• Title/Summary/Keyword: FET Device

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Development of active discharge tester for high capacity lithium-ion battery (대용량 리튬 이온 배터리용 Active 방전시험기의 개발)

  • Park, Joon-Hyung;Yunana, Gani Dogara;Park, Chan Won
    • Journal of Industrial Technology
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    • v.40 no.1
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    • pp.13-18
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    • 2020
  • Lithium-ion batteries have a small volume, light weight and high energy density, maximizing the utilization of mobile devices. It is widely used for various purposes such as electric bicycles and scooters (e-Mobility), mass energy storage (ESS), and electric and hybrid vehicles. To date, lithium-ion batteries have grown to focus on increasing energy density and reducing production costs in line with the required capacity. However, the research and development level of lithium-ion batteries seems to have reached the limit in terms of energy density. In addition, the charging time is an important factor for using lithium-ion batteries. Therefore, it was urgent to develop a high-speed charger to shorten the charging time. In this thesis, a discharger was fabricated to evaluate the capacity and characteristics of Li-ion battery pack which can be used for e-mobility. To achieve this, a smart discharger is designed with a combination of active load, current sensor, and temperature sensor. To carry out this thesis, an active load switching using sensor control circuit, signal processing circuit, and FET was designed and manufactured as hardware with the characteristics of active discharger. And as software for controlling the hardware of the active discharger, a Raspberry Pi control device and a touch screen program were designed. The developed discharger is designed to change the 600W capacity battery in the form of active load.

탄소나노튜브-그래핀 하이브리드 박막을 이용한 투명전극과 전계효과트랜지스터로의 응용

  • Kim, Seong-Ho;Song, U-Seok;Jeong, Min-Uk;Gang, Min-A;Lee, Seon-Suk;Im, Jong-Seon;Hwang, Jin-Ha;Myeong, Seong;An, Gi-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.177.1-177.1
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    • 2014
  • 단일벽 탄소나노튜브(single-wall carbon nanotube)와 그래핀(graphene)과 같은 저차원 구조의 탄소물질은 우수한 기계적, 전기적, 열적 광학적 특성으로 인해 투명하고 유연한 차세대 전자소자로의 응용(투명전극, 투명트랜지스터, 투명센서 등)을 위한 연구가 활발히 진행되고 있다. 본 연구에서는 단일벽 탄소나노튜브와 단일층 그래핀을 이용한 하이브리드 박막을 제작하여 투명전극(transparent electrode)과 전계효과 트랜지스터(field effect transistors)로의 응용 가능성을 연구하였다. 하이브리드 박막의 제작은 간단한 방법으로 단일벽 탄소나노튜브가 스핀 코팅된 구리 호일 위에 열 화학기상증착법(thermal chemical vapor deposition)을 통해 제작 하였다. 제작 과정 중 탄소나노튜브의 스핀코팅 조건을 최적화하여 하이브리드 박막에서 탄소나노 튜브의 밀도와 정렬을 제어하였으며 하이브리드 박막 제작 후 스핀 코팅 방향에 따른 박막의 저항을 측정하여 단일벽 탄소나노튜브의 코팅 방향에 따라 박막의 저항이 달라지는 모습을 확인할 수 있었다. 하이브리드 박막의 투명전극 특성을 확인 한 결과 $300{\Omega}/sq$의 면저항에 96.4%의 우수한 투과도를 보이는 것을 확인 할 수 있었다. 또한 하이브리드 박막은 CVD 그래핀과 비교하여 향상된 와 on-state current를 보이는 것을 확인 할 수 있었다. 우리는 단일벽 탄소나노튜와 단일층 그래핀으로 이루어진 하이브리드 박막이 앞으로의 투명하고 유연한 소자제작 연구에 있어 새로운 투명 전극 및, 트랜지스터 제작 방법을 제시 할 수 있을 것이다.

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Transparent and Flexible All-Organic Multi-Functional Sensing Devices Based on Field-effect Transistor Structure

