• Korean Chemical Engineering Research
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• v.49 no.2
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• pp.161-167
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• 2011

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservatives (OSP) in order to improve the stability and the reliability of final product. Since current OSPs have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to develop various thermo-stable OSPs based upon poly(vinyl pyridine-co- methylmethacrylate) and to evaluate their anti-oxidation property protecting Cu pad, thermo-stability and solubility to acid- or alcohol-containing aqueous solution during pos-fluxing. All OSPs showed not only good anti-oxidation property, thermo-stability and solubility but also more advantages like low cost, less odor, and less hygroscopic.

• Applied Chemistry for Engineering
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• v.8 no.2
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• pp.179-190
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• 1997

To study the effects of chemical composition on the fusion temperatures of coal ashes, the chemical composition, mineral matter, and fusion temperature were studied with 54 kinds of coal ash samples including Korean anthracite coals. CaO, MgO and $Fe_2O_3$ were observed to be major fluxing elements in reducing and oxidizing atmosphere. The fluxing effect of $Fe_2O_3$ was increased more in reducing atmosphere. In a base/acid ratio, the fusion temperature decreased with increasing amounts of basic components. Nevertheless, the correlation between a fusion temperature and base/acid ratio was not shown well in a higher ratio of $Fe_2O_3/CaO$. The differences of fusion temperatures between oxidizing and reducing atmosphere showed close relationship with $SiO_2/Al_2O_3$ ratio rather than with $Fe_2O_3$ contents. Multiple regression was used to predict the fusion temperature of coal ashes, and it was established that the major predictors in oxidizing atmosphere were Base/Acid, $Fe_2O_3/CaO$, $SiO_2/Al_2O_3$, and $(SiO_2/A1_2O_3){\cdot}(Base/Acid)$ and Base/Acid, $Fe_2O_3/CaO$, $SiO_2$, and $TiO_2$ were major ones in reducing atmosphere.

• Journal of the Korean Society of Safety
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• v.13 no.4
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• pp.87-95
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• 1998

The use of flux cored arc welding(FCAW) process has grown dramatically since it has been developed because of the remarkable operating characteristics and the resulting weld properties. The feature that distinguishes the FCAW process from other arc welding processes is the enclosure of fluxing ingredients within a continuously fed tubular electrode. The benefits of FCAW process are the increased productivity due to continuous wire feeding, the metallurgical effects derived from the reactions with flux, and the shapes of weld bead formed by slag. However, FCAW process causes the problem in working environment because it generates much more fume than other welding processes. Recently, the welding fume became a hot issue in the field after some welders were diagnosed as manganese toxcosis and siderosis. This study was started to investigate the characteristics of welding fume and utilize the results from the investigation to protect the welders from welding fume. As a first step, the effect of welding conditions on the fume generation rate(FGR) were investigated during FCAW process with $CO_2$ shielding. The considered welding conditions were welding current, arc voltage, travel speed, contact tube to work distance, and torch angle. The results showed that FGR was affected by all of these factors.

• Journal of the Korean Ceramic Society
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• v.49 no.1
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• pp.105-110
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• 2012

In this paper, a yellow phosphor $Sr_3SiO_5:Eu^{2+}$ that emits efficiently at the 450 nm excitation for warm white LED is studied. In addition, the effects of various flux $BaF_2$, $NH_4Cl$ on the emission spectra were investigated. The samples were synthesized through conventional solid state reaction under reducing atmosphere of 95% $N_2$-5% $H_2$ mixture at the high temperature. All phosphors showed a excitation band from 450 nm and broad band emission peaking at region of 580 nm. The optimal concentration of $BaF_2$ flux is 3 wt% for $Sr_3SiO_5$ with doping 0.05mol Eu phosphors fired in a reductive atmosphere. The phosphor showed highest emission peaking at 582 nm.

