• Title/Summary/Keyword: Fabricating condition

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Investigation of nonlinear vibration behavior of the stepped nanobeam

  • Mustafa Oguz Nalbant;Suleyman Murat Bagdatli;Ayla Tekin
    • Advances in nano research
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    • v.15 no.3
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    • pp.215-224
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    • 2023
  • Nonlinearity plays an important role in control systems and the application of design. For this reason, in addition to linear vibrations, nonlinear vibrations of the stepped nanobeam are also discussed in this manuscript. This study investigated the vibrations of stepped nanobeams according to Eringen's nonlocal elasticity theory. Eringen's nonlocal elasticity theory was used to capture the nanoscale effect. The nanoscale stepped Euler Bernoulli beam is considered. The equations of motion representing the motion of the beam are found by Hamilton's principle. The equations were subjected to nondimensionalization to make them independent of the dimensions and physical structure of the material. The equations of motion were found using the multi-time scale method, which is one of the approximate solution methods, perturbation methods. The first section of the series obtained from the perturbation solution represents a linear problem. The linear problem's natural frequencies are found for the simple-simple boundary condition. The second-order part of the perturbation solution is the nonlinear terms and is used as corrections to the linear problem. The system's amplitude and phase modulation equations are found in the results part of the problem. Nonlinear frequency-amplitude, and external frequency-amplitude relationships are discussed. The location of the step, the radius ratios of the steps, and the changes of the small-scale parameter of the theory were investigated and their effects on nonlinear vibrations under simple-simple boundary conditions were observed by making comparisons. The results are presented via tables and graphs. The current beam model can assist in designing and fabricating integrated such as nano-sensors and nano-actuators.

Characteristics of the Adhesion Layer for the Flexible Organic Light Emitting Diodes (플렉시블 OLED 소자 제작을 위한 접합층 특성 연구)

  • Cheol-Hee Moon
    • Journal of Adhesion and Interface
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    • v.24 no.3
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    • pp.86-94
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    • 2023
  • To fabricate all-solution-processed flexible Organic Light-Emitting Diodes (OLEDs), we demonstrated a bonding technology using a polyethyleneimine (PEI) as an adhesion layer between the two substrates. As the adhesion layer requires not only a high adhesion strength, but also a high current density, we have tried to find out the optimum condition which meets the two requirements at the same time by changing experimental factors such as PEI concentration, thickness of the layer and by mixing some additives into the PEI. The adhesion strength and the electrical current density were investigated by tensile tests and electron only device (EOD) experiments, respectively. The results showed that at higher PEI concentration the adhesion strength showed higher value, but the electrical current through the PEI layer decreased rapidly due to the increased PEI layer thickness. We added Sorbitol and PolyEthyleneGlycohol (PEG) into the 0.1 wt% PEI solution to enhance the adhesion and electrical properties. With the addition of the 0.5 wt% PEG into the 0.1 wt% PEI solution, the device showed an electrical current density of 900 mA/cm2 and a good adhesion characteristic also. These data demonstrated the possibility of fabricating all-solution-processed OLEDs using two-substrate bonding technology with the PEI layer as an adhesion layer.

Recurrent Neural Network Modeling of Etch Tool Data: a Preliminary for Fault Inference via Bayesian Networks

