• Title/Summary/Keyword: Etching system

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A Study on Effect of Spray Characteristics on Etching Characteristics in Micro Fabrication System (미세 가공 시스템에서 분무특성이 에칭특성에 미치는 영향에 관한 연구)

  • Jung, Ji-Won;Kim, Duck-Jool
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.1
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    • pp.109-117
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    • 2004
  • The objective of this study is to investigate the effect of the spray characteristics on the etching characteristics for the optimization of etching process in the micro fabrication industry. The etching characteristics such as etching rate and etching factor were investigated under different etching conditions. To compare with the etching characteristic, the spray characteristics such as droplet size and velocity were measured by PDA system. The etching rate was increased in case of high spray pressure and in the region of spray center. The etching factor was increased with decrease in the distance from nozzle tip and increase in the etchant temperature. It was found that the spray characteristics were correlated with the etching characteristics.

Simulation of Etching Characteristics with Oscillation Angle in Etching System (에칭시스템에서 요동각 변화에 따른 에칭특성 시뮬레이션)

  • Jeong, Heung-Cheol;Kim, Young-Jin;Jung, Ji-Won;Kim, Duck-Jool
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.1534-1539
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    • 2004
  • The objective of this study is to simulate the etching characteristics with oscillation angle for the optimization of etching system. The etching characteristics were analyzed under different etching conditions. The spray characteristics were measured by Phase Doppler Anemometer (PDA). The correlation between the spray characteristics and the etching characteristics was investigated and used for fundamental data to simulate the etching characteristics with oscillation angle. The smaller coefficient of variation, the more uniform etching characteristic distribution became. It was found that numerical predictions of etching factor generally agreed well with the measured results with distance from nozzle tip. Oscillation leads to decrease of etching factor and increase of uniformity.

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Correlation Between Spray Characteristics and Etching Characteristics in Twin Spray (이중분무에서 분무특성과 에칭특성의 상호상관)

  • Jung, Ji-Won;Kim, Young-Jin;Kim, Duck-Jool
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.4
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    • pp.449-455
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    • 2004
  • The objective of this study is to obtain the correlation between the spray characteristics and the etching characteristics for the optimization of etching system in the micro fabrication industry. The etching characteristics such as etching rate were measured under different conditions. The single spray characteristics such as droplet size and velocity were measured by PDA system. These were compared to the etching characteristics. The twin spray characteristics in the overlap region were analyzed to predict the effect of them on the etching characteristics with the pitch and also were compared to the single spray. The etching rate was increased in case of high spray pressure and in the region of spray center. It was found that the etching characteristics could be correlated with the single spray characteristics and the twin spray characteristics were correlated with the etching characteristics.

Microtensile bond strength of silorane-based composite specific adhesive system using different bonding strategies

  • Bastos, Laura Alves;Sousa, Ana Beatriz Silva;Drubi-Filho, Brahim;Pires-de-Souza, Fernanda de Carvalho Panzeri;Garcia, Lucas da Fonseca Roberti
    • Restorative Dentistry and Endodontics
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    • v.40 no.1
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    • pp.23-29
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    • 2015
  • Objectives: The aim of this study was to evaluate the effect of pre-etching on the bond strength of silorane-based composite specific adhesive system to dentin. Materials and Methods: Thirty human molars were randomly divided into 5 groups according to the different bonding strategies. For teeth restored with silorane-based composite (Filtek Silorane, 3M ESPE), the specific self-etching adhesive system (Adhesive System P90, 3M ESPE) was used with and without pre-etching (Pre-etching/Silorane and Silorane groups). Teeth restored with methacrylate based-composite (Filtek Z250, 3M ESPE) were hybridized with the two-step self-etching system (Clearfil SE Bond, Kuraray), with and without pre-etching (Pre-etching/Methacrylate and Methacrylate groups), or three-step adhesive system (Adper Scotchbond Multi-Purpose, 3M ESPE) (Three-step/Methacrylate group) (n = 6). The restored teeth were sectioned into stick-shaped test specimens ($1.0{\times}1.0mm$), and coupled to a universal test machine (0.5 mm/min) to perform microtensile testing. Results: Pre-etching/Methacrylate group presented the highest bond strength values, with significant difference from Silorane and Three-step/Methacrylate groups (p < 0.05). However, it was not significantly different from Pre-etching/Silorane and Methacrylate groups. Conclusions: Pre-etching increased bond strength of silorane-based composite specific adhesive system to dentin.

Characterizations of Surface Textured Silicon Substrated by XeF2 Etching System (이불화제논 기상 식각에 의한 실리콘 기판의 표면 텍스쳐링 특성)

  • Kim, Seon-Hoon;Ki, Hyun-Chul;Kim, Doo-Gun;Na, Yong-Beom;Kim, Nam-Ho;Kim, Hwe-Jong
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.4
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    • pp.749-753
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    • 2010
  • We investigated the haze and the surface roughness of textured Si substrates etched by $XeF_2$ etching system with the etching parameters of $XeF_2$ pressure, etching time, and etching cycle. Here the haze was obtained as a function of wavelength from the measured reflectance. The haze of textured Si substrates was strongly affected by the etching parameter of etching cycle. The surface roughness of textured Si substrates was calculated with the haze and the scalar scattering theory at the wavelength of 800 nm. Then, the surface roughness was compared with that measured by atomic force microscope. The surce roughness obtained by two methods was changed with the similar tendency n terms of $XeF_2$ etching conditions.

