• 제목/요약/키워드: Free Acceptance

검색결과 183건 처리시간 0.02초

Suppression of nitric oxide (NO) production by traditional medicine

  • Lee, Jin Soo;Jeong, Hyun-Ja
    • 셀메드
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    • 제8권2호
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    • pp.8.1-8.5
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    • 2018
  • Nitric oxide (NO) is a small diffusible molecule which plays an important role in various physiological activities. NO is a notable molecule, functioning as a cytotoxic agent and cellular messenger. There has been considerable interest in NO production by activated macrophages because this gaseous metabolite plays a fundamental role in the cytotoxic and cytostatic effects of macrophages towards invasive micro-organisms and tumour cells. No is a bioactive free radical that has been implicated in many physiological functions, plays a critical role during inflammation and therefore constitutes a potential target for developing therapeutics for inflammatory diseases. The use of medicinal plants by the population has been an important alternative the resource in the treatment of various diseases. Its growing acceptance in the medical community has been due to the fact that several plants with biological activities have been scientifically investigated and their efficacy and safety have been proven. In this review, discussed suppressive effects of No production by traditional medicines in RAW 264.7 and THP-1 macrophages.

Conduits for Coronary Bypass: Arteries Other Than the Internal Thoracic Artery's

  • Barner, Hendrick B.
    • Journal of Chest Surgery
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    • 제46권3호
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    • pp.165-177
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    • 2013
  • This is the third in a series on coronary artery bypass which reviews three alternative arterial conduits. The radial artery has become the most widely used of the three and accumulating experience demonstrates better patency at 10 years versus saphenous vein. Drawbacks are a long incision on the forearm, the propensity for spasm and persistent sensory disturbance in about 10%. The first is answered by endoscopic harvest which may yield a shorter conduit but reduces sensory nerve injury. Spasm is managed pharmacologically and by less harvest trauma. The gastroepiploic artery is used in situ and free and although the abdominal cavity is entered complications are minimal and patency compares favorably with the radial artery. Use of the inferior epigastric artery remains minimal and its similar length often requires composite use but limited patency data are supportive. Other arteries have had rare use and this is unlikely to change because the three presented here have significant advantages and acceptance.

Guide flange prosthesis for early management of reconstructed hemimandibulectomy: a case report

  • Patil, Pravinkumar Gajanan;Patil, Smita Pravinkumar
    • The Journal of Advanced Prosthodontics
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    • 제3권3호
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    • pp.172-176
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    • 2011
  • Surgical resection of the mandible due to presence of benign or malignant tumor is the most common cause of the mandibular deviation. Depending upon the location and extent of the tumor in the mandible, various surgical treatment modalities like marginal, segmental, hemi, subtotal, or total mandibulectomy can be performed. The clinicians must wait for extensive period of time for completion of healing and acceptance of the osseous graft before considering the definitive prosthesis. During this initial healing period prosthodontic intervention is required for preventing the mandibular deviation. This case report describes early prosthodontic management of a patient who has undergone a reconstructed hemi-mandibulectomy with modified mandibular guide flange prosthesis. The prosthesis helps patient moving the mandible normally without deviation during functions like speech and mastication.

단백질 분해효소로 원료 처리하여 제조한 효소분해 간장의 특성 (Production and Characteristics of Enzymatically Hydrolyzed Soy Sauce by the Treatment Using Proteases)

  • 채희정;인만진;김민홍
    • 한국식품영양과학회지
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    • 제26권5호
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    • pp.784-787
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    • 1997
  • Enzymatically hydrolyzed soy sauce(eHSS) was prepared by the treatment of defatted soy flake using two types of proteases, followed by maillard reaction and formulation with some ingredients. The eHSS was mixed with fermented soy sauce(FSS) to make enzymatically hydrolyzed mixed soy sauce(eHMSS). The properties and sensory characteristics were evaluated and compared with commercially available soy sauces. The control of salt and total nitrogen contents in eHSS and eHMSS was easy, and the production of soy sauce of low salt and high protein was possible. However, the free amino acid content of eHSS was lower than FSS. due to lower degree of hydrolysis. In sensory evaluation, the eHSS have no loss taste and overall acceptance than FSS. Consequently, the eHSS and eHMSS have the potential for use with FSS to produce high quality soy sauce of low salt and high protein contents.

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금융 MVNO 환경에서의 소비자의 모바일지급결제서비스 이용의도 (Intention to use of Mobile Payment Service in Financial MVNO Environment)

  • 박진성;강인양;한필구;전병호
    • 디지털산업정보학회논문지
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    • 제8권2호
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    • pp.213-227
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    • 2012
  • Recently MVNO has been adopted to reform the monopoly structure of mobile telecommunication industry in Korea. MVNO is expected to not only enable mobile telecommunication industry more free, but also provide various welfare service with customers, in particular mobile payment system service. Based on TAM, this paper is to investigate the affecting factors of intention to use of mobile payment system service in MVNO environment. The results indicate that all system quality factors are significantly related to both perceived usefulness and perceived easy of use, but only stability of service quality factor is significantly related to the perceived usefulness. Perceived easy of use was found to be siginificantly related to the intention to use of mobile payment system in MVNO environment, but percevied usefulness was not.