  • Nawaz, Javeria;Arshad, Muhammad Zeeshan;Park, Jin-Su;Shin, Sung-Won;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.239-240
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    • 2012
  • With advancements in semiconductor device technologies, manufacturing processes are getting more complex and it became more difficult to maintain tighter process control. As the number of processing step increased for fabricating complex chip structure, potential fault inducing factors are prevail and their allowable margins are continuously reduced. Therefore, one of the key to success in semiconductor manufacturing is highly accurate and fast fault detection and classification at each stage to reduce any undesired variation and identify the cause of the fault. Sensors in the equipment are used to monitor the state of the process. The idea is that whenever there is a fault in the process, it appears as some variation in the output from any of the sensors monitoring the process. These sensors may refer to information about pressure, RF power or gas flow and etc. in the equipment. By relating the data from these sensors to the process condition, any abnormality in the process can be identified, but it still holds some degree of certainty. Our hypothesis in this research is to capture the features of equipment condition data from healthy process library. We can use the health data as a reference for upcoming processes and this is made possible by mathematically modeling of the acquired data. In this work we demonstrate the use of recurrent neural network (RNN) has been used. RNN is a dynamic neural network that makes the output as a function of previous inputs. In our case we have etch equipment tool set data, consisting of 22 parameters and 9 runs. This data was first synchronized using the Dynamic Time Warping (DTW) algorithm. The synchronized data from the sensors in the form of time series is then provided to RNN which trains and restructures itself according to the input and then predicts a value, one step ahead in time, which depends on the past values of data. Eight runs of process data were used to train the network, while in order to check the performance of the network, one run was used as a test input. Next, a mean squared error based probability generating function was used to assign probability of fault in each parameter by comparing the predicted and actual values of the data. In the future we will make use of the Bayesian Networks to classify the detected faults. Bayesian Networks use directed acyclic graphs that relate different parameters through their conditional dependencies in order to find inference among them. The relationships between parameters from the data will be used to generate the structure of Bayesian Network and then posterior probability of different faults will be calculated using inference algorithms.

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Study on the Separation of N2/SF6 Mixture Gas Using Polyimide Hollow Fiber Membrane (폴리이미드 중공사 막을 이용한 N2/SF6 혼합기체 분리에 관한 연구)

  • Kim, Dae-Hoon;Kim, Guang-Lim;Jo, Hang-Dae;Park, Jong-Soo;Lee, Hyung-Keun
    • Korean Chemical Engineering Research
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    • v.48 no.5
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    • pp.660-667
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    • 2010
  • In this research polyimide, Matrimid 5218, hollow fiber membrane was used to recover sulfur hexafluoride($SF_6$) which is one of the six greenhouse gases from $N_2/SF_6$ mixture gas. Fibers were spun from using dry-wet phase inversion method. The module was manufactured by fabricating fibers after surface coating with silicone elastomer. The scanning electron microscopy(SEM) studies showed that the produced fibers typically had an asymmetric structure; a dense top layer supported by a sponge-like substructure. The developed module had a permeance of 0.78-1.36 GPU for $N_2$ with $N_2/SF_6$ selectivity of 2.44-5.08 at various pressure and temperature. For recovery of $SF_6$, a membrane module and 10 vol.% $SF_6$ from $N_2/SF_6$ mixture gas was used. The effects of various operating condition such as pressure, temperature, and retentate side flow rate were tested. When pressure and temperature were increased and retentate flow rate was decreased, the $SF_6$ purity in recovered gas was increased up to 37.5 vol.% with decreasing recovery ratio. When retentate flow rate was increased pressure and temperature was decreased, the $SF_6$ recovery ratio in retentate side was increased up to 89% with decreasing the $SF_6$ purity in retentate side.

Study on Fiber Laser Annealing of p-a-Si:H Deposition Layer for the Fabrication of Interdigitated Back Contact Solar Cells (IBC형 태양전지 제작을 위한 p-a-Si:H 증착층의 파이버 레이저 가공에 관한 연구)

