• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.12
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• pp.1563-1568
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• 2012

Printed electronics is a technology used for forming electronic circuits or devices, and it is used in the manufacture of many products such as RFID tags, solar cells, and flexible display panels with a much lower cost than in the case of semiconductor process technology. Web-guide-type printing such as roll-to-roll printing is a method used to produce printed electronic devices in a large volume. To commercialize such products, highly precise alignment between printed layers is required. In this study, a highly precise alignment system is proposed, and some experimental results are compared with those obtained using a laser surface vibrometer to illustrate the reliability of the proposed system. The robustness of the proposed system to web deformation is also considered experimentally.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.25-30
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• 2018

Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

• Proceedings of the KIEE Conference
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• 2000.07d
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• pp.3075-3077
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• 2000

이동통신단말기 등의 표시소자로 사용되는 LCD(Liquid Crystal Diode)나 LED(Light Emitting Diode)의 표현의 한계를 극복하고 보다 많은 정보를 표시할 수 있는 가상의 화면을 구성하기 위한 400dpi급 LED array 칩과 이를 구동하기 위한 driver 칩을 패키징하는 방법에 대하여 연구하였다. 연성 인쇄회로기판(flexible Printed Circuit) 기판 위에 칩을 실장하여 제품의 소형화와 경량화 그리고 전선을 대체하여 신뢰성을 높일 수 있도록 설계하였고 알루미늄 wire bonding법으로 각각의 칩을 연결하는데 있어 고려해야할 패키지의 조건에 대하여 연구하였다. 본 연구의 목적은 휴대용 이동통신단말기의 경박단 소화를 위한 패키징 기술을 확보하는데 있다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.8
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• pp.544-549
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• 2015

Since LEDs (light emitting diodes) have many advantages as a light source in vehicle headlamp, such as good reliability, energy and space saving, and flexible headlamp design. On the other hand, the dependence of its performance and life on temperature have great influence on its practical use. In this study, design and fabrication of heat sink for vehicle LED headlamp were performed using thermally-conductive plastics. This study focused on the effective heat sink structure with limited space in the vehicle LED headlamp. We designed two different prototype of heat sink by thermal simulation using SolidWorks program, which had excellent temperature characteristics. The two different prototype of heat sink were fabricated by injection molding with thermally-conductive plastics. The results showed that LED $T_j$ (junction temperature) of sample B (model 1) and sample C (model 1, 2) was below then $165^{\circ}C$ when applying the thermally-conductive plastics in heat sink of vehicle LED headlamp.

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.3
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• pp.45-56
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• 2012

Printing technology is accepted by appropriate technology that smart phones, tablet PC, display(LCD, OLED, etc.) precision recently in the electronics industry, the market grows, this process in the ongoing efforts to improve competitiveness through the development of innovative technologies. So printed electronics appeared by new concept. This technology development is applied on electronic components and circuits for the simplification of the production process and reduce processing costs. Low-temperature process making possible for widening, slimmer, lighter, and more flexible, plastic substrates, such as(flexible) easily by forming a thin film on a substrate has been studied. In the past, the formation of the electrode used a screen printing method. But the screen printing method is formation of fine patterns, high-speed printing, mass production is difficult. The roll-to-roll printing method as an alternative to screen printing to produce electronic devices by printing techniques that were used traditionally in the latest technology and processing techniques applied to precision control are very economical to implement fine-line printing equipment has been evaluated as. In order to function as electronic devices, especially the dozens of existing micro-level of non-dot print fine line printing is required, the line should not break at all, because according to the specifications required to fit the ink transfer conditions should be established. In this study of roll-to-roll printing conductive paste suitable for gravure offset printing by developing Ag paste for forming fine patterns to study the basic physical properties with the aim of this study were to.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.3.2-3.2
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• 2011

