• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1506-1511
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• 2003

The present study proposes a new structure for a flat plate heat pipe which could embody a thin thickness, any shapes and high heat density a unit area. It is on the structure for the formation of vapor passages and the support of the case of the flat plate heat pipe. A screen mesh is used as the one. To verify the validity of the one, the flat plate heat pipe of 1.08mm thickness was made with a layer of the screen mesh with 14 and 100 mesh number respectively and tested. Here the screen mesh with 14 mesh number plays a role of the vapor passage and the support of the case and the screen mesh with 100 mesh number functions as the wick structure. T he results show that the screen mesh excellently carries out the function of the vapor passage and the support of the case.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1406-1411
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• 2004

A series of experiments was conducted to examine characteristics of a grooved flat-strip heat pipe having multiple heat sources. The inner grooves of the heat pipe have the aspect ratio of 1 to $2.5(0.42{\times}1.05$ mm) whose pitch was 0.6 mm. Four block heaters ($10{\times}20$ mm) were placed in the evaporator section at intervals of 20 mm and six different heating modes were tested. The maximum surface heat flux of 80 $W/cm^2$ was achieved while the operating temperature was kept below $100^{\circ}C$, In the nearest heating mode (from the condenser location), the heat pipe exhibited more stable temperature distribution than the far heating mode where the heaters is located furthest from the condenser.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.11
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• pp.755-759
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• 2016

The use of heat pipes in the electronic telecommunication field is increasing. Among the various types of heat pipes, the thin flat heat pipe has relatively high applicability compared with the circular heat pipe in the electronic packaging application. The thin flat heat pipe based on extrusion fabrication has a simple capillary wick structure consisting of rectangular cross sectional grooves on the inner wall of the pipe. Although the groove serves as a simple capillary wick, and many such grooves are provided on the inner wall, it is difficult for the grooves to realize a sufficiently high capillary force. In the present study, a thin flat heat pipe with a wire bundle was developed to overcome the drawback of poor capillary force in the thin flat heat pipe with grooves, and was evaluated by conducting tests. In the performance test, the thin flat heat pipe with the wire bundle showed a lower thermal resistance of approximately 3.4 times, and a higher heat transfer rate of approximately 3.8 times with respect to the thin flat heat pipe with grooves as the capillary wick respectively. The possibility of using the wire bundle as a capillary wick in the heat pipe was validated in the present study; further study for commercializing this concept will be taken up in the future.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.635-639
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• 2007

In this study, optimal design and test of flat-plate heat pipe were carried out in order to improve both thermal response and surface temperature uniformity of heating plate. Experimental results show that the thermal response of flat-plate heat pipe is faster than that of a conventional heating type ones along with less weight and cost. The surface temperature uniformity is also improved.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.30.2-30.2
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• 2005

• Journal of the Korean Society of Visualization
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• v.14 no.3
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• pp.15-21
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• 2016

The circular and flat heat pipe were experimentally investigated by using neutron imaging technique. This experimental study was performed at the DINGO of OPAL research reactor, Australia. The diameter of the circular heat pipe is 10 mm and the dimension of flat is $10(width){\times}3(thickness)mm2$, respectively. We used the distilled water as a coolant. The coolant distributions and 2-phase flow patterns were measured under heating conditions. Experimental results show that neutron imaging technique is a good tool to visualize the 2-phase flow and phenomena in the heat pipe. The coolant distributions and 2-phase flow patterns depend on installation posture of the heat pipe and volume ratio of the coolant. Finally, it was discussed to calculate the void fraction by neutron imaging technique.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2113-2118
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• 2007

In this study, a mathematical model for a thermal analysis of a flat heat pipe with a grooved wick structure is presented. The effects of the liquid-vapor interfacial shear stress, the contact angle, and the amount of liquid charge have been included in the proposed model. In particular, the axial variations of the wall temperature and the evaporation/condensation rates are considered by solving the one-dimensional conduction and the augmented Young-Laplace equations, respectively. In order to verify the model, the results obtained from the model are compared to existing experimental data.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.360-364
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• 2001

Numerical Aanlysis is made on the thermal performance of micro heat pipe in a axial flat grooved channel. The flow of liquid and vapor is investigated in trapezoidal grooves and the effect of variable shear stress along the interface of the liquid and vapor considered. The results from this study are obtained in the axial variation of pressure difference between vapor and liquid, contact angle, velocity of liquid and vapor and so forth. In addition, maximum heat transport capacity of micro-heat pipe is provided by varying the operation temperature, and compared with that from Schneider and Devos's model in which the interfacial shear stress is neglected.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2369-2374
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• 2008

In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ${\pm}1.5%$ during heating to $120^{\circ}C$. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type(300mm) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various liquids(aceton, FC-40, water) were used as the working fluid and charging ratio was changed($14{\sim}36\;vol.%$). Several cases were tested to improve temperature uniformity. Major working fluid to be investigated was water. Using water, various parameters such as charging ratio, wafer operation on-off time, different working fluids. In case of water, the temperature uniformity was ${\pm}1.5%$, response time of wafer were investigated.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.