• Title/Summary/Keyword: Flow-Rate Uniformity

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Manufacturing and characterization of ECR-PECVD system (ECR-PECVD 장치의 제작과 특성)

  • 손영호;정우철;정재인;박노길;황도원;김인수;배인호
    • Journal of the Korean Vacuum Society
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    • v.9 no.1
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    • pp.7-15
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    • 2000
  • An ECR-PECVD system with the characteristics of high ionization rat다 ability of plasma processing in a wide pressure range and deposition at low temperature was manufactured and characterized for the deposition of thin films. The system consists of a vacuum chamber, sample stage, vacuum gauge, vacuum pump, gas injection part, vacuum sealing valve, ECR source and a control part. The control of system is carried out by the microprocessor and the ROM program. We have investigated the vacuum characteristics of ECR-PECVD system, and also have diagnosed the characteristics of ECR microwave plasma by using the Langmuir probe. From the data of system and plasma characterization, we could confirmed the stability of pressure in the vacuum chamber according to the variation of gas flow rate and the effect of ion bombardment by the negative DC self bias voltage. The plasma density was increased with the increase of gas flow rate and ECR power. On the other hand, it was decreased with the increase of horizontal radius and distance between ECR source and probe. The calculated plasma densities were in the range of 49.7\times10^{11}\sim3.7\times10^{12}\textrm{cm}^{-3}$. It is also expected that we can estimate the thickness uniformity of film fabricated by the ECR-PECVD system from the distribution of the plasma density.

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Effects of $C_2F_{6}$ Gas on Via Etching Characteristics ($C_2F_{6}$ 가스가 Via Etching 특성에 미치는 영향)

  • Ryu, Ji-Hyeong;Park, Jae-Don;Yun, Gi-Wan
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.1
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    • pp.31-38
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    • 2002
  • In order to improve the 0.35 $mutextrm{m}$-via hole etching process the etching characteristic of the gas $C_2F_{6}$ has been analyzed. The samples were triple-layer films(TEOS/SOG/TEOS) on 8-inch wafers and the orthogonal array matrix technique was used for the process. The equipment for etching was the transformer coupled plasma (TCP) source which is a type of high density plasma(HDP). This experiment showed the etching rate for $C_2F_{6}$ was 0.8 $mutextrm{m}$/min-1.1 $mutextrm{m}$/min and the measured uniformity was under $pm$6.9% in the matrix window. The CD skew comparison between pre and post-etching was under 10% which is an outstanding results in the window of profile in anisotropic etching. There was no problem in C2F6 with the flow rate of 20sccm, but when 14sccm of $C_2F_{6}$ was supplied there was a recess problem on the inner wall of SOG film. Consequently the etching characteristic of $C_2F_{6}$ shows a fast etching rate and a very wide process window in HDP TCP.

Quantitative and qualitative analysis of the flow field development through T99 draft tube caused by optimized inlet velocity profiles

  • Galvan, Sergio;Reggio, Marcelo;Guibault, Francois;Solorio, Gildardo
    • International Journal of Fluid Machinery and Systems
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    • v.8 no.4
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    • pp.283-293
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    • 2015
  • The effect of the inlet swirling flow in a hydraulic turbine draft tube is a very complex phenomenon, which has been extensively investigated both theoretically and experimentally. In fact, the finding of the optimal flow distribution at the draft tube inlet in order to get the best performance has remained a challenge. Thus, attempting to answer this question, it was assumed that through an automatic optimization process a Genetic Algorithm would be able to manage a parameterized inlet velocity profile in order to achieve the best flow field for a particular draft tube. As a result of the optimization process, it was possible to obtain different draft-tube flow structures generated by the automatic manipulation of parameterized inlet velocity profiles. Thus, this work develops a qualitative and quantitative analysis of these new draft tube flow field structures provoked by the redesigned inlet velocity profiles. The comparisons among the different flow fields obtained clearly illustrate the importance of the flow uniformity at the end of the conduit. Another important aspect has been the elimination of the re-circulating flow area which used to promote an adverse pressure gradient in the cone, deteriorating the pressure recovery effect. Thanks to the evolutionary optimization strategy, it has been possible to demonstrate that the optimized inlet velocity profile can suppress or mitigate, at least numerically, the undesirable draft tube flow characteristics. Finally, since there is only a single swirl number for which the objective function has been minimized, the energy loss factor might be slightly affected by the flow rate if the same relation of the axial-tangential velocity components is maintained, which makes it possible to scale the inlet velocity field to different operating points.