  • Trung, Tran Quang;Tien, Nguyen Thanh;Seol, Young-Gug;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.491-491
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    • 2011
  • Transparent and flexible electronic devices that are light-weight, unbreakable, low power consumption, optically transparent, and mechanical flexible possibly have great potential in new applications of digital gadgets. Potential applications include transparent displays, heads-up display, sensor, and artificial skin. Recent reports on transparent and flexible field-effect transistors (tf-FETs) have focused on improving mechanical properties, optical transmittance, and performances. Most of tf-FET devices were fabricated with transparent oxide semiconductors which mechanical flexibility is limited. And, there have been no reports of transparent and flexible all-organic tf-FETs fabricated with organic semiconductor channel, gate dielectric, gate electrode, source/drain electrode, and encapsulation for sensor applications. We present the first demonstration of transparent, flexible all-organic sensor based on multifunctional organic FETs with organic semiconductor channel, gate dielectric, and electrodes having a capability of sensing infrared (IR) radiation and mechanical strain. The key component of our device design is to integrate the poly(vinylidene fluoride-triflouroethylene) (P(VDF-TrFE) co-polymer directly into transparent and flexible OFETs as a multi-functional dielectric layer, which has both piezoelectric and pyroelectric properties. The P(VDF-TrFE) co-polumer gate dielectric has a high sensitivity to the wavelength regime over 800 nm. In particular, wavelength variations of P(VDF-TrFE) molecules coincide with wavelength range of IR radiation from human body (7000 nm ~14000 nm) so that the devices are highly sensitive with IR radiation of human body. Devices were examined by measuring IR light response at different powers. After that, we continued to measure IR response under various bending radius. AC (alternating current) gate biasing method was used to separate the response of direct pyroelectric gate dielectric and other electrical parameters such as mobility, capacitance, and contact resistance. Experiment results demonstrate that the tf-OTFT with high sensitivity to IR radiation can be applied for IR sensors.

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Performance and Variation-Immunity Benefits of Segmented-Channel MOSFETs (SegFETs) Using HfO2 or SiO2 Trench Isolation

  • Nam, Hyohyun;Park, Seulki;Shin, Changhwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.4
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    • pp.427-435
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    • 2014
  • Segmented-channel MOSFETs (SegFETs) can achieve both good performance and variation robustness through the use of $HfO_2$ (a high-k material) to create the shallow trench isolation (STI) region and the very shallow trench isolation (VSTI) region in them. SegFETs with both an HTI region and a VSTI region (i.e., the STI region is filled with $HfO_2$, and the VSTI region is filled with $SiO_2$) can meet the device specifications for high-performance (HP) applications, whereas SegFETs with both an STI region and a VHTI region (i.e., the VSTI region is filled with $HfO_2$, and the STI region is filled with $SiO_2$) are best suited to low-standby power applications. AC analysis shows that the total capacitance of the gate ($C_{gg}$) is strongly affected by the materials in the STI and VSTI regions because of the fringing electric-field effect. This implies that the highest $C_{gg}$ value can be obtained in an HTI/VHTI SegFET. Lastly, the three-dimensional TCAD simulation results with three different random variation sources [e.g., line-edge roughness (LER), random dopant fluctuation (RDF), and work-function variation (WFV)] show that there is no significant dependence on the materials used in the STI or VSTI regions, because of the predominance of the WFV.

Robust Design for Parts of Induction Bolt Heating System (유도가열시스템의 구성부품에 대한 강건설계)

  • Kim, Doo Hyun;Kim, Sung Chul;Lee, Jong Ho;Kang, Moon Soo;Jeong, Cheon Kee
    • Journal of the Korean Society of Safety
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    • v.36 no.2
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    • pp.10-17
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    • 2021
  • This paper presents the robust design of each component used in the development of an induction bolt heating system for dismantling the high-temperature high-pressure casing heating bolts of turbines in power plants. The induction bolt heating system comprises seven assemblies, namely AC breaker, AC filter, inverter, transformer, work coil, cable, and CT/PT. For each of these assemblies, the various failure modes are identified by the failure mode and effects analysis (FMEA) method, and the causes and effects of these failure modes are presented. In addition, the risk priority numbers are deduced for the individual parts. To ensure robust design, the insulated-gate bipolar transistor (IGBT), switched-mode power supply (SMPS), C/T (adjusting current), capacitor, and coupling are selected. The IGBT is changed to a field-effect transistor (FET) to enhance the voltage applied to the induction heating system, and a dual-safety device is added to the SMPS. For C/T (adjusting current), the turns ratio is adjusted to ensure an appropriate amount of induced current. The capacitor is replaced by a product with heat resistance and durability; further, coupling with a water-resistant structure is improved such that the connecting parts are not easily destroyed. The ground connection is chosen for management priority.

