• Journal of the Computational Structural Engineering Institute of Korea
• /
• v.27 no.5
• /
• pp.413-420
• /
• 2014

The purpose of this study is to experimentally investigate the shear behavior of flat plate that reinforced by embedded GFRP(glass fiber reinforced polymer) plate with openings. Shape of the GFRP shear reinforcement is a plate with several openings to ensure perfect integration with concrete. The test was performed on 7 specimens to check shear strength of flat plate that reinforced by GFRP plate. The parameters include the spacing of the shear reinforcement and amount of the shear reinforcement. The result of test showed that when amount of shear reinforcement was increased, shear strength improved. The result of test showed that maximum shear strength was confirmed when spacing of shear reinforcement was 0.3d. The calculation of the shear strength of reinforced flat plate with GFRP plate based on the KCI was compared with the test results.

• Journal of the Computational Structural Engineering Institute of Korea
• /
• v.27 no.4
• /
• pp.247-254
• /
• 2014

In this study, shear test performed to investigate the shear behavior of flat plate that reinforced by embedded GFRP(glass fiber reinforced polymer) plate with openings. Shape of the GFRP shear reinforcement is a plate with several openings to ensure perfect integration with concrete. The test parameters include the distance between the column face and the first line of GFRP plate and number of GFRP plate vertical strip. The result of test showed that when number of GFRP plate vertical strip was increased, shear strength improved. The shear strength for flat plate reinforced GFRP plate in various codes including ACI 318, BS 8110, EUROCODE 2, and KCI were compared to provide more rational approach for reinforced concrete flat plates with GFRP plate.

• Information Display
• /
• v.5 no.1
• /
• pp.25-30
• /
• 2004

Poly-Si TFT(Thin Film Transistor) technology are reviewed and discussed. Poly-Si TFTs fabricated on glass using low-temperature process were studied extensively for the application to LCD (Liquid Crystal Display) as well as to OLED(Organic Light Emitting Diode) Display. Currently, one of the application targets of the poly-Si TFT is emphasized on the highly functional SOG(System on Glass). Improvement of device characteristics such as an enhancement of carrier mobility has been studied intensively by enlarging the grain size. Reduction of the voltage and shrinkage of the device size are the trend of AM FPD(Active Matrix Flat Panel Display) as well as of Si LSI, which will arise a peculiar issue of uniformity for the device performance. Some approaches such as nucleation control of the grain seed or lateral grain growth have been tried, so far.

• 제어로봇시스템학회:학술대회논문집
• /
• 2004.08a
• /
• pp.1565-1567
• /
• 2004

Various defects are found in FPD (Flat Panel Display) manufacturing process. So detecting these defects early and reprocessing them is an important factor that reduces the cost of production. In this paper, the bare glass inspection system for the FPD which is the early process inspection system in the FPD manufacturing process is designed and implemented using the high performance and accuracy CCD line scan camera. For the preprocessing of the high speed line image data, the Image Processing Part (IPP) is designed and implemented using high performance DSP (Digital signal Processor), FIFO (First in First out), FPGA (Field Programmable Gate Array) and the Data Management and System Control part are implemented using ARM (Advanced RISC Machine) processor to control many IPP and cameras and to provide remote users with processed data. For evaluating implemented system, experiment environment which has an area camera for reviewing and moving shelf is made.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08b
• /
• pp.1545-1546
• /
• 2007

Zinc gallate-based RGB phosphors and vertically aligned carbon nanotube emitters are prepared for flat field-emission lamp. The blend phosphors of blue $ZnGa_2O_4$, green $ZnGa_2O_4:Mn^{2+}$ and red $ZnGa_2O_4:Cr^{3+}$ are coated on the front glass, and the carbon nanotubes are chemically bonded on the rear ITO glass as a cathode.

• Proceedings of the KIEE Conference
• /
• 2006.10c
• /
• pp.579-581
• /
• 2006

Flat panel image display devices such as TFT LCD and PDP have required more large area and high quality control components. To control the qualities of the components, measurements of the flatness of a plate glass has been required. In order to measure the shape of the specular objects, Non-Contact Optical Sensor using Hologram laser unit was proposed. The sensor has a optical system that is composed of a Hologram laser and objective lens. The temperature of the sensor body is controlled by TEC(Thermoelectric Cooler) to maintain the same wavelength of the diode laser. In this research, we proposed the calibration scheme to make sensor real time measuring sensor. From the experimental results we see that the proposed sensor unit can measure the position of the glass surface in rial time.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.45-48
• /
• 2006

Effectiveness and its possibility of ELA (Excimer Laser Annealing) for advanced Si TFT system on insulator are described. Currently, extensive study is carried out to realize an advanced SoG (System on Glass) based on LTPS (Low Temperature Poly-Si) technique. By reducing further the process temperature and by improving the fabrication process of LTPS, addressing TFT circuits for FPD (Flat Panel Display) can be mounted onto a flexible plastic as well as onto a glass substrate. Functional devices on the insulating panels are developed to be formed by using ELA. Although technical issues are remained for the fabrication process, Si transistors including 3D TFT structure formed by ELA is expected as a functional Si system on insulator in the ubiquitous IT era.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2003.07a
• /
• pp.1005-1008
• /
• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.18 no.9
• /
• pp.2396-2403
• /
• 1994

An experimental study on material characterization and mechanical properties of SMC(Sheet Molding Compounds) compression method parts was carried out. Simple compression test using grease oil as a lubricant was carried out to characterize flow stress of SMC at elevated temperatures. Two different mold temperatures, $130^{\circ}C{\;}and{\;}150^{\circ}C$ and two different mold speeds, 15, 45 mm/min were used for preparing the specimen of SMC compression molded parts. Surface roughness, tensile, and 3-point bending tests were used to determine the effects of molding temperatures and speeds on mechanical properties of compression molded SMC parts. Orientation and distribution of glass fiber in the compression molded SMC parts were also investigated by photographing the burnt flat specimen and taking SEM(Scanning Electron Microscope) of cross-sectional T-specimen.

• Journal of the Korean Society for Precision Engineering
• /
• v.12 no.11
• /
• pp.36-44
• /
• 1995

When sliding a hard cylinder along the surface of glass, periodic surface cracks appear on the flat surface due to tensile stresses induced by the slider. These cracks propagate into the substrate and will affect the fracture properties of a body. Crack spacings and the directions of crack propagation into glass were calculated numerically by applying the finite element method and linear elastic fracture mechanics. The calculated crack spacings were in the range of the experimental results. Stress intensity factors and crack extension angles depended on the radius of slider and the load, and from these two factors the possible directions of crack propagation were calculated. The calculated propagation directions were in good agreement with real crack propagation.