Numerical Study of Effect of DAF-Tank Shape on Flow Pattern in Separation Zone of Dissolved Air Flotation (용존공기부상조(DAF-tank)의 형상변화가 분리조(Separation Zone)의 내부 유동 패턴에 미치는 영향에 대한 수치해석적 연구)

  • Ryu, Gwang-Nyeon;Park, Sang-Min;Lee, Ho-Il;Chung, Mong-Kyu
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.8
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    • pp.855-860
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    • 2011
  • We numerically simulated a dissolved air flotation (DAF) tank to predict the performance of the pilot facility. The flow was assumed to be two-dimensional and two-phase. The velocity distributions in the separation zones of differently shaped DAFs were compared to find the effect of the shape on the performance. The results showed that the typical flow pattern that appeared in a well-designed DAF-tank was generated in the separation zone of the base model. This flow pattern could be maintained while the baffle height was sufficiently tall regardless of the other geometric parameters. However, the baffle height and angle, the contact zone width, and the perforated plate affected the uniformity of the downward flow in the separation zone. Except for the baffle height, the base model used in this study showed a better uniformity of downward flow than did other models with different geometric parameters.

Synthesis of Graphene Using Thermal Chemical Vapor Deposition and Application as a Grid Membrane for Transmission Electron Microscope Observation (열화학증기증착법을 이용한 그래핀의 합성 및 투과전자현미경 관찰용 그리드 멤브레인으로의 응용)

  • Lee, Byeong-Joo;Jeong, Goo-Hwan
    • Korean Journal of Materials Research
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    • v.22 no.3
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    • pp.130-135
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    • 2012
  • We present a method of graphene synthesis with high thickness uniformity using the thermal chemical vapor deposition (TCVD) technique; we demonstrate its application to a grid supporting membrane using transmission electron microscope (TEM) observation, particularly for nanomaterials that have smaller dimensions than the pitch of commercial grid mesh. Graphene was synthesized on electron-beam-evaporated Ni catalytic thin films. Methane and hydrogen gases were used as carbon feedstock and dilution gas, respectively. The effects of synthesis temperature and flow rate of feedstock on graphene structures have been investigated. The most effective condition for large area growth synthesis and high thickness uniformity was found to be $1000^{\circ}C$ and 5 sccm of methane. Among the various applications of the synthesized graphenes, their use as a supporting membrane of a TEM grid has been demonstrated; such a grid is useful for high resolution TEM imaging of nanoscale materials because it preserves the same focal plane over the whole grid mesh. After the graphene synthesis, we were able successfully to transfer the graphenes from the Ni substrates to the TEM grid without a polymeric mediator, so that we were able to preserve the clean surface of the as-synthesized graphene. Then, a drop of carbon nanotube (CNT) suspension was deposited onto the graphene-covered TEM grid. Finally, we performed high resolution TEM observation and obtained clear image of the carbon nanotubes, which were deposited on the graphene supporting membrane.

