• Proceedings of the Korean Society of Crop Science Conference
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• 2017.06a
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• pp.300-300
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• 2017

'Saemimyeon' a Tongil-type rice variety (Indica ${\times}$ Japonica), which contains high amylose contents is suitable for rice noodle production. Nowadays, the major parts of rice processing industry that includes products like rice flour and noodles are expected to partially replace wheat flour market. The volume of rice noodle market is getting bigger and can contribute to the rice surplus and farmer's income. This study was carried out to promote productivity and flour-making quality of 'Saemimyeon' by finding the most suitable transplanting and harvesting times. The transplanting days used were May $10^{th}$, May $17^{th}$, May $24^{th}$, May $31^{th}$, June $7^{th}$ and June $14^{th}$ and the planting distance used was 30 x 12cm. In addition, harvesting time was determined by days after heading time (40, 45, 50, 55 and 60 days). The field experiment was conducted at the experimental field in Miryang (Southern plain area of Korea) from 2015 to 2016. Our results suggest that the optimum transplanting days were from May $24^{th}$ to May $31^{th}$ which resulted to an average yield of 748~751kg/10a. Interestingly, yield was sharply decreased below 700kg/10a before May $10^{th}$ and after June $7^{th}$. The average grain filling rate before May $31^{th}$ was more than 83% but it declined to 75% after June $7^{th}$. The average temperature ranges from heading time to harvesting time was $ 21\sim25^{\circ}C$ and the estimated optimal temperature was $23.4^{\circ}C$ which is similar to May $24^{th}$ by regression equation. We found that the optimal harvest time was 45~50 days after heading time. It is hypothesized that low temperature at seed maturation time caused the lower grain filling rate therefore 'Saemimyeon' need to be transplanted before May $31^{th}$ for higher productivity. We found no statistical variation in amylose contents among experimental plots (28.2~30.4%). We conclude that the productivity of 'Saemimyeon' highly depends on temperature that is critical for grain filling stage controlled by transplanting time.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.140-140
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• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Journal of Korean Tunnelling and Underground Space Association
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• v.12 no.1
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• pp.75-85
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• 2010

The focus of this study is to evaluate the field applicability of the newly developed inorganic thixotropic-grout in various ways. In order to do this, the volume stability and the permeability of the inorganic thixotropic-grout have been measured and compared to the existing silica type grouts. In addition, the filling capability of the grout into the tail void has been evaluated through both an experiment with a miniature tail-void filling equipment and a test filling at the shield TBM construction site. The volume loss of the inorganic thixotropic-grout after a 14 day-curing under the atmosphere condition was appeared to be minimal. The excellent waterproofing ability of the inorganic thixotropic-grout was confirmed through a permeability test. The toxicity of the inorganic thixotropic-grout has been evaluated through a toxicity test of aquatic fishes (KS M 0111) and the pH value of the liquid eluviated from inorganic thixotropic-grout was measured as an average of 8.0 and a fatality rate of goldfish after 96 hours was 10% or so. The existence of harmful heavy metals in the liquid eluviated from the inorganic thixotropic-grout has been also examined through an atomic absorption spectroscopy (AAS) test. Any of harmful heavy metals were not detected and the detected level of $Cr^{6+}$ and Cd was far below the standard. Based on both an experiment with a miniature tail-void filling equipment and a test filling at the shield TBM construction site, the filling ability of inorganic thixotropic-grout into the tail void was proved to be excellent.

• Transactions of the Korean hydrogen and new energy society
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• v.31 no.4
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• pp.345-350
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• 2020

Hydrogen is an green energy without pollution. Recently, fuel cell electric vehicle has been commercialized, and many studies have been conducted on hydrogen tanks for vehicles. The hydrogen tank for vehicles can be charged up to 70 MPa pressure. In this study, the change in filling time, pressure, and temperature for each hydrogen level in a 59 L hydrogen tank was predicted by numerical analysis. The injected hydrogen has the properties of real gas, the temperature is -40℃, and the mass flow rate is injected into the tank at 35 g/s. The initial tank internal temperature is 25℃. Realizable k-epsilon turbulence model was used for numerical analysis. As a result of numerical analysis, it was predicted that the temperature, charging time, and the mass of injected hydrogen increased as the residual capacity of hydrogen is smaller.

• Journal of Power System Engineering
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• v.4 no.3
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• pp.19-24
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• 2000

This study concerns the performance of the heat transfer of the thermosyphon having 80 internal groove in which boiling and condensation occur. Distilled water has been used as a working fluid. The liquid filling as the ratio of working fluid volume to total volume of thermosyphon has been used as the experimental parameters. The heat flux and heat transfer coefficient at the condenser are estimated from the experimental results. The experimental results have been assessed and compared with the existing theories. As a result of the experimental investigation, the maximum heat flow rate in the thermosyphon is proved to be dependent upon the liquid fill quantity. relatively high rates of heat transfer have been achieved operating in the thermosyphon with the internal groove. Also, a thermosyphon with the internal groove can be used to achieve some inexpensive and compact heat exchangers in low temperature. In addition, overall heat transfer coefficients and the characteristics as an operating temperature are obtained for the practical applications.