• ETRI Journal
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• v.38 no.6
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• pp.1179-1189
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• 2016

A chemorheological analysis of a no-flow underfill was conducted using curing kinetics through isothermal and dynamic differential scanning calorimetry, viscosity measurement, and solder (Sn/27In/54Bi, melting temperature of $86^{\circ}C$) wetting observations. The analysis used an epoxy system with an anhydride curing agent and carboxyl fluxing capability to remove oxide on the surface of a metal filler. A curing kinetic of the no-flow underfill with a processing temperature of $130^{\circ}C$ was successfully completed using phenomenological models such as autocatalytic and nth-order models. Temperature-dependent kinetic parameters were identified within a temperature range of $125^{\circ}C$ to $135^{\circ}C$. The phenomenon of solder wetting was visually observed using an optical microscope, and the conversion and viscosity at the moment of solder wetting were quantitatively investigated. It is expected that the curing kinetics and rheological property of a no-flow underfill can be adopted in arbitrary processing applications.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Korean Journal of Materials Research
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• v.15 no.8
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• pp.536-542
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• 2005

Recently European Council(EU) published the RoHS(restriction of the use of certain hazardous substances in electrical and electronic equipment) which is prohibit the use of Pb, Hg, Cd, $Cr^{+6}$, PBB or PBDE in the electrical and electronic equipments. So EU member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain 6 hazardous substances. The one of the most important in electronics manufacturing process is soldering. Soldering process use the chemical substances which are applied in fluxing and cleaning processes and it can generate the malfunction of electronics caused by corrosion in the fields conditions. Therefore this study researched on the polarization and Tafel properties of Sn40Pb and Sn3.0Ag0.5Cu(SAC) solder based on the electrochemical theory. We prepared SnPb specimens which was aged in $150^{\circ}C,\;180^{\circ}C$ for 15 minutes ana Sn3.0Ag0.5Cu specimens that was aged in $180^{\circ}C,\;220^{\circ}C$ for 10 minutes. Experimental polarization curves were measured in distilled ionized water and $3.5 wt\%$, 1 mole NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrode, respectively. To observe the electrochemical reaction, polarization test was conducted from -250 mV to +250 mV. From the polarization curves that were composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density(Icorr). In these results, corrosion rate for two specimen were compared Sn3.0Ag0.5Cu with SnPb solders

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.985-991
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• 1999

Corrosion behaviors of Incoloy 800H, KSA(Kaeri Superalloy)-6, Inconel 600 and Hastelloy C-276 in molten salts were investigated in the temperature range of 650 ~ $850^{\circ}C$. Due to $\textrm{Li}_{2}\textrm{O}$-induced basic fluxing mechanism, the corrosion rates of the alloys in mixed molten salt of LiC1-$\textrm{Li}_{2}\textrm{O}$ were significantly higher than those in molten salt of LiCl. In the mixed molten salt, Fe-base alloys showed higher corrosion resistance than the Ni-base alloys. and Hastelloy C-276 with high Mo and W contents exhibited the highest corrosion rate among the examined alloys. The single layer of $\textrm{LiCrO}_{2}$ was formed in molten salt of LiCl and two phase structure of a scale consisted of oxides and Ni was formed in the mixed molten salt.

• Journal of the Korean Chemical Society
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• v.44 no.6
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• pp.563-572
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• 2000

The analysis of coal ash is very important to predict some factors, such as slagging and fouling in the boiler, and to determine optimum mixing ratios of the each coals used. In ASTM, the analysis of coal ash is clarified to use lithium metaborate (LiBO$_2$) as a fluxing agent and then to analyze the pre-treated samples using AAS. However, it takes too much time and efforts to analyze many samples by ASTM method, as a result, this method is not proper in our laboratory in charge of analyses of all power plants. So we tried to establish more convenient and accurate analytical method of coal ash by 3 different methods which are 2 different pre-treatment methods (fusion dissolution and microwave digestion) and XRF analysis method using a clear pellet. Although all 3 methods can be utilized to analyze the major elements of coal ash, each method has its own characteristics, therefore, each method should be chosen according to its own purpose.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.