• Korean Journal of Materials Research
• /
• v.7 no.4
• /
• pp.295-302
• /
• 1997

금속분말 Fe와 Si에 KNO$_{3}$(Fe+Si)무게비=0.2로 점화촉매 KNO$_{3}$를 혼합하고 50MPa로 성형한 후 점화시키는 비기체연소합성(SHS; Self propagating High temperature Synthesis)법으로 출발 분말을 얻었다. 점화분위기를 공기 및 Ar으로 한 경우 XRD결과에서 특별한 차이가 없었고 두 경우 모두 SiO$_{2}$피크가 검출되었다. 합성된 분말을 성형한 후 119$0^{\circ}C$환원분위기에서 소결하고 포석온도이하에서 열처리하여 반도성 FeSi$_{2}$가 주상인 Fe-Si계 열전재료를 제조하였다. Fe/Si무게비=46/54,44/56 및 42/58시편의 제벡계수는 Si함량이 증가할수록 증가하였다. 점화후의 세척처리를 2단계로 하는 경우 제벡계수의 부호가 변화하여 p-type에서 n-type으로 변화하며 소결밀도가 크게 상승하였다. 조성에 관계없이 공통적으로 발견되는 SiO$_{2}$는 점화시의 분위기보다는 점화촉매에 포함된 K성분이 소결 및 열처리시 산화제로 작용하여 형성되는 것이 확인되었다.

• Korean Journal of Materials Research
• /
• v.6 no.10
• /
• pp.1043.2-1048
• /
• 1996

자기기록의 고밀도화로 인해 보자력(Hc)이 큰 자기기록매체가 필요하게 되었다. 고보자력매체에 신호를 충분히 기록하기 위해서는 보다 강한 자장이 필요하다. 이 때문에 포화자화(Ms)가 큰 재료가 필요하며 고주파 영역에서 실효투자율($\mu$eff)이 높아야 한다. Fe계 합금박막은 이에 적합한 재료이다. 본 연구에서는 Fe의 결정자기이방성에 영향을 미치는 Si과 Fe의 격자 변형을 유도할 수 있는 B를 첨가하였다. Fe-B-Si 계 박막을 질소분위기 중에서 RF Matnetron Sputter로 제작하여 연자기적 특성에 관하여 고찰하였다. Fe91.49B4.01Si4.50at% 박막은 35$0^{\circ}C$에서 1시간 열처리를 행함으로써 약 900(10MHz) 정도의 투자율과 7.6Oe의 보자력을 나타냈으며 포화자화는 1300emu/㎤를 얻었다.

• Korean Journal of Materials Research
• /
• v.1 no.4
• /
• pp.198-205
• /
• 1991

Sintered thermistor body was fabricated by solid reaction method using $Fe_2O_3, \;Al_2O_3, \;TiO_2$ and Si powder. Surface matrix of sintered body was investigated by SEM and $\beta$-constant was obtained from measurement of resistance variation in liquid bath. The values of thermistor constant $\beta$ of samples in the temperature range $-50~+50^{\circ}C$ were distributed from 927 to 4005k. This thermistor body can be used as temperature sensor for radiosonde.

• Journal of Korea Foundry Society
• /
• v.24 no.5
• /
• pp.295-303
• /
• 2004

The effects of three minor elements, S, Ce and Bi, on the inoculation ability and fading behavior of 1.0 wt%Ba-Fe-Si were investigated through thermal analysis. The performance of 1.0 wt%Ba-Fe-Si inoculant was better and more consistant at the high temperature range of $1,450{\sim}1,500^{\circ}C$ than that of low one of $1,300{\sim}1,400^{\circ}C$. That was improved with individual addition of three minor elements. The optimum amount of addition was 1.0% of the weight of inoculant added, respectively. That was improved also by the simultaneous addition of two or three kinds of minor elements. Even though worse with the addition of two kinds of them simultaneously than with individual addition, that was improved with the simultaneous addition of all three kinds over that with the individual one.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.9 no.1
• /
• pp.16-22
• /
• 2008

