• Applied Microscopy
• /
• v.28 no.4
• /
• pp.435-446
• /
• 1998

It is suggested that Urechis unicinctus is a filler feeder as like many tide and watery invertebrates which filtrate food materials by ciliary movement. However, the structure of the filter is not yet known in U. unicinctus, nor the filtering mechanism is not well understood. This study reveals ciliated epithelial cells in the foregut and the features of the cilia are good accord with that of known filtrating apparatus of other tide animals. This may implies that the foregut is in function of filtration and the food materials are filtrated by the ciliary movement. With the observation of the filtrating apparatus in the foregut, the intestine of U. unicinctus can be functionally compartmented into 3 parts. These are already known midgut and hindgut in function of digestion and respiration respectively, and the foregut in function of filtrating apparatus for foods. The filtrating apparatus of U. unicinctus is composed of the pseudostratified columnar epithelial cells with numerous cilia. The cilia are well differentiated kinocilia with the typical microtubule pattern, kinetosome and cilia roots. There are two kinds of striated cilia roots, the main root and the accessory root. The main root is extended perpendicularly from the cell surface to basement membrane and the short accessory root is branched with an acute angle of about $80^{\circ}$ from the main root at level of basal plate of the kinetosome. The spacial approaches of the main root with the large fused form of mitochondria is one of the characteristic features which might be in structural consideration an intimate association between energy source and energy mass consuming cell organelles.

• The KIPS Transactions:PartA
• /
• v.12A no.2 s.92
• /
• pp.103-108
• /
• 2005

The purpose of numerical analysis is to design an effective algorithm to realize some mathematical model on computer. In general the approximate value, which is obtained from computer operation, is not the same as the real value that is given by mathematical theory. Therefore the mr estimate measuring how approximate value is near to the real value, is the most significant task to evaluate the efficiency of algorithm. The limit of an error is used for mr estimation at the most case, but the exact mr evaluation could not be expected to get for there is no way to know the real value of the given problem. Wegmann's method has been researched, which is one of the solution to derive the numerical conformal mapping. We proposed an improved method for convergency by applying a low frequency filter to the Wegmann's method. In this paper we investigate error analysis based on some mathematical theory and propose an effective method which makes us able to estimate an error if the real value is not acquired. This kind of proposed method is also proved by numerical experiment.

• Journal of the Korean institute of surface engineering
• /
• v.49 no.2
• /
• pp.218-224
• /
• 2016

Thermal radiation pastes were prepared by dispersing carbon materials as fillers with a content of 1 weight percent in an acrylic resin. The kind of fillers was as follows; $25{\mu}m$ graphite, $45{\mu}m$ graphite, $15{\mu}m$ carbon nanotube(CNT), a 1:1 mixture of $25{\mu}m$ graphite and $15{\mu}m$ CNT, and a 1:1 mixture of $45{\mu}m$ graphite and $15{\mu}m$ CNT. Thermal emissivity was measured as 0.890 for the samples with graphite only, 0.893 for that with CNT only, and 0.892 for those containing both. After coating prepared pastes on a side of 0.4 mm thick aluminium plate and placing the plate over an opening of a box maintained at $92^{\circ}C$ with the coated side out, the temperatures on the uncoated side of the plates were measured. The samples containing graphite and CNT showed the lowest temperatures. The paste with mixed fillers was coated on the back side of the PCB of an LED module and thermal analysis was carried out using Thermal Transient Tester (T3ster) in a still air box. The thermal resistance of the module with coated PCB was measured as 14.34 K/W whereas that with uncoated PCB was 15.02 K/W. The structure function analysis of T3ster data revealed that the difference between junction and ambient temperatures was $13.8^{\circ}C$ for the coated case and $18.0^{\circ}C$ for the uncoated. From the infrared images of heated LED modules, the hottest-spot temperature of the module with coated PCB was lower than that of the uncoated one for a given period of LED operation.

• Restorative Dentistry and Endodontics
• /
• v.29 no.3
• /
• pp.249-266
• /
• 2004

The purpose of this study was to determine whether pH and time has any influence on the degradation behavior of composite restoration by analyzing the leached monomers of dental composites qualitatively and quantitatively after storage in acetate buffer solution as a function of time using high performance liquid chromatography (HPLC) / mass spectrometer. Materials and Methods：Three commercial composite restorative resin materials (Z-250, Heliomolar and Aeliteflo) with different matrix structure and filler composition were studied. Thirty specimens (7mm $diameter{\times}2mm$ thick) of each material were prepared. The cured materials were stored in acetate buffer solution at different pH (4, 7) for 1, 7 and 45days. As a reference, samples of unpolymerized composite materials of each product were treated with methanol (10mg/ml). Identification of the various compounds was achieved by comparison of their mass spectra with those of reference compound, with literature data. and by their fragmentation patterns. Data were analysed statistically using ANOVA and Duncan's test. Results：1. Amounts of leached TEGDMA in Aeliteflo were significantly larger than those of UDMA in Z-250 and Heliomolar at experimental conditions of different storage time and pH variation (p<0.001). 2. As to comparison of the amounts of leached monomers per sorage time, amounts of leached TEGDMA in Aeliteflo and UDMA in Z-250 and Heliomolar were increased in the pH 4 solution more significantly than in the pH 7 solution after 1day, 7days and 45days, respectively (p<0.001). 3. In total amounts of all the leached monomers with storage times, the overall amounts of pH 4 extracts were larger than those of pH 7 extracts for all resin groups, but there was no significant difference (p>0.05).