• Nuclear Engineering and Technology
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• v.52 no.8
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• pp.1714-1723
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• 2020

This study aims at characterizing the rheological properties of uranium oxide powders for nuclear fuel pellets manufacturing. The flowability of these powders must be compatible with a reproducible filling of press molds. The particle size distribution is known to have an impact on the rheological properties and fine particles (<100 ㎛) are suspected to have a detrimental effect. In this study, the impact of the particle size distribution on the rheological properties of UO₂ powders was quantified, focusing on the influence of fine particles. Two complementary approaches were used. The first approach involved characterizing the powder in a static state: density, compressibility and shear test measurements were used to understand the behavior of the powder when it is transitioned from a static to a dynamic state (i.e., incipient flow conditions). The second approach involved characterizing the behavior of the powder in a dynamic state. Two zones, corresponding to two characteristic behaviors, were demonstrated for both types of measurements. The obtained results showed the amount of fines should be kept below 10 % wt to ensure a robust mold filling operation (i.e., constant mass and production rate).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.5
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• pp.735-745
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• 1997

In this study, the compressibility of resin was considered in filling analysis to account for the possible packing type flow. A numerical simulation program employing a hybrid finite element/finite difference scheme was developed to solve Hele-Shaw flow of the compressible viscous fluid at non-isothermal conditions. To advance the melt front, a control volume approach was adopted. Thin complex 3-D shapes of cavities, runners, and sprues were discretized by employing triangular, cylindrical and/or rectangular strip elements. Mass conservation was applied to each control volume to solve for the pressure distribution. Directly applying a constant mass flow rate at the inlet removes calculation of the apparent pressure boundary conditions, resulting in better simulation condition. The Cross model was used to model viscosity and the Tait equation was employed to represent density as a function of temperature and pressure. The validity of the developed program was verified through comparisons with available data in the literature and the effect of compressibility on the pressure distribution was discussed. To reduce computation time, 1-D and 2-D elements were used instead of applying triangular elements and the numerical results were compared to each other.

• Journal of Korea Foundry Society
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• v.40 no.2
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• pp.34-42
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• 2020

The effects of the initial balancing pressure, filling pressure and maximum build-up pressure on the casting characteristics of the thick-wall thickness casting during the counter-pressure casting process were investigated. Water model experiment and a computer simulation were carried out to evaluate the characteristics during the filling and solidification stages in counter-pressure casting (CPC); as a reference, the low-pressure casting (LPC) process was used. The average dendrite cell size decreased with an increase in the solidification rate and maximum build-up pressure. A turbulent flow occurred during the filling stage of the LPC process, resulting in the formation of inner gas, while a lamellar flow pattern dominated during the CPC process and was more evident with an increase in the initial balancing pressure, improving the mechanical properties of the castings.

• Korea-Australia Rheology Journal
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• v.21 no.3
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• pp.193-200
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• 2009

We present a direct simulation technique for two-dimensional mold-filling simulations of fluids filled with a large number of circular disk-like rigid particles. It is a direct simulation in that the hydrodynamic interaction between particles and fluid is fully considered. We employ a pseudo-concentration method for the evolution of the flow front and the DLM (distributed Lagrangian multipliers)-like fictitious domain method for the implicit treatment of the hydrodynamic interaction. Both methods allow the use of a fixed regular discretization during the entire computation. The discontinuous Galerkin method has been used to solve the concentration evolution equation and the rigid-ring description has been introduced for freely suspended particles. A buffer zone, the gate region of a finite area subject to the uniform velocity profile, has been introduced to put discrete particles into the computational domain avoiding any artificial discontinuity. From example problems of 450 particles, we investigated the particle motion and effects of particles on the flow for both Newtonian and shear-thinning fluid media. We report the prolonged particle movement toward the wall in case of a shear-thinning fluid, which has been interpreted with the shear rate distribution.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.9A
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• pp.998-1004
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• 2004

In this paper we propose a discrete bit-loading algorithm that maximizes the transmit bit rate using the channel information. to optimize the performance of the very high-speed digital subscriber line(VDSL) system under the constraint of a maximum transmit power for each user. When the power level of crosstalk is high, the power allocation of a user changes the crosstalk experienced by the other users in the same binder. In this case, the performance of DSL modems can be improved by jointly considering the bit and power allocation of all users Simulation results shows that the proposed method improves the performance compared With that of iterative water-filling method.