• Journal of Korea Foundry Society
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• v.18 no.5
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• pp.431-438
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• 1998

Microstructure of A356 aluminum alloys cast in the permanent mold was investigated by optical microscope and image analyzer, with particular respect to the shape and size distribution of iron intermetallics known as ${\beta}-phase$ ($Al_5FeSi$). Morphologies of the ${\beta}-phase$ was found to change gradually with the Be:Fe ratio like these. In Be-free alloys, ${\beta}-phase$ with needlelike morphology was well developed, but script phase was appeared when the Be:Fe ratio is above 0.2:1. With the Be:Fe ratios of 0.4:1-1:1, script phase as well as Be-rich phase was also observed. In case of higher Be addition, above 1:1, Be-rich phase was observed on all regions of the specimens, and increasing of the Be:Fe ratios gradually make the Be-rich phase coarse. It was also observed that the ${\beta}-phase$ with needlelike morphology was coarsened with increase of the Fe content in Be-free alloys. However, in Be-added alloys, length and number of these ${\beta}-phases$ were considerably decreased with the increased Be:Fe ratio. Beryllium addition improved tensile properties and impact toughness of the A356 aluminium alloy, due to the formation of a script phase or a Be-rich phase instead of a needlelike ${\beta}-phase$. The DSC tests indicated that the presence of Be could increase the amount of Mg which is available for $Mg_2Si$ precipitate hardening, and enhance the precipitation kinetics by lowering the ternary eutectic temperature.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.43-48
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• 2010

The heat sink system for a main board in a network server computer is built on printed circuit board by an anchor structure, mounted by eutectic SnPb solder. The solder creeping is caused by a constant high temperature condition in the computer and it eventually makes fatal failures. The FE model is used to calculate the stress and predict the life of soldered anchor in the computer. In the model, Anand constitutive equation is employed to simulate creep characteristics of solder. The creep test is conducted to verify and calibrate the solder model. A special jig is designed to mitigate the flexure of printed circuit board and to get the creep deformation of solder only in the test. Test results are compared with analysis and calibration is conducted on Anand model's constants. Precise life prediction of soldered anchor in creep condition can be performed by this model.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.10
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• pp.1377-1384
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• 2010

The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the room temperature to $125^{\circ}C$. An experiment is conducted to examine deformation by Moire interferometry. Three different constitutive equation models are used in the finite element analysis (FEA) of the thermal cycle. In order to minimize the difference between the FEA results and the experimental results, the material parameters of the solder alloy are considered to be unknown and are determined by conducting optimization. As a result of the study, the Anand model is found to represent the deformation behavior of the solder most accurately.

• Journal of Powder Materials
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• v.10 no.6
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• pp.406-414
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• 2003

In order to produce good wear resistance powder metallurgy Al-Si alloys with high strength, addition of glass forming elements of Ni and Ce in $Al_{81}$Si$_{19}$ alloy was examined using SEM, TEM, tensile strength and wear testing. The solubility of Si in aluminum increased with increasing Ni and Ce contents for rapidly solidified powders. These bulk alloys consist of a mixed structure in which fine Si particles with a particle size below 500 nm and very fine A1$_3$Ni, A1$_3$Ce compounds with a particle size below 200 nm are homogeneously dispersed in aluminum matrix with a grain size below 600 nm. The tensile strength at room temperature for $Al_{81}$Si$_{19}$, $Al_{78}$Si$_{19}$Ni$_2$Ce$_{0.5}$, and $Al_{76}$Si$_{19}$Ni$_4$Ce$_1$ bulk alloys extruded at 674 K and ratio of 10 : 1 is 281,521, and 668 ㎫ respectively. Especially, $Al_{73}$Si$_{19}$Ni$_{7}$Ce$_1$ bulk alloy had a high tensile strength of 730 ㎫. These bulk alloys are good wear-resistance bel ter than commercial I/M 390-T6. Specially, attactability for counterpart is very little, about 15 times less than that of the I/M 390-T6. The structural refinement by adding glass forming elements such as Ni and Ce to hyper eutectic $Al_{81}$Si$_{19}$ alloy is concluded to be effective as a structural modification method.d.tion method.

• Analytical Science and Technology
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• v.5 no.1
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• pp.127-134
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• 1992

Effects of boron addition on microstructure and phases of plasma are melted tungsten have been investigated by optical microscopy, scanning electron microscopy, Auger electron spectroscopy, X-ray diffractometer, measurements of grain size and hardness. The change in the microstructure upon boron addition was studied by optical microscopy. It was observed that the grain refinement was induced upon content within the limit of solubility. When the boron content was above the solubility limit, two phases of primary tungsten and eutectic structure were observed and confirmed by AES and XRD analysis. It was also shown that recrystallization temperature was increased and recrystallized grain size was reduced as boron content increased.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.53-58
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• 2004

To facilitate the observation of the electromigration of 63Sn-37Pb eutectic solder, strip-type samples were fabricated by solder evaporation. The electromigration test for the 63Sn-37Pb solder strip was conducted at temperatures of $80{\sim}150^{\circ}C$ and the current densities of $1{\times}10^4{\sim}1{\times}10^5\;A/cm^2$. With increasing temperature and the current density, mean-time-to-failure(MTTF) decreased due to the formation of hillock and void in the solder strip. The activation energy for the electromigration in the 63Sn-37Pb solder strip was analyzed as $0.16{\sim}0.5\;eV$ using Black's equation.