• Resources Recycling
• /
• v.3 no.3
• /
• pp.27-31
• /
• 1994

We tested the limestone sludge produced in Pohang Iron & Steel Co., Ltd. as a filler powder for the effective use of portland cement. Hydration process was investigated by measuring the hydration rate, the amounts of non-evaporable water and compressive strength of cement-limestone sludge paste prepared by mixing limes-tone sludge with cement. The results obtained in this study can be summarized as follows: 1. There is no significant difference between the cases of adding up to 10% limestone sludge and those of unmixed cement system. However the reaction rate increases in the 5% limestone sludge system(due to the effects of fine). 2. The compressive strength increases proportionally with increasing the measured amount of non-evaporable water, Adding 5% limestone sludge also increases the strength a little higher, and the compressive strength and calcium silicate hydrates. In the case of the mixed limestone sludge, $2\theta$=$11.7^{\circ}$ peak appears in the samples of 28 days hydration. This peak indicted the presence of calcium carboaluminate hydrate. Although limestone sludge is generally regarded as a inert materials, some kinds of cement can produce a calcium carboaluminate by reacting with aluminate in cement pastes.

• Resources Recycling
• /
• v.23 no.4
• /
• pp.69-74
• /
• 2014

Slags generated in the smelting reduction of deep sea manganese nodule could be utilized as an additional materials for making Fe-Si-Mn alloys by mixing with cokes and re-smelting at an arc furnace. In this re-melting process slag is also generated, and the secondary slag is treated as waste. In this survey, recycling of the waste slag of Mn nodule was studied. It is tried to utilize the waste slag as ceramic materials or construction materials. However, it is difficult to use the waste slag directly as an additional material to ceramics such as portland cement or castable refractory material due to the much difference of chemical compositions. As an altercation road constructing material is considered, and toxicity on the soil of the waste slag was tested according to Korean Standard for testing permissible amount of toxic substances. The test result was satisfied with the requirements on the standard. So, it should be suggested that the waste slag of the Mn nodule could be utilized as constructing materials such as road filler or base materials.

• Electrical & Electronic Materials
• /
• v.10 no.6
• /
• pp.519-527
• /
• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.242-242
• /
• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.24 no.10
• /
• pp.834-838
• /
• 2011

This research shows the electrical characteristic using excellent epoxy nano-composite of MgO 5.0 wt% and $SiO_2$ 0.4 wt% in mechanical strength test depending on nano-additive. First of all, volume resistance depending on nano-additive and temperature using high resistance meter (HP. 4329A) by increasing 10, 100, 1,000 V of applying voltage was measured. Moreover, temperature range of $25{\sim}120^{\circ}C$ with virgin sample was tested using TO-9B oven by Ando Company. The result showed that virgin and the samples added with MgO and $SiO_2$ had similar value of volume resistance in low temperature and low electric field region and reduced with slow slope. The nano-composite's volume resistance of sample added with MgO and $SiO_2$ had higher value than virgin sample's volume resistance in high temperature region more than $80^{\circ}C$. Moreover, the slope has steeply reduced. The volume resistance of sample added with MgO 5.0 wt% was $8.38{\times}10^{13}\;{\Omega}{\cdot}cm$ and it was 6.8 times more than virgin sample in high temperature at $120^{\circ}C$. The insulation characteristics were constant although filler has changed in low temperature region. But, in high temperature region, the value of volume resistance of sample with MgO 5.0 wt% was 7.6 times more than the virgin sample's volume resistance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.11a
• /
• pp.126-127
• /
• 2007

Sn-filled and Fe-doped $CoSb_3$ skutterudites were synthesized by encapsulated induction melting. Single ${\delta}$-phase was successfully obtained by subsequent annealing and confirmed by X-ray diffraction analysis. Temperature dependences of Seebeck coefficient, electrical resistivity and thermal conductivity were examined from 300 K to 700 K. The positive Seebeck coefficient confirmed the p-type conduction. Electrical resistivity increased with increasing temperature, which shows that the $Sn_zCo_3FeSb_{12}$ skutterudite is highly degenerate. Thermal conductivity was reduced by Sn-filling because the filler atoms acted as phonon scattering centers in the skutterudite lattice. Thermoelectric figure of merit was enhanced by Sn filling and its optimum filling content was considered to be z=0.3 in the $Sn_zCo_3FeSb_{12}$ system.