• Journal of Korea Foundry Society
• /
• v.37 no.5
• /
• pp.148-156
• /
• 2017

The effects of minor additives on the casting properties of AC4A aluminum alloys were investigated. Measurements of the cooling curve and microstructure observations were conducted to analyze the effects of Ti-B and Sr minor elements during the solidification process. A fine grain size and an increase in the crystallization temperature for the ${\alpha}-Al$ solution were evident after the addition of 0.1wt% Al-5%Ti-1%B additive. The modification effect of the eutectic $Mg_2Si$ phase with the addition of 0.05% Al-10%Sr additive was prominent. A fine eutectic $Mg_2Si$ phase and a decrease in the growth temperature of the eutectic $Mg_2Si$ phase were evident. Fluidity, shrinkage and solidification-cracking tests were conducted to evaluate the castability of the alloy. The combined addition of Al-5%Ti-1%B and Al-10%Sr additives showed the maximum filling length owing to the effect of the fine ${\alpha}-Al$ grains. The macro-shrinkage ratio increased, while the micro-shrinkage ratio decreased with the combined addition of Al-5%Ti-1%B and Al-10%Sr additives. The macro-shrinkage ratio was nearly identical, while the micro-shrinkage ratio increased with the addition of the Al-10%Sr additive. The tendency of the occurrence of solidification cracking decreased owing to the effect of the fine ${\alpha}-Al$ grains and the modification of the $Mg_2Si$ phase with the combined addition of Al-5%Ti-1%B and Al-10%Sr additives.

• Journal of the Korean Society of Safety
• /
• v.32 no.1
• /
• pp.9-14
• /
• 2017

Diffusion bonding is a technique that has the ability to join materials with minimum change in joint micro-structure and deformation of the component. The quality of the joints produced was examined by metallurgical characterization and the joint micro-structure developed across the diffusion bonding was related to changes in mechanical properties as a function of the bonding time. An increase in bonding time also resulted in an increase in the micro-hardness of the joint interface from 55 VHN to 180 VHN, The increase in hardness was attributed to the formation of intermetallic compounds which increased in concentration as bonding time increased.

• Corrosion Science and Technology
• /
• v.5 no.6
• /
• pp.201-205
• /
• 2006

HYPER(Hybrid Power Extraction Reactor) is the accelerator driven subcritical transmutation system developed by KAERI(Korea Atomic Research Institute). HYPER is designed to transmute long-lived transuranic actinides and fission products such as Tc-99 and I-129. Liquid lead-bismuth eutectic (LBE). Has been a primary candidate for coolant and spallation neutron target due to its appropriate thermal-physical and chemical properties, However, it is very corrosive to the common steels used in nuclear installations at high temperature. This corrosion problem is one of the main factors considered to set the upper limits of temperature and velocity of HYPER system. In this study, a parametric study for a corrosion model was performed. And a preliminary corrosion model was also developed to predict the corrosion rate in isothermal Pb and LBE flow loops.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.10 no.5
• /
• pp.345-349
• /
• 2000

$Al_2O_3/ZrO_2$eutectic fibers were grown by micro-pulling down technique and investigated their microstructure as a function of solidification rate. $Al_2O_3/ZrO_2$eutectic fibers 0.2~2 mm in diameter and 500 mm in length have been grown with a pulling rate of 0.1~15 mm/min. The eutectic microstructures changed as a function of fulling rate from rod-shaped to cellular shape containing some thin lamellar pattern via uniform lamellar structure. Typical lamellar thickness decreased from about 380 nm to 110 nm as the pulling rate increased from 1 mm/min to 15 mm/min. The interlamellar spacing fitted with the inverse-square-root dependence on pulling rate according to $\lambda$= $1{\times}v^{-1/2}$, where $\lambda$ has the dimension in $\mu\textrm{m}$ and v is $\mu\textrm{m}$/s. Hardness value reached 13.1 GPa at 15 mm/min of pulling rate and tensile strength 900 MPa at 10 mm/min were also increased as the interlamellar spacing decreased.

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.4 s.37
• /
• pp.281-287
• /
• 2005

in-situ electromigration test was carried out for edge drift lines of eutectic SnPb solder using Scanning Electron Microscopy (SEM). The electromigration test for the eutectic SnPb solder sample was conducted at temperature of $90^{\circ}C$ and the current density of $6{\times}10^4A/cm^2$. Edge drift at cathode and hillock growth at anode were observed in-situ in a SEM chamber during electromigration test. It was clearly revealed that eutectic SnPb solder lines has an incubation stage before void formation during electromigration test, which seemed to be related to the void nucleation stage of flip chip solder electromigration behaviors.

