• International Journal of Air-Conditioning and Refrigeration
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• 제9권2호
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• pp.69-76
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• 2001

The purpose of this research is to investigate the thermal performance of embossing surface sandwich panel and flat surface sandwich panel. To do this research, thermal performances in summer season at the six points of embossing surface sandwich panel and flat surface sandwich panel are investigated focusing on the temperature. Three kinds of embossing surface sandwich panel and one kind of flat surface sandwich panel are used for this research. At the same size of sandwich panel, the average temperature differences of flat surface sandwich panel between average temperature at the 0.5 mm below copper plate and average outside air temperature and surface temperature are higher than those of embossing surface sandwich panel. The average heat transfer rate of flat surface sandwich panel in higher than that of embossing surface sandwich panel. More study will be needed about the size of diameter and height of embossing, and materials of embossing surface sandwich panel.

• 설비공학논문집
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• 제12권10호
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• pp.917-924
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• 2000

The purpose of this research is to investigate the thermal performance of embossing surface sandwich panel and flat surface sandwich panel during the summer. To do this research, thermal performances in summer season at the six points of embossing surface sandwich panel and flat surface sandwich panel are investigated focusing on the temperature. Three kinds of embossing surface sandwich panel and one kind of flat surface sandwich panel are used for this research. At the same size of sandwich panel, the average temperature differences of flat surface sandwich panel between average temperature at the 0.5 mm below copper plate and average outside air temperature and surface temperature are higher than those of embossing surface sandwich panel. The average heat transfer rate of flat surface sandwich panel is higher than that of embossing surface sandwich panel. More study will be needed about the size of diameter and height of embossing, and materials of embossing surface sandwich panel.

• 대한기계학회논문집A
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• 제25권1호
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• pp.115-126
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• 2001

In this paper, through a series of comparative experiments, effects of two different cure processing methods, cocure and precure, on the mechanical properties of honeycomb core materials for aircraft applications are considered. Mass of moisture accumulated into the closed cells of the sandwich panel specimen from the measured mass of moisture diffused to the full saturation state into the elements(skin, adhesive layer, Nomex honeycomb), consisting the honeycomb sandwich specimen has been calculated. Water reservoir of 70$\^{C}$ was used to have specimens absorb moisture to see the influence of moisture absorbed into sandwich panel on its mechanical properties. For the repair condition holding for 2 hours at 177$\^{C}$(350℉) temperature, a pressure due to the vapor expansion in each cell of the sandwich panel, which may result in the local separation of the interface between laminated skin and the surface of the honeycomb, has been estimated by vapor pressure-temperature relation from the thermodynamic steam table and compared to the pressure from the ideal gas state equation. The bonding strengths of the laminated skins on the flat surface of the Nomex honeycomb have been compared by the flatwise tension test and climbing drum peel test performed at room temperature for dry, wet and wet-repair specimens, respectively.