We fabricated thermally-evaporated 10 nm-Ni/30 nm and 70 nm Poly-Si/200 nm-$SiO_2/Si$ structures to investigate the thermal stability of nickel silicides formed by rapid thermal annealing(RTA) of the temperature of $300{\sim}1100^{\circ}C$ for 40 seconds. We employed for a four-point tester, field emission scanning electron microscope(FE-SEM), transmission electron microscope(TEM), high resolution X-ray diffraction(HRIXRD), and scanning probe microscope(SPM) in order to examine the sheet resistance, in-plane microstructure, cross-sectional microstructure evolution, phase transformation, and surface roughness, respectively. The silicide on 30 nm polysilicon substrate was stable at temperature up to $900^{\circ}C$, while the one on 70 nm substrate showed the conventional $NiSi_2$ transformation temperature of $700^{\circ}C$. The HRXRD result also supported the existence of NiSi-phase up to $900^{\circ}C$ for the Ni silicide on the 30 nm polysilicon substrate. FE-SEM and TEM confirmed that 40 nm thick uniform silicide layer and island-like agglomerated silicide phase of $1{\mu}m$ pitch without residual polysilicon were formed on 30 nm polysilicon substrate at $700^{\circ}C\;and\;1000^{\circ}C$, respectively. All silicides were nonuniform and formed on top of the residual polysilicon for 70 nm polysilicon substrates. Through SPM analysis, we confirmed the surface roughness was below 17 nm, which implied the advantage on FUSI gate of CMOS process. Our results imply that we may tune the thermal stability of nickel monosilicide by reducing the height of polysilicon gate.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 1997.10a
• /
• pp.19-19
• /
• 1997

• Proceedings of the Korean Magnestics Society Conference
• /
• 1999.04a
• /
• pp.82-83
• /
• 1999

• Journal of the Korean Vacuum Society
• /
• v.9 no.4
• /
• pp.389-393
• /
• 2000

Effects of Co addition and heat treatment on the magnetic properties of Fe-Si-B thin films were investigated. The compositions of metalloids, i.e, B and Si, in the alloys were kept 10 at.% each. Heat treatments were carried out in the temperature range from 100 to $300^{\circ}C$ for up to 60 min. Amorphous thin films of FeCoSiB were deposited on the water-cooled substrates by dc magnetron sputtering. The composition of thin films was controlled by placing proper number of pellets of alloying elements and analyzed by ICP, resulting in $Fe_{80-X}Co_ XB_{10}Si_{10}$ (X=8~18 at.%). Saturation magnetization of the alloys increased as Co concentration increased up to 10 at.% and then decreased with further increase of Co concentration. However, coercive force of the films decreased with the increase of Co concentration. Furthermore, the coercive force was also reduced by the annealing due to the residual stress relief.

• Journal of Surface Science and Engineering
• /
• v.27 no.1
• /
• pp.3-11
• /
• 1994

Cyclic hot corrosion studies have been carried out on(82~94) wt. % Fe-(5, 10, 15) wt. % Cr alloys con-taining either (1, 3)wt. % of Si or Pt as minor alloying elements in molten salts of($Na_2SO_4$+NaCl) between 820 and $920^{\circ}C$. Si or Pt decreased corrosion rate with the most pronounced effect being observed for alloys having 15wt. %Cr. Especially, as Si or Pt contents are increased from 1 to 3 wt. %, improved corrosion resistance was obtained. The beneficial effect of Si addition is due to the presence of the Si-rich second phase along the grain boundaries as well as the formation of the protective $SiO_2$layer between substrates and oxide scale. The Pt addition also increased the corrosion resistance by enhancing the formation ($Cr_2O_3$+layers and by increasing the adherence of the oxide scale.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.1-8
• /
• 2017

Fe-9.8Si-6.0Al mother alloy was manufactured using by Fe-3.5Si recycled scrap and Si powder. And then, soft magnetic alloy powder of $D_{50}$ size and sphere type were prepared by gas atomization process. To obtain the soft magnetic powder of a high aspect ratio, in the first, we conducted the ball milling process for 8 hours. And heat treatment was performed under $650^{\circ}C$, 2 hours and $N_2$ atmosphere condition for reducing the residual stress of the powder. Based on these process, we made around $50{\mu}m$ diameter Fe-9.8Si-6.0Al powder, which morphology and shape was a similar to the commercial Fe-Si-Al powder. Finally, the soft magnetic sheets were prepared by tape casting process using by those powders. The permeability of the tape casting sheet was measured, and we confirmed the possibility of reusing to the soft magnetic materials of Fe-Si electric sheet scrap.