Optical and Electrical Properties of Fluorine-Doped Tin Oxide Prepared by Chemical Vapor Deposition at Low Temperature (저온 증착된 불소도핑 주석 산화 박막의 광학적·전기적 특성)

  • Park, Ji Hun;Jeon, Bup Ju
    • Korean Journal of Materials Research
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    • v.23 no.9
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    • pp.517-524
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    • 2013
  • The electrical and optical properties of fluorine-doped tin oxide films grown on polyethylene terephthalate film with a hardness of 3 using electron cyclotron resonance plasma with linear microwave of 2.45 GHz of high ionization energy were investigated. Fluorine-doped tin oxide films with a magnetic field of 875 Gauss and the highest resistance uniformity were obtained. In particular, the magnetic field could be controlled by varying the distribution in electron cyclotron deposition positions. The films were deposited at various gas flow rates of hydrogen and carrier gas of an organometallic source. The surface morphology, electrical resistivity, transmittance, and color in the visible range of the deposited film were examined using SEM, a four-point probe instrument, and a spectrophotometer. The electromagnetic field for electron cyclotron resonance condition was uniformly formed in at a position 16 cm from the center along the Z-axis. The plasma spatial distribution of magnetic current on the roll substrate surface in the film was considerably affected by the electron cyclotron systems. The relative resistance uniformity of electrical properties was obtained in film prepared with a magnetic field in the current range of 180~200A. SEM images showing the surface morphologies of a film deposited on PET with a width of 50 cm revealed that the grains were uniformly distributed with sizes in the range of 2~7 nm. In our experimental range, the electrical resistivity of film was able to observe from $1.0{\times}10^{-2}$ to $1.0{\times}10^{-1}{\Omega}cm$ where optical transmittance at 550 nm was 87~89 %. These properties were depended on the flow rate of the gas, hydrogen and carrier gas of the organometallic source, respectively.

Characterization of Via Etching in $CHF_3/CF_4$ Magnetically Enhanced Reactive Ion Etching Using Neural Networks

  • Kwon, Sung-Ku;Kwon, Kwang-Ho;Kim, Byung-Whan;Park, Jong-Moon;Yoo, Seong-Wook;Park, Kun-Sik;Bae, Yoon-Kyu;Kim, Bo-Woo
    • ETRI Journal
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    • v.24 no.3
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    • pp.211-220
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    • 2002
  • This study characterizes an oxide etching process in a magnetically enhanced reactive ion etching (MERIE) reactor with a $CHF_3/CF_4$ gas chemistry. We use a statistical $2^{4-1}$ experimental design plus one center point to characterize the relationships between the process factors and etch responses. The factors that we varied in the design include RF power, pressure, and gas composition, and the modeled etch responses were the etch rate, etch selectivity to TiN, and uniformity. The developed models produced 3D response plots. Etching of $SiO_2$ mainly depends on F density and ion bombardment. $SiO_2$ etch selectivity to TiN sensitively depends on the F density in the plasma and the effects of ion bombardment. The process conditions for a high etch selectivity are a 0.3 to 0.5 $CF_4$ flow ratio and a -600 V to -650 V DC bias voltage according to the process pressure in our experiment. Etching uniformity was improved with an increase in the $CF_4$ flow ratio in the gas mixture, an increase in the source power, and a higher pressure. Our characterization of via etching in a $CHF_3/CF_4$ MERIE using neural networks was successful, economical, and effective. The results provide highly valuable information about etching mechanisms and optimum etching conditions.

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Control of oscillatory Czochralski convection by ACRT (ACRT에 의한 초크랄스키 대류진동 제어)

  • Choe, Jeong-Il;Seong, Hyeong-Jin
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.20 no.7
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    • pp.2397-2408
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    • 1996
  • A numerical study was made of the control of transient oscillatory flow modes in Czochralski convection. The reduction of temperature oscillation was achieved by changing the rotation rate of crystal rod, .OMEGA.$_{S}$=.OMEG $A_{S0}$(1+ $A_{S}$sin(2.pi. $f_{S}$/ $t_{p}$t)). The temporal behavior of oscillation flow was scrutinized over broad ranges of two parameters, i.e., the rotation amplitude( $A_{S}$.leq.0.5) and the nondimensional frequency (0.9.leq. $f_{S}$.leq.1.5). The mixed convection parameter was ranged 0.225.leq.Ra/PrR $e^{2}$.leq.0.929, which encompassed the buoyancy-and forced-dominant convection regimes. Computational results revealed that the temperature oscillations could be reduced effectively by a proper adjustment of the control parameters. The uniformity of temperature distribution near the crystal rod was examined. The control of oscillatory flow modes was also made for a realistic, low value of Pr.

