유되는 첨가제에 의존한다. 첨가제로 사용된 SPS의 함량의 증가와 함께 $150^{\circ}C$에서 열처리 후 많은 양의 Kirkendall void가 $Cu/Cu_3Sn$ 계면에 존재하였다. AES 분석은 void 표면에 S가 편석되어 있음을 보여주었다. $Cu/Cu_3Sn$ 계면을 따라 파괴된 시편에서 Cu, Sn, S peak만 검출되었고 AES 깊이 프로파일에서 S는 급격하게 감소하였다. $Cu/Cu_3Sn$ 계면에서 S 편석은 계면에너지를 낮추고 Kirkendall void 핵생성을 위한 에너지장벽을 감소시킨다. 낙하충격시험은 SPS를 사용하여 도금된 Cu의 경우 Kirkendall void가 형성된 $Cu/Cu_3Sn$ 계면에서 파괴가 진행되고 급격하게 신뢰성이 감소됨을 보였다.

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IT 모듈의 자유 낙하 모사를 위한 병렬처리시스템의 적용 (Application of Parallel Processing System for free drop simulation of IT-related modules)

  • 박영재;이준성;고한옥;장윤석;최재붕;김영진
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.405-406
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    • 2006
  • Recently, the flat display modules such as plasma or TFT-LCD employ thin crystallized panels which are normally weak to high level transient mechanical energy inputs. As a result, anti-shock performance is one of the most important design specifications for TFT-LCD modules. However, most of large display module designs are generated based on engineers own experiences. Also, a large-scale analysis to evaluate complex material and structural behaviors is one of interesting topic in diverse engineering and scientific fields. The utilization of massively parallel processors has also been a recent trend of high performance computing. The objective of this paper is to introduce a parallel process system which consists of general purpose finite element analysis solver as well as parallelized PC cluster. The parallel processing system is constructed using thirty-two processing elements and the finite element program is developed by adopting hierarchical domain decomposition method. In order to verify the efficiency of the established system, an impact analysis on thin and complex sub-parts of flat display modules is performed. The evaluation results showed a good agreement with the corresponding reference solutions, and thus, the parallel process system seems to be a useful tool fur the complex structural analysis such as IT related products.

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