• Phonetics and Speech Sciences
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• v.7 no.4
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• pp.35-40
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• 2015

We propose a speech waveform forgery detection algorithm based on the flatness of frequency distribution. We devise a new measure of flatness which emphasizes the local change of the frequency distribution. Our measure calculates the sum of the differences between the energies of neighboring frequency bands. We compare the proposed measure with conventional flatness measures using a set of a large amount of test sounds. We also compare- the proposed method with conventional detection algorithms based on spectral distances. The results show that the proposed method gives lower equal error rate for the test set compared to the conventional methods.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.566-569
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• 2001

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude $0~250^{\circ}C$. We developed the techniques that measures and analyzes thermal uniformity using infrared thermal vision, and compensates measuring error of flatness using laser displacement sensor. For measuring flatness, we specially makes the measurement stage of 3 axes which adopts the precision encoder. The allowable error of measuring technique is less than thermal uniformity, $\pm 0.1^{\circ}C$ and flatness, $\pm 1mm$. It is expected that the developed system can measure from $\Phi$210(wafer 8") to $\Phi$356(wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.187-193
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• 2003

This paper presents an on-machine measurement method of flatness error fur surface machining processes. There are two kinds of on-machine measurement methods available to measure flatness errors in workpieces: i.e., surface scanning method and sensor scanning method. However, motion errors are often engaged in both methods. This paper proposes an idea to realize a measurement system of flatness errors and its rigorous application for estimation of motion errors of the positioning system. The measurement system is made by modifying the straightness measurement system, which consists of a laser, a CCD camera and processing system, a sensor head, and some optical units. The sensor head is composed of a retroreflector, a ball and ball socket, a linear motion guide unit and adjustable arms. The experimental .results show that the proposed method is useful to identify flatness errors of machined workpieces as well as motion errors of positioning systems.

• Speech Sciences
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• v.10 no.2
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• pp.77-84
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• 2003

In this research, we seek the beginning of the speech and detect the stationary speech region using lip information. Performing running average of the estimated speech signal in the stationary region, we reduce the effect of musical noise which is inherent to the conventional MlMSE (Minimum Mean Square Error) speech enhancement algorithm. In addition to it, SFM (Spectral Flatness Measure) is incorporated to reduce the speech signal estimation error due to speaking habit and some lacking lip information. The proposed algorithm with Wiener filtering shows the superior performance to the conventional methods according to MOS (Mean Opinion Score) test.

• Proceedings of the IEEK Conference
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• 2003.07e
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• pp.2004-2007
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• 2003

This paper describes a method of performance enhancement using Flatness Mesure(FM) for the Gaussian Mixture Model(GMM) face recognition systems. Using this measure we discard the frames having low information before training and test. As the result, the performance increases about 9％ in the lower mixtures and calculation burden is decreased. As well, the recognition error rate is decreased under the illumination change surroundings. We use the 2D DCT coefficients lot face feature vectors and experiments are carried out on the Olivetti Research Laboratory (ORL) face database.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.45 no.4
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• pp.100-106
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• 2008

In this paper we apply a discriminative weight training employing power spectral flatness measure (PSFM) to a statistical model-based voice activity detection (VAD) in various noise environments. In our approach, the VAD decision rule is expressed as the geometric mean of optimally weighted likelihood ratio test (LRT) based on a minimum classification error (MCE) method which is different from the previous works in th at different weights are assigned to each frequency bin and noise environments depending on PSFM. According to the experimental results, the proposed approach is found to be effective for the statistical model-based VAD using the LRT.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.686-689
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• 2004

As the demands of X-Y linear motors increase, it becomes very important to measure flatness errors and to compensate them. In this study, in order to investigate flatness errors, a laser interferometer is used for measurement. To improve the measurement efficiency, a Union Jack method is adopted instead of a square method. The square method is frequently used because of its accuracy, but it requires many measurement points. In this study, the Union Jack method with Grey Theory is used. By using the Grey Theory, unmeasured data are predicted, and these are compared with results of the square method. The results show that the Union Jack method with Grey Theory is accurate enough to replace the square method.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.8
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• pp.180-186
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• 2002

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8＂)\;to\;\Phi300mm$ (wafer 12＂) and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.8
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• pp.847-854
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• 2007

The battery electrode of a mobile phone is made of layered polymer coated on aluminum foils and the hot rolling process is applied to increase the density per volume of an electrode for a high capacity battery. The flatness of batteries surfaces should be less than $2{\mu}m$. To satisfy the required flatness, the deformation of roll surface due to bending and heating of the roll should be minimized. Complicated hot oil paths of $100^{\circ}C$ inside the roll are required for heating the polymer layers. FEA was used to calculate thermal deformations and temperatures distributions of the roller. Based on FEA, a modified surface curvature called a crown roll was suggested and this gave the area of 30% improved flatness compared with a flat roll. The flat roll satisfied the flatness of $2{\mu}m$ in the length of 340 mm and the crown roll resulted in the longer length of 460 mm. Experiments to measure the temperature distribution and thermal strain were performed and compared with FEA. There were only 6% difference between two results.

• Journal of Digital Contents Society
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• v.5 no.4
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• pp.251-256
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• 2004

The flatness of a silicon wafer concerned with ULSI chip is one of the most critical parameters ensuring high yield of wafers. That is necessary to constitute the circuit with high quality for he surface of silicon wafer, which comes to be base to make the direct circuit of the semiconductor, Flatness, therefore, is the most important factor to guarantee it wafer with high quality. The process of polishing is one of the most crucial production line among 10 processing stages to change the rough surface into the flatnees with best quality. Currently at this process, it is general for an engineer in charge to observe, judge and control the model of wafer from the monitor of measuring equipment with his/her own eyes to enhance the degree of flatness. This, however, is quite a troublesome job for someone has to check of process by one's physical experience. The purpose of this study is to approach the model of wafer with digital contents and to apply the result of the research for an algorithm which enables to control the polishing process by means of measuring the degree of flatness automatically, not by person, but by system. In addition, this paper shows that this algorithm proposed for the whole wafer flatness enables to draw an estimated algorithm which is for the thickness of sites to measure the degree of flatness for each site of wafer.