  • Kim, Sung-Chul;Lee, Young-Seok;Han, Kyu-Min;Moon, In-Yong;Kwon, Tae-Young;Kyung, Do-Hyun;Kim, Young-Kuk;Heo, Jong-Kyu;Yoon, Ki-Chan;Yi, Jun-Sin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.430-430
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    • 2008
  • Using multi plasma enhanced chemical vapor deposition system (Multi-PECVD), p-a-Si:H deposition layer as a $p^+$ region which was annealed by laser (Q-switched fiber laser, $\lambda$ = 1064 nm) on an n-type single crystalline Si (100) plane circle wafer was prepared as new doping method for single crystalline interdigitated back contact (IBC) solar cells. As lots of earlier studies implemented, most cases dealt with the excimer (excited dimer) laserannealing or crystallization of boron with the ultraviolet wavelength range and $10^{-9}$ sec pulse duration. In this study, the Q-switched fiber laser which has higher power, longer wavelength of infrared range ($\lambda$ = 1064 nm) and longer pulse duration of $10^{-8}$ sec than excimer laser was introduced for uniformly deposited p-a-Si:H layer to be annealed and to make sheet resistance expectable as an important process for IBC solar cell $p^+$ layer on a polished n-type Si circle wafer. A $525{\mu}m$ thick n-type Si semiconductor circle wafer of (100) plane which was dipped in a buffered hydrofluoric acid solution for 30 seconds was mounted on the Multi-PECVD system for p-a-Si:H deposition layer with the ratio of $SiH_4:H_2:B_2H_6$ = 30:120:30, at $200^{\circ}C$, 50 W power, 0.2 Torr pressure for 20 minutes. 15 mm $\times$ 15 mm size laser cut samples were annealed by fiber laser with different sets of power levels and frequencies. By comparing the results of lifetime measurement and sheet resistance relation, the laser condition set of 50 mm/s of mark speed, 160 kHz of period, 21 % of power level with continuous wave mode of scanner lens showed the features of small difference of lifetime and lowering sheet resistance than before the fiber laser treatment with not much surface damages. Diode level device was made to confirm these experimental results by measuring C-V, I-V characteristics. Uniform and expectable boron doped layer can play an important role to predict the efficiency during the fabricating process of IBC solar cells.

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Fabrication of Anisotropic Hexagram Particles by using the Micromolding Technique and Selective Localization of Patch (미세성형 기술과 패치의 선택적 제거방법을 이용한 이방성의 육각별 입자 제조)

  • Shim, Gyurak;Yeom, Su-Jin;Jeong, Seong-Geun;Kang, Kyoung-Ku;Lee, Chang-Soo
    • Clean Technology
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    • v.24 no.2
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    • pp.105-111
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    • 2018
  • This study presents a novel and eco-friendly process that can precisely control the location of the patches on the patch particles. The method of manufacturing these anisotropic hexagram patch particles consists of sequential combinations of two separate methods such as a sequential micromolding technique for fabricating patch particles and a selective localization method for controlling the location of patches on the patch particles. The micromolding technique was carried out using physicochemically stable material as a micromold. In order to fabricate the highly stable patch anisotropic hexagram particles, the perfluoropolyether (PFPE) micromold was used to the process of the micromolding technique because they could prevent the problem of diffusion of hydrophobic monomers while conventional poly(dimethylsiloxane) (PDMS) micromold is limited to prevent the problem of diffusion of hydrophobic monomers. Based on combination methods of the micromolding technique and the selective localization method, the reproducibility and stability have been improved to fabricate 12 different types of anisotropic hexagram patch particles. This fabrication method shows the unique advantages in eco-friend condition, easy and fast fabrication due to less number of process, the feasibility of a mass production. We believe that these anisotropic hexagram patch particles can be widely utilized to the field of the directional self-assembly.

Evaluation of Silicon Carbide (SiC) for Deep Borehole Disposal Canister (심부시추공 처분용기 재료로서 SiC 세라믹의 적합성 평가)

  • LEE, Minsoo;LEE, Jongyoul;CHOI, Heuijoo;YOO, MalGoBalGaeBitNaLa;JI, Sunghoon
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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    • v.16 no.2
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    • pp.233-242
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    • 2018
  • To overcome the low mechanical strength and corrosion behavior of a carbon steel canister at high temperature condition of a deep borehole, SiC ceramics were studied as an alternative material for the disposal canister. In this paper, a design concept for a SiC canister, along with an outer stainless steel container, was proposed, and its manufacturing feasibility was tested by fabricating several 1/3 scale canisters. The proposed canister can contain one PWR assembly. The outer container was also prepared for the string formation of SiC canisters. Thermal conductivity was measured for the SiC canister. The canister had a good thermal conductivity of above $70W{\cdot}m^{-1}{\cdot}K^{-1}$ at $100^{\circ}C$. The structural stability was checked under KURT environment, and it was found that the SiC ceramics did not exhibit any change for the 3 year corrosion test at $70^{\circ}C$. Therefore, it was concluded that SiC ceramics could be a good alternative to carbon steel in application to deep borehole disposal canisters.