• Korean Journal of Materials Research
• /
• v.30 no.12
• /
• pp.678-686
• /
• 2020

Microstructural characteristics of directionally solidified René 80 superalloy are investigated with optical microscope and scanning electron microscope; solidification velocity is found to change from 25 to 200 μm/s under the condition of constant thermal gradient (G) and constant alloy composition (Co). Based on differential scanning calorimetry (DSC) measurement, γ phase (1,322 ℃), MC carbide (1,278 ℃), γ/γ' eutectic phase (1,202 ℃), and γ' precipitate (1,136 ℃) are formed sequentially during cooling process. The size of the MC carbide and γ/γ' eutectic phases gradually decrease with increasing solidification velocity, whereas the area fractions of MC carbide and γ/γ' eutectic phase are nearly constant as a function of solidification velocity. It is estimated that the area fractions of MC carbide and γ/γ' eutectic phase are determined not by the solidification velocity but by the alloy composition. Microstructural characteristics of René 80 superalloy after solid solution heat-treatment and primary aging heat-treatment are such that the size and the area fraction of γ' precipitate are nearly constant with solidification velocity and the area fraction of γ/γ' eutectic phase decreases from 1.7 % to 0.955 %, which is also constant regardless of the solidification velocity. However, the size of carbide solely decreases with increasing solidification velocity, which influences the tensile properties at room temperature.

• Journal of Korea Foundry Society
• /
• v.40 no.4
• /
• pp.118-127
• /
• 2020

Microstructural evolution during a heat treatment and high-temperature tensile properties have been investigated in conventionally cast CM247LC. In as-cast specimens, MC carbides with high amounts of Ta, Ti, Hf, and W were found to exist in the interdendritic regions, and γ' was observed in the form of cubes and octocubes prior to decomposition into cubes. In the heat-treated condition, some portion of eutectic γ-γ' remained, and uniform cubic γ' was observed in both interdendritic regions and dendrite core. Three types of carbides with different stoichiometries and compositions were found at the grain boundaries. MC carbides with high Hf contents were observed in the vicinity of eutectic γ-γ'. The highest tensile strength value was found at 750℃, whereas the greatest ductility appeared at 649℃. The effect of the temperature on the tensile properties was closely related to the dislocation structure. With increase in the test temperature, the density of dislocations inside γ' decreased, whereas that in the γ matrix increased. Stacking faults generated in γ' at 750℃ had a strengthening effect, whereas thermally activated dislocation motion at a high temperature was considered to have the opposite effect.

• Proceedings of the KWS Conference
• /
• 2002.10a
• /
• pp.487-492
• /
• 2002

The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energies of Cu$_{6}$Sn$_{5}$ and Ni$_3$Sn$_4$ intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.ely.

• Transactions on Electrical and Electronic Materials
• /
• v.15 no.3
• /
• pp.155-158
• /
• 2014

The phase transformation of Sn-Pb-Bi solder for photovoltaic ribbon during soldering was studied using real-time synchrotron x-ray scattering. At room temperature, Sn and Pb crystal phases in the solder existed separately. By heating to $92^{\circ}C$, a new PbBi alloy crystal phase was formed, which grew further up to $160^{\circ}C$. The Sn crystal phase first started to melt at $160^{\circ}C$, and was mostly melted at $165^{\circ}C$. In contrast, the Pb and PbBi crystal phases started to melt at $165^{\circ}C$, and were mostly melted at $170^{\circ}C$. The useful result was obtained, that the solder's melting temperature decreased from $183^{\circ}C$ to $170^{\circ}C$ by addition of a small amount of Bi atoms to the eutectic Sn62-Pb38 (wt%) solder. Our study first revealed the detailed in-situ phase transformation of Sn-Pb-Bi solder during heating to the eutectic temperature. Considering the results of peel strength and hardness, adding 1 wt% of Bi atoms to the Sn62-Pb38 (wt%) solder produced an appropriate composition.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.20 no.11
• /
• pp.3655-3665
• /
• 1996

An analytical solution is presented for the conduction-dominated solidification of a binary mixture in a semi-infinite medium. The present approach differs from that of other solution by these four characteristics. (1) Solid fraction is determined from the phase diagram, (2) thermophysical properties in mushy zone are weighted according to the local solid fraction, (3) non-equilibrium solidification can be simulated and (4) the cooling condition of under-eutectic temperature can be simulated. Up to now, almost all analyses are based on the assumption of constant properties in mushy zone and solid fraction linearly with temperature or length. The validation for these assumptions, however, shows that serious error is found except some special cases. The influence of microscopic model on the macroscopic temperature profile is very small and can be ignored. But the solid fraction and average solid concentration which directly influence the quality of materials are drastically changed by the microscopic models. An approximate solution using the method of weighted residuals is also introduced and shows good agreement with the analytical solution. All calculations are performed for NH$_{4}$Cl-H$_{2}$O and Al-Cu system.