Controlling the Work Functions of Graphene by Functionalizing the Surface of $SiO_2$ Substrates with Self-assembled Monolayers

  • Jo, Ju-Mi;Kim, Yu-Seok;Cha, Myeong-Jun;Lee, Su-Il;Jeong, Sang-Hui;Song, U-Seok;Kim, Seong-Hwan;Jeon, Seung-Han;Park, Jong-Yun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.400-401
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    • 2012
  • 그래핀(Graphene)은 열 전도도가 높고 전자 이동도(200 000 cm2V-1s-1)가 우수한 전기적 특성을 가지고 있어 전계 효과 트랜지스터(Field effect transistor; FET), 유기 전자 소자(Organic electronic device)와 광전자 소자(Optoelectronic device) 같은 반도체 소자에 응용 가능하다. 그러나 에너지 밴드 갭이 없기 때문에 소자의 전기적 특성이 제한되는 단점이 있다. 최근에는 아크 방출(Arc discharge method), 화학적 기상 증착법(Chemical vapor deposition; CVD), 이온-조사법(Ion-irradiation) 등을 이용한 이종원자(Hetero atom)도핑과 화학적 처리를 이용한 기능화(Functionalization) 등의 방법으로 그래핀을 도핑 후 에너지 밴드 갭을 형성시키는 연구 결과들이 보고된 바 있다. 그러나 이러한 방법들은 표면이 균일하지 않고, 그래핀에 많은 결함들이 발생한다는 단점이 있다. 이러한 단점을 극복하기 위해 자가조립 단층막(Self-assembled monolayers; SAMs)을 이용하여 이산화규소(Silicon oxide; SiO2) 기판을 기능화한 후 그 위에 그래핀을 전사하면 그래핀의 일함수를 쉽게 조절하여 소자의 전기적 특성을 최적화할 수 있다. SAMs는 그래핀과 SiO2 사이에 부착된 매우 얇고 안정적인 층으로 사용된 물질의 특성에 따라 운반자 농도나 도핑 유형, 디락 점(Dirac point)으로부터의 페르미 에너지 준위(Fermi energy level)를 조절할 수 있다[1-3]. 본 연구에서는 SAMs한 기판을 이용하여 그래핀의 도핑 효과를 확인하였다. CVD를 이용하여 균일한 그래핀을 합성하였고, 기판을 3-Aminopropyltriethoxysilane (APTES)와 Borane-Ammonia(Borazane)을 이용하여 각각 아민 기(Amine group; -NH2)와 보론 나이트라이드(Boron Nitride; BN)로 기능화한 후, 그 위에 합성한 그래핀을 전사하였다. 기판 위에 NH2와 BN이 SAMs 형태로 존재하는 것을 접촉각 측정(Contact angle measurement)을 통해 확인하였고, 그 결과 NH2와 BN에 의해 그래핀에 도핑 효과가 나타난 것을 라만 분광법(Raman spectroscopy)과 X-선 광전자 분광법(X-ray photoelectron spectroscopy: XPS)을 이용하여 확인하였다. 본 연구 결과는 안정적이면서 패턴이 가능하기 때문에 그래핀을 기반으로 하는 반도체 소자에 적용 가능할 것이라 예상된다.

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Novel Graphene Volatile Memory Using Hysteresis Controlled by Gate Bias

  • Lee, Dae-Yeong;Zang, Gang;Ra, Chang-Ho;Shen, Tian-Zi;Lee, Seung-Hwan;Lim, Yeong-Dae;Li, Hua-Min;Yoo, Won-Jong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.120-120
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    • 2011
  • Graphene is a carbon based material and it has great potential of being utilized in various fields such as electronics, optics, and mechanics. In order to develop graphene-based logic systems, graphene field-effect transistor (GFET) has been extensively explored. GFET requires supporting devices, such as volatile memory, to function in an embedded logic system. As far as we understand, graphene has not been studied for volatile memory application, although several graphene non-volatile memories (GNVMs) have been reported. However, we think that these GNVM are unable to serve the logic system properly due to the very slow program/read speed. In this study, a GVM based on the GFET structure and using an engineered graphene channel is proposed. By manipulating the deposition condition, charge traps are introduced to graphene channel, which store charges temporarily, so as to enable volatile data storage for GFET. The proposed GVM shows satisfying performance in fast program/erase (P/E) and read speed. Moreover, this GVM has good compatibility with GFET in device fabrication process. This GVM can be designed to be dynamic random access memory (DRAM) in serving the logic systems application. We demonstrated GVM with the structure of FET. By manipulating the graphene synthesis process, we could engineer the charge trap density of graphene layer. In the range that our measurement system can support, we achieved a high performance of GVM in refresh (>10 ${\mu}s$) and retention time (~100 s). Because of high speed, when compared with other graphene based memory devices, GVM proposed in this study can be a strong contender for future electrical system applications.

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