• Title/Summary/Keyword: FPCB cutting

Search Result 12, Processing Time 0.031 seconds

An analysis of Cutting Characteristic of Multilayer FPCB using Nd:YAG UV Laser System (Nd:YAG UV 레이저를 이용한 연성회로 다층기판 절단특성에 대한 연구)

  • Choi, Kyung-Jin;Lee, Young-Hyun
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.27 no.3
    • /
    • pp.9-17
    • /
    • 2010
  • The FPCB is used for electronic products such as LCD display. The process of manufacturing FPCB includes a cutting process, in which each single FPCB is cut and separated from the panel where a series of FPCBs are arrayed. The most-widely used cutting method is the mechanical punching, which has the problem of creating burrs and cracks. In this paper, the cutting characteristics of the FPCB have been experimented using Nd:YAG DPSS UV laser as a way of solving this problem. To maximize the industrial application of this laser cutting process, test samples of the multilayered FPCB have been chosen as it is actually needed in industry. The cutting area of the FPCB has four different types of layer structure. First, to cut the test sample, the threshold laser cut-off fluence has been found. Various combinations of laser and process parameters have been made to supply the acquired laser cut-off fluence. The cutting characteristics in terms of the variation of the parameters are analyzed. The laser and process parameters are optimized, in order to maximize the cutting speed and to reach the best quality of the cutting area. The laser system for the process automation has been also developed.

Laser Cutting of Flexible Printed Circuit Board in Liquid (연성인쇄회로기판의 액중 레이저 절단)

  • Kim, Teakgu;Kim, Joohan
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.22 no.1
    • /
    • pp.56-62
    • /
    • 2013
  • The laser cutting process which is flexible and rapid usually provides a better result in cutting of flexible printed circuit boards (FPCB). However, circuit-short by the re-deposition of debris from laser ablation or its heat affect zone (HAZ) on the cutting surfaces can be a problem. A laser cutting process of FPCB in the presence of liquid can minimize these negative effects. The temperature distribution of copper and polymer parts of FPCB was analyzed with numerical simulation and the experimental results were presented to evaluate this process. Generally, laser cutting under liquid has advantages of less re-deposition of carbides and less HAZ on the cutting edges. However, bubble generation and laser beam control through the liquid media should be considered carefully to obtain a successful result.

FPCB Cutting Process using ns and ps Laser (나노초 및 피코초 레이저를 이용한 FPCB의 절단특성 분석)

  • Shin, Dong-Sig;Lee, Jae-Hoon;Sohn, Hyon-Kee;Paik, Byoung-Man
    • Laser Solutions
    • /
    • v.11 no.4
    • /
    • pp.29-34
    • /
    • 2008
  • Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

  • PDF