투습방수용 수분산 폴리우레탄의 합성 및 특성에 관한 연구 - PEG와 DMPA 함량의 영향 - (A Study on the Synthesis and Characterization of Waterborne Polyurethanes for Water Vapor Permeable / Waterproof - Effect of PEG and DMPA Content)

  • Kwak, Yong-Sil;Kim, Eun-Young;Kim, Han-Do
    • 한국섬유공학회:학술대회논문집
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    • 한국섬유공학회 2003년도 가을 학술발표회 논문집
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    • pp.42-45
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    • 2003
  • Polyurethane(PU) products are generally used in the automobile, paint, furniture, adhesive, the medical and textile industries. Recently, the increasing acceptance of waterborne polyurethane (WBPU) Is motivated by more stringent environmental requirements, such as the reduction of solvent emissions into the atmosphere [1]. The application for textiles includes suede processing, soft-hand processing, wrinkle-free processing, antistatic processing, sizing and adhesives. (omitted)

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프탈로시아닌계 광전도성 유기박막의 제조에 관한 연구 (A study on the preparation of phthalocyanine optoelectric thin films)

  • 박구범;조기선;이덕출
    • E2M - 전기 전자와 첨단 소재
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    • 제7권5호
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    • pp.409-416
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    • 1994
  • A double layered photoreceptor using phthalocyanine dye was made by dip-coating method. The under cutting layer(UCL) was coated with A1$\_$2/O$\_$3/ or polyamide, and the charge generation layer(CGL) was formed by .tau.-type metal-free phthalocyanine. The oxadiazole was used as a charge transport layer(CTL) and polycarbonate and poly(vinyl butyral) was employed as a host polymer. The .tau.-H$\_$2/Pc had an absorption peak around 780nm, which coincided with the emitting wavelengths of GaAlAs diode lasers. Maximum charge acceptance of CTL that gives thickness of 12.mu.m was -900V by corona charge of -6.0kV. In photo-induced discharge measurements, residual potential was less than -20V and sufficient for ordinary use, and sample films using of poly(vinyl butyral) was showed good charge retention. In printing test, drum that was employed polycarbonate as a host polymer showed the good print quality.

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New Generation of Lead Free Paste Development

  • Albrecht Hans Juergen;Trodler K. G.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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    • pp.233-241
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    • 2004
  • A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

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New Generation of Lead Free Solder Spheres 'Landal - Seal'

  • Walter H.;Trodler K. G.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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    • pp.211-219
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    • 2004
  • A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

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새싹땅콩 분말 및 추출물이 생면 품질특성과 항산화 활성에 미치는 영향 (Effects of Peanut Sprout Extract and Powder on Quality Characteristics and Antioxidant Activity of Wet Noodles)

  • 김민지;이수정
    • 한국식품영양학회지
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    • 제28권3호
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    • pp.507-516
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    • 2015
  • This study investigated the quality characteristics and antioxidant activities of wet noodles as well as their cooking properties following the addition of peanut sprout extract (PSE) and powder (PSP), which are known to contain a significant level of resveratrol. Wet noodles were prepared with 0, 2.5, 5, 7.5 and 10% PSE and PSP. Quality characteristics such as increasing volume of noodle, water ratio, turbidity of cooking water and color, texture, and sensory evaluation were then assessed. Additionally, the total resveratrol content in the cooked noodles was analyzed by HPLC and DPPH free radical scavenging capacity. As the amount of PSE and PSP increased, the L value of wet and cooked noodles significantly decreased, whereas the a and b values increased (p<0.001). The L value of cooked noodles was significantly lower compared to wet noodles (p<0.001) whereas the a and b values were higher. For the cutting intensity properties of the cooked noodles, hardness was reduced with increasing amounts of PSE (p<0.001), and was significantly increased in proportion to the amount of PSP (p<0.05). Meanwhile, springiness was not significantly different in all groups. Total resveratrol content and free radical scavenging activity significantly increased in proportion to the amounts of PSE and PSP (p<0.001), especially in noodles containing 5%, 7.5% and 10% PSE and PSP. Finally, sensory evaluation of PSE noodle revealed that color, flavour, taste were significantly decreased (p<0.05). But there was no difference in overall acceptance among cooked noodles with 2.5% to 5% PSE comparison to the control. Sensory characteristics in the PSP noodle showed similar results. In conclusion, these findings suggest that peanut sprout extract and powder could be potentially used as functional food ingredients. In addition, up to 5% PSE and PSP can be substituted for wheat flour.