In recent years, inkjet printing technology has received significant attention as a micro/nanofabrication technique for flexible printing of electronic circuits and solar cells, as well for biomaterial patterning. It eliminates the need for physical masks, causes fewer environment problems, lowers fabrication costs, and offers good layer-to-layer registration. To fulfill the requirements for use in the above applications, however, the inkjet system must meet certain criteria such as high frequency jetting, uniform droplet size, high density nozzle array, etc. Existing inkjet devices are either based on thermal bubbles or piezoelectric pumping; they have several drawbacks for flexible printing. For instance, thermal bubble jetting has limitations in terms of size and density of the nozzle array as well as the ejection frequency. Piezoelectric based devices suffer from poor pumping energy in addition to inadequate ejection frequency. Recently, an electrohydrodynamic (EHD) printing technique has been suggested and proposed as an alternative to thermal bubble or piezoelectric devices. In EHD jetting, a liquid (ink) is pumped through a nozzle and a strong electric field is applied between the nozzle and an extractor plate, which induce charges at the surfaces of the liquid meniscus. This electric field creates an electric stress that stretches the meniscus in the direction of the electric field. Once the electric field force is larger than the surface tension force, a liquid droplet is formed. An EHD inkjet head can produce droplets smaller than the size of the nozzle that produce them. Furthermore, the EHD nano-inkjet can eject high viscosity liquid through the nozzle forming tiny structures. These unique features distinguish EHD printing from conventional methods for sub-micron resolution printing. In this presentation, I will introduce the recent research results regarding the EHD nano-inkjet and the printing system, which has been applied to solar cell or thin film transistor applications.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.70-78
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• 2009

This paper addresses the analysis and the design optimization of differential interconnects for high-speed Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, and time-domain transient simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.88.1-88.1
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• 2015

In recent printed electronics technology, Photo-Sintering, a technique for sintering materials using a light source, has attracted attention as an alternative to time-consuming high-temperature thermal processes. The key principle of this technique is the selective heating of a strongly absorbent thin film, while preventing the heating of the transparent substrate by the light source. Many recent studies have used a flash lamp as the light source, and investigated the material-dependent effect of the width or intensity of the pulsed light. However, the flash lamp for sintering is not suitable for industry yet, because of needing too high power to sinter for a large scale. In energy-saving and large-scale sintering, LED technologies would be very useful in the near future. In this work, we investigated a sintering process for silver nanoparticles using UV-LED array. Silver nanoparticles in ink were inkjet-printed on a $1{\times}1cm$ area of a PET film and photo-sintered by 365 nm UV-LED module. A sheet resistance value as low as $72.6m{\Omega}/sq$ (2.3 - 4.5 times that of bulk silver) was obtained from the UV-LED sintering at 300 mW/cm2 for 50 min.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.407-408
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• 2013

Thin transparent conductive oxides (TCOs) having a thickness lower than 30 nm have been widely usedin touch screen panels. However the resistivity of the TCO films significantly increases as the thickness decreases, due to the poor crystallinity at very thin thickness of TCO films. In this study, we have investigated the effect of electron beam irradiation during the sputtering on the electrical properties and transmittance of 30 nm-thick ITO films, which have a different SnO2 atomic percent, prepared by magnetron sputtering at room temperature. Fig. 1 shows the variation of resistivity of ITO films with a different SnO2 atomic percent for both the normal ITO films and electron beam irradiated ITO films. As shows in Fig. 1, the electron beam irradiation to the ITO (SnO2 weight percent 10%) films during the sputtering resulted in a significantly decreased in resistivity from $7.4{\times}10^{-4}{\Omega}-cm$ to $1.5{\times}10^{-4}{\Omega}-cm$ and it also increased in transmittance from 84% to 88% at a wavelength of 550 nm. These results can be attributed to energy transfer from electron to ad-atoms of ITO films during the electron beam irradiated sputtering, which can enhance the crystallinity of 30 nm-thick ITO films. It is strongly indicate that electron beam irradiation can greatly improve the electrical properties and transmittance of very thin ITO films for touch screen panels, flexible displays and solar cells.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.5
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• pp.121-127
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• 2021

Reverse offset printing is considering as an emerging technology for printed electronics owing to its environmentally friendliness and cost-effectiveness. In reverse offset printing, selecting the materials for cliché and blanket is critical because of its minimum resolution, registration errors, aspect ratio of reliefs, pattern area, and reusability. Various materials such as silicon, quartz, glass, electroplated nickel plates, and imprinted polymers on rigid substrates can be used for the reverse offset printing of cliché. However, when new structures are designed for specific applications, new clichés need to re-fabricated each time employing multiple time-consuming and costly processes. Therefore, by modifying the blanket materials containing the printing ink, several new structures can be easily created using the same cliché. In this study, we investigated various elastomeric materials and evaluated their applicability for designing a highly stretchable blanket with controlled elastic deformation to implement tunable reverse offset printing.