• Journal of Electrical Engineering and Technology
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• v.10 no.5
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• pp.2001-2008
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• 2015

This paper proposes the concept of FlexPCB(flexible Printed Circuit Board) conductive structure for electrodynamic bearings. It has three main advantages: easy “printing” of considerably thin conductive wires, resulting in potential reduction in stray eddy currents; realization of specific conductive configurations with high precision to optimize the eddy current flowing; simplicity in being wound to cylinders or hollow cylinders of different diameters. To verify this new concept, the FlexPCB conductive structure was manufactured, an axial electrodynamic bearing test rig was built and the conductive structure's induced voltage was measured along the axial displacements from 0mm to 56mm at three rotating speeds. The finite element method was used to calcuatlate the flux density of electrodynamic bearing and induced voltage of the FlexPCB conductive structure. The experimental results are compared with the results from the FEM calculation. It is concluded that the measured and calculated induced voltages have consistency in the middle part of the bearing.

• Journal of Auto-vehicle Safety Association
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• v.13 no.3
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• pp.20-25
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• 2021

Flexural resistance evaluation of FFC (Flexible Flat Cable) was performed according to the grain size of rolled copper foil by adding 0.1wt% silver (Ag) and electrodeposited copper foil by slitting method after heat-treatment. These methods are aimed at enhancing the flexural durability of the FFC by growing the grain size of copper foil. By increasing the grain size of the copper foil and minimizing the miss-orientation at grain boundaries, the residual stress at the grain boundaries of the copper foil is reduced and the durability of the FFC is improved. Maximizing an average grain size of copper foil can be got a good solution in order to enhance the durability of the FFC or FPCB (Flexible Printed Circuit Board).

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.79-85
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• 2007

This study was focused on the feasibility of ultrasonic bonding of Au stud flip chip bumps on the flexible printed circuit board (FPCB) with three different surface finishes: organic solderability preservative (OSP), electroplated Au and electroless Ni/immersion Au (ENIG). The Au stud flip chip bumps were successfully bonded to the bonding pads of the FPCBs, irrespective of surface finish. The bonding time strongly affected the joint integrity. The shear force increased with increasing bonding time, but the 'bridge' problem between bumps occurred at a bonding time over 2 s. The optimum condition was the ultrasonic bonding on the OSP-finished FPCB for 0.5 s.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.75-81
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• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.202-202
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• 2011

최근 대용량 고속송신을 위한 모바일 무선정보통신기기의 신뢰성향상 함께 광 인쇄회로기판(O-PCB)국산화개발이 진행되고 있다. 광 Rigid-MLB개발에 이어 개발추진중인 광 Flexlble PCB는 광 연결 장치는 대용량데이터를 고속 전송하는데 필수적이다. 전원접속코드를 사용하지 않는 광도파로 층으로 구성되며 전기신호를 광신호로 변환시켜 다층의 광도파로 층으로 전송시킨다. 신속한 전송을 위한 균일도금에칭기술이 요구되고 있다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.291-292
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• 2012

플렉시블 (F-PCB, Flexible Printed Circuit Board)은 얇고 유연하며 모바일, 광학, 노트북, 프린터, LCD 등 IT산업전반에 걸쳐 사용되고 있다. 통신기기가 이동용으로 전환되면서 대용량, 고속의 정보 전달이 필요하다. 인접 회로간의 전자파 차폐, 구리성분의 편석방지와 고성능의 회로소재 확보가 요구된다. 본고에서는 최근의 플렉시블 인쇄회로기판의 주석도금의 위스커방지 품질향상을 중심으로 기술하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.70-78
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• 2009

This paper addresses the analysis and the design optimization of differential interconnects for high-speed Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, and time-domain transient simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.11
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• pp.1194-1200
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• 2009

An internal antenna which has 1 cc volume was implemented on the FPCB(Flexible Printed Circuit Board) for the mobile phone. We increased antenna gain and efficiency by the applying of current direction concept on the antenna pattern for this small antenna. Short antenna length for the GSM band was compensated by the spiral inductor on the FPCB. For broadening bandwidth on GSM band, it's applied 2 spiral inductors. A conductor pattern for the DCS band was positioned perpendicular with the FPCB. Antenna was implemented on FPCB that is dielectric constant 4.4 and thickness 0.05 mm, and FPCB was attached on a carrier dimensioned $L{\times}W{\times}H=30{\times}7{\times}5\;mm$. Measurements showed that max. VSWR 2:1, efficiency 42.49~60.95 % and 47.95~73.21 %, average gain -3.72~-2.15 dBi and -3.19~-1.35 dBi on the GSM and DCS band, respectively. These results are good performances among the small antenna. And the radiation patterns are omnidirectional on the H-plane to both band.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.81-81
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• 2009

최근 휴대폰, 노트북 등과 같은 소형 멀티미디어 기기의 사용이 증가함에 따라 전자 패키징 산업은 경박단소화를 요구하고 있습니다. 더불어 전기적 신호의 손실을 줄이기 위해 전기, 전자산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(Flexible Printed Circuit Board, FPCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(Rigid Printed Circuit Board, RPCB)의 전극간 접합에 많은 관심을 보이고 있습니다. 기존에 연성인쇄회로기판과 경성인쇄회로기판을 접합하는 방식으로는 connector를 이용한 체결법이 사용되고 있지만 완성품의 부피가 커지고 자동화 공정이 힘들며 I/O 개수가 제한적이어서 신호전달에 취약한 단점이 있습니다. 또한, 최근 FPCB를 RPCB에 접합하는데 interconnection으로 이방성 도전 필름(Anisotropic conductive film, ACF) 또는 비전도성 필름(Non-conductive film)이 널리 사용되고 있습니다. 하지만 필름의 가격이 비싸고, 낮은 전기 전도도를 보이며, 신뢰성 특성이 낮다는 단점을 가지고 있습니다. 본 실험에서는 기존의 connector 방식과 접착 필름을 이용한 방식을 대체하기 위하여 솔더를 interlayer로 이용하여 열과 압력으로 접합하는 방법에 대하여 연구하였습니다. 실험에 사용된 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)이고, RPCB와 FPCB의 표면처리는 ENIG로 하였습니다. 접합 온도와 접합 시간에 따라 최적의 접합 조건을 도출하고자 하였고, 접합된 시편을 가지고 신뢰성 테스트를 진행하였습니다. $85^{\circ}C$/85% 고온고습 시험과 고온 방치 시험을 통하여 접합부의 신뢰성을 테스트 하였고, 90도 Peel test로 기계적 접합 강도를 측정하였고, 파괴 단면을 Scanning Electron Microscopy (SEM), Energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS)로 분석하였습니다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.1
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• pp.92-98
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• 2014

In this paper, the reconfigurable frequency selective surface for C-band was designed using patch array and grid structure. Frequency reconfigurability was obtained by varying the capacitance from varactor diode. From the optimized design parameters, we fabricated the reconfigurable frequency selective surface using the FPCB(Flexible Printed Circuit Board) and commercial varactor diode and measured the frequency reconfigurability for different bias voltage. From the measurement results, proposed structure has the wideband operating frequency of 6.6~7.6 GHz. We can applied this proposed structure to the smooth curved surface like as radome of aircraft or warship.