Development of Large-area Plasma Sources for Solar Cell and Display Panel Device Manufacturing

  • Seo, Sang-Hun;Lee, Yun-Seong;Jang, Hong-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.148-148
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    • 2011
  • Recently, there have been many research activities to develop the large-area plasma source, which is able to generate the high-density plasma with relatively good uniformity, for the plasma processing in the thin-film solar cell and display panel industries. The large-area CCP sources have been applied to the PECVD process as well as the etching. Especially, the PECVD processes for the depositions of various films such as a-Si:H, ${\mu}c$-Si:H, Si3N4, and SiO2 take a significant portion of processes. In order to achieve higher deposition rate (DR), good uniformity in large-area reactor, and good film quality (low defect density, high film strength, etc.), the application of VHF (>40 MHz) CCP is indispensible. However, the electromagnetic wave effect in the VHF CCP becomes an issue to resolve for the achievement of good uniformity of plasma and film. Here, we propose a new electrode as part of a method to resolve the standing wave effect in the large-area VHF CCP. The electrode is split up a series of strip-type electrodes and the strip-type electrodes and the ground ones are arranged by turns. The standing wave effect in the longitudinal direction of the strip-type electrode is reduced by using the multi-feeding method of VHF power and the uniformity in the transverse direction of the electrodes is achieved by controlling the gas flow and the gap length between the powered electrodes and the substrate. Also, we provide the process results for the growths of the a-Si:H and the ${\mu}c$-Si:H films. The high DR (2.4 nm/s for a-Si:H film and 1.5 nm/s for the ${\mu}c$-Si:H film), the controllable crystallinity (~70%) for the ${\mu}c$-Si:H film, and the relatively good uniformity (1% for a-Si:H film and 7% for the ${\mu}c$-Si:H film) can be obtained at the high frequency of 40 MHz in the large-area discharge (280 mm${\times}$540 mm). Finally, we will discuss the issues in expanding the multi-electrode to the 8G class large-area plasma processing (2.2 m${\times}$2.4 m) and in improving the process efficiency.

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Discharging Performance in Length of Hard Labyrinth and Pressure of Cylinder Type Drip Irrigation Hose (원통형 점적기의 압력과 경질미로의 길이에 따른 토출 특성)

  • Kim, Jin Hyun;Woo, Man Ho;Kim, Dong Eok
    • Journal of agriculture & life science
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    • v.52 no.6
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    • pp.103-109
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    • 2018
  • The performance of drip irrigation devices depends on flow uniformity related to the function of pressure compensation. The flow uniformity can be secured when the internal fluid pressures at the positions of the flow holes are maintained uniformly. The pressure compensation effect of the drip irrigation devices can be optimized with the combination of soft silicon and labyrinth structures. However, for a drip irrigation devices composed of only hard labyrinth structures, the flow rate is changed largely with the length and the internal geometry of the labyrinth structure. Although a drip irrigation devices with only hard labyrinth structures can be fabricated simply, the changes of flow rates with internal fluid pressures are much larger than those of the drip irrigation devices with soft silicon. Because the drip irrigation devices with only labyrinth structures can be utilized widely through the optimization of the fluid pressure, the length of the structures, and the cross-sectional area of them, the study on the optimization can play an important role for enhancing the performance of the drip irrigation devices. In this study, experimental and numerical studies for investigating the performance of the drip irrigation devices had been conducted. In the experiments and numerical calculations(CFD), the variable parameters were the lengths of the labyrinth structures(#1~#8) and the fluid pressures(0.5~3.0 bar).