Mechanical Properties of Metallic Additive Manufactured Lattice Structures according to Relative Density (상대 밀도에 따른 금속 적층 제조 격자 구조체의 기계적 특성)

  • Park, Kwang-Min;Kim, Jung-Gil;Roh, Young-Sook
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.22 no.6
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    • pp.19-26
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    • 2021
  • The lattice structure is attracting attention from industry because of its excellent strength and stiffness, ultra-lightweight, and energy absorption capability. Despite these advantages, widespread commercialization is limited by the difficult manufacturing processes for complex shapes. Additive manufacturing is attracting attention as an optimal technology for manufacturing lattice structures as a technology capable of fabricating complex geometric shapes. In this study, a unit cell was formed using a three-dimensional coordinate method. The relative density relational equation according to the boundary box size and strut radius of the unit cell was derived. Simple cubic (SC), body-centered cubic (BCC), and face-centered cubic (FCC) with a controlled relative density were designed using modeling software. The accuracy of the equations for calculating the relative density proposed in this study secured 98.3%, 98.6%, and 96.2% reliability in SC, BCC, and FCC, respectively. A simulation of the lattice structure revealed an increase in compressive yield load with increasing relative density under the same cell arrangement condition. The compressive yield load decreased in the order of SC, BCC, and FCC under the same arrangement conditions. Finally, structural optimization for the compressive load of a 20 mm × 20 mm × 20 mm structure was possible by configuring the SC unit cells in a 3 × 3 × 3 array.

Removal Torque Values of Retaining Screws Tightened to Implant-Supported Prosthesis with Different Connection Systems by Various Tightening Technique (다른 연결 시스템을 갖는 임플랜트 상부 구조물에서 조임술식에 따른 지대주 나사의 풀림 토크값에 대한 연구)

  • Kim, Dong-Wook;Choi, Yu-Sung;Jo, In-Ho
    • Journal of Dental Rehabilitation and Applied Science
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    • v.27 no.4
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    • pp.343-358
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    • 2011
  • As implant treatment has become popular, lots of different shapes and materials of the implant upper component have been supplied. And there are also diverse reports about failures including loosening of the abutment screw which is one of the most common reason. Purpose : The purpose of this study is to find out how different screw tightening orders and methods influence on screw loosening according to the different connection systems. The upper component was fabricated by casting method. After fabricating master models that are precisely attached to the upper component, 5 experimental models each for the external connection system and internal connection system were fabricated using splinting impression technique. First, to find out the influence of the screw tightening order, screws were tightened in 3 orders; 1-2-3-4, 2-3-1-4, 2-4-3-1. After tightening, removal torque values (RTV) of each group was measured. And also to find out the influence of screw tightening method, a model with 2-3-1-4 screw tightening order was tightened with 30 Ncm at one time(1-step method) and the RTV was compared with the same order group (2-3-1-4) in the 2 step method. In the external connection system, RTV appeared significantly lower in group 2-3-1-4 than group 2-4-3-1 (p<0.05). And also in the internal connection system, the RTV of group 2-3-1-4 appeared significantly lower than that of group 2-4-3-1 and 1-2-3-4 (p<0.05). When comparing the tightening number of the screw without considering the screw tightening order, the first tightened screw appeared significantly higher RTV than the second one in the external connection system (p<0.05), however there was no significant difference from the first tightened screw to the last tightened screw in the internal connection system. And there was no statistically significant difference between the two screw tightening methods in both internal and external connection system. In the comparison of external and internal connection system, each RTV appeared 16.27 Ncm and 14.25 Ncm and appeared as a statistically significant difference (p<0.05). There was a significant difference in RTV measured according to the screw tightening order. The lowest RTV appeared in the groups started tightening from the middle. There was also a significant difference in RTV between the two connection system groups. A further study is needed to find out the influence factors in RTV and also a study is required related to the load condition.