A Study on The Optimal Operation and Malfunction Detection of Plasma Etching Utilizing Neural Network (신경회로망을 이용한 플라즈마 식각공정의 최적운영과 이상검출에 관한 연구)

  • 고택범;차상엽;이석주;최순혁;우광방
    • Journal of Institute of Control, Robotics and Systems
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    • v.4 no.4
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    • pp.433-440
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    • 1998
  • The purpose of this study is to provide an integrated process control system for plasma etching. The control system is designed to employ neural network for the modeling of plasma etching process and to utilize genetic algorithm to search for the appropriate selection of control input variables, and to provide a control chart to maintain the process output within a desired range in the real plasma etching process. The target equipment is the one operating in DRAM production lines. The result shows that the integrated system developed is practical value in the improved performance of plasma etching process.

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A Study on Improvement of Etching Characteristics by Spray Characteristics Analysis with Nozzle Geometries in Wet Etching Process (습식 에칭공정에서 노즐 형상에 따른 분무특성 분석을 통한 에칭특성의 향상에 관한 연구)

  • Jung, Ji-Won;Kim, Duck-Jool
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.7
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    • pp.842-849
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    • 2004
  • The objective of this work is to study the improvement of etching characteristics in wet etching process. The etching characteristics such as etching factor were investigated under different etching conditions and compared with the spray characteristics. The spray characteristics of nozzle with different geometries such as swirler angle and swirl chamber aspect ratio were analyzed by using PDA system to predict the effect of the spray characteristics on the etching factor. The swirler angles were 49,5$^{\circ}$, 63$^{\circ}$ and 76.5$^{\circ}$. The swirl chamber aspect ratios were 1.2, 1.6 and 2.0. It was found that the etching factor was correlated with the spray characteristics and also the smaller swiller angle, the larger etching factor became.

The Prediction of Etching Characteristics Using Monte-Carlo Simulation in Etching Process of Lead-Frame (Lead-Frame 에칭공정에서 몬테카를로 시뮬레이션을 이용한 에칭특성 예측)

  • Jeong Heung-Cheol;Choi Gyung-Min;Kim Duck-Jool
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.1 s.178
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    • pp.72-79
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    • 2006
  • The objective of this work is to simulate the etching characteristics for the optimization on the etching process of Lead-Frame. The etching characteristics such as etching factor, etching uniformity were investigated under different the actual operating conditions. The correlation between the etching characteristics and the spray ones were analyzed to simulate the etching characteristics in the etching process. To improve the etching characteristics in the etching process, effects of the various operating conditions such as pressure, distance from nozzle tip, pipe pitch, and feed speed should be understood in detail. The spray characteristics obtained by experiment using PDA system were simulated by the Monte-Carlo simulation. The etching process model was coded by Java language. It was found that the spray characteristics were correlated with the etching ones and simulation results generally agreed well with the measured results of etching characteristics in the etching process of Lead-Frame. The optimal operating parameters were successfully found under variable conditions.

The Precision of Lead Frame Etching Characteristics Using Monte-Carlo Simulations

  • Jeong, Heung-Cheol;Choi, Gyung-Min;Kim, Duck-Jool
    • International Journal of Precision Engineering and Manufacturing
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    • v.8 no.1
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    • pp.73-78
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    • 2007
  • The objective of this work was to simulate lead frame etching characteristics to optimize the etching process, Characteristics such as the etching factor and uniformity were investigated for different actual operating conditions, including pressure, distance from the nozzle tip, pipe pitch, and feed speed. The correlation between the etching and spray characteristics was analyzed to develop the etching model. Spray characteristics obtained from an experiment using a phase Doppler anemometer system were then simulated using a Monte-Carlo technique, The etching process model was coded in the Java language, The spray and etching characteristics were correlated with each other and simulated results agreed well with the measured data for a lead frame etching process, The optimal operating parameters under various conditions were successfully determined.

THE ETCHING EFFECTS AND MICROTENSILE BOND STRENGTH OF TOTAL ETCHING AND SELF-ETCHING ADHESIVE SYSTEM ON UNGROUND ENAMEL (법랑질에 대한 total etching과 self-etching 접착제의 산부식 효과와 미세인장결합강도)

  • Oh, Sun-Kyong;Hur, Bock;Kim, Hyeon-Cheol
    • Restorative Dentistry and Endodontics
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    • v.29 no.3
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    • pp.273-280
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    • 2004
  • The purpose of this study was to evaluate the etching effects and bond strength of total etching and self-etching adhesive system on unground enamel using scanning electron microscopy and microtensile bond strength test. The buccal coronal unground enamel from human extracted molars were prepared using low-speed diamond saw. Scotchbond Multi-Purpose (group SM). Clearfil SE Bond (group SE), or Adper Prompt L-Pop (group LP) were applied to the prepared teeth. and the blocks of resin composite (Filtek Z250) were built up incrementally. Resin tag formation was evaluated by scanning electron microscopy. after removal of enamel surface by acid dissolution and dehydration. For microtensile bond strength test. resin-bonded teeth were sectioned to give a bonded surface area of $1\textrm{mm}^2$. Microtensile bond strength test was perfomed. The results of this study were as follows. 1. A definite etching pattern was observed in Scotchbond Multi-Purpose group. 2. Self-etching groups were characterized as shallow and irregular etching patterns. 3. The results (mean) of microtensile bond strength were SM: 26.55 MPa, SE: 18.15 MPa, LP: 15.57 MPa. SM had significantly higher microtensile bond strength than 8E and PL (p < 0.05). but there was no significant differance between SE and PL.