• Journal of the Optical Society of Korea
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• v.20 no.1
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• pp.130-134
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• 2016

The influence of Au/Ni-based contact formed on a lightly-doped (7.3×1017cm−3, Zn-doped) InGaAsP layer for electrical compensation of surface plasmon polariton (SPP) propagation under various rapid thermal annealing (RTA) conditions has been studied. The active control of SPP propagation is realized by electrically pumping the InGaAsP multiple quantum wells (MQWs) beneath the metal planar waveguide. The metal planar film acts as the electric contact layer and SPP waveguide, simultaneously. The RTA process can lower the metal-semiconductor electric contact resistance. Nevertheless, it inevitably increases the contact interface morphological roughness, which is detrimental to SPP propagation. Based on this dilemma, in this work we focus on studying the influence of RTA conditions on electrical control of SPPs. The experimental results indicate that there is obvious degradation of electrical pumping compensation for SPP propagation loss in the devices annealed at 400℃ compared to those with no annealing treatment. With increasing annealing duration time, more significant degradation of the active performance is observed even under sufficient current injection. When the annealing temperature is set at 400℃ and the duration time approaches 60s, the SPP propagation is nearly no longer supported as the waveguide surface morphology is severely changed. It seems that eutectic mixture stemming from the RTA process significantly increases the metal film roughness and interferes with the SPP signal propagation.

• Journal of the Korean Ceramic Society
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• v.37 no.2
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• pp.186-193
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• 2000

Effects of 1.0 mol% CoO addition on sintering and the electrical properties of ZnO-Bi2O3-Sb2O3(ZBS) varistor system with 3.0 mol% co-addition of Sb2O3 and Bi2O3 at various Sb/Bi ratio (0.5, 1.0, and 2.0) were investigated. Cobalt had little influence on the liquid-phase formation and the pyrochlore decomposition temepratures of ZBS, while densification was mainly dependent on Sb/Bi ratio: when Sb/Bi=0.5, excess Bi2O3 irrelevant to the formation of pyrochore(Zn2Sb3Bi3O14) forms eutectic liquid at ~75$0^{\circ}C$ which promotes densification and grain growth; with Sb/Bi=2.0, the second phase Zn7Sb2O12 formed by excess Sb2O3 irrelevant to the formation of the pyrochlore retards densification up to ~100$0^{\circ}C$. These phases caused the coarsening and uneven distribution of the second phase particles on the grain boundaries of ZnO above the pyrochlore decomposition temperature(~105$0^{\circ}C$), which led to broad size dist-ribution of ZnO; the specimen with Sb/Bi=1.0 showed homogeneous microstructure compared with the others, which enabled improved varistor characteristics. Doping of Co increased the nonlinearity and the potential barrier height of ZBS, which is thought to stem from improved sintering behavior such as homogenized microstructure due to size reduction and even distribution of the second phase and suppressed volatility of Bi2O3, as well as the improvement in the potential barrier structure via increased donor and interface electron trap densities.

• Composites Research
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• v.30 no.6
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• pp.350-355
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• 2017

The new liquid crystalline (LC) epoxy was designed by substituting the phenylcyclohexyl (PCH) mesogen moiety with an alkyl chain at the 2,5 position of the diglycidyl terephthalate. The mesomorphic properties were evaluated by differential scanning calorimetry (DSC) and polarized optical microscopy (POM). All LC epoxy derivatives exhibited an enantiotropic smectic phase upon heating and cooling process. The LC phase temperature range was widened by mixing the eutectic mixture of LC epoxies. Interestingly, the cured LC epoxy exhibited the highest thermal conductivity of $0.4W{\cdot}m^{-1}{\cdot}K^{-1}$. The novel LC epoxy with high thermal conductivity might be used as a composite material for electronic and display devices.

• Korean Journal of Materials Research
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• v.1 no.1
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• pp.37-45
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• 1991

In order to control the microstructures, the sintering behavior and abnormal grain growth with Ba/Ti ratio variation of $BaTiO_3$were investigated. The $BaTiO_3$powders used in this study were prepared by conventional calcination of $BaCO_3$ and $TiO_2$. The onset temperatures of the sintering were lowered and the densification was enhanced with increasing amounts of $TiO_2$ excess. These results are because of decrease of calcined particle sizes. A eutectic melt above temperature of $1320^{\circ}C$ did not assist the densification. Grain growth was strongly inhibited with increasing amounts of $TiO_2$ excess. The inhibition of grain growth caused abnormal grain growth due to inhomogeneous distribution of Ti-rich second phase.