• 제목/요약/키워드: Etching glass

검색결과 257건 처리시간 0.03초

Effect On Glass Texturing For Enhancement of Light Trapping in Perovskite Solar Cells

  • Kim, Dong In;Nam, Sang-Hun;Hwang, Ki-Hwan;Lee, Yong-Min;Boo, Jin-Hyo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.387.2-387.2
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    • 2016
  • Glass texturing is a sufficient method for changing the surface morphology to enhance the light trapping. In this study, glass texturing was applied to the perovskite solar cell for improving the current density. Glass substrates (back-side glass of FTO coated glass substrate) were textured by randomly structure assisted wet etching process using diluted HF solution at a constant concentration of etchants (HF:H2O=1:1). Then, the light trapping properties of suitable films were controlled over a wide range by varying the etching time (1, 2, 3, 4 and 5 min.). The surface texturing changed the reflected light in an angle that it can be reflected by substrate glass surface. As a result, Current density and cell efficiency were affected by light trapping layer using glass texturing method in perovskite solar cells.

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디스플레이용 유리의 눈부심 현상 억제를 위한 표면 에칭 및 돌기 형성에 관한 연구 (Study on surface etching and projection formation to control the glare of display glass)

  • 우희수;강승구
    • 한국결정성장학회지
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    • 제30권6호
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    • pp.251-257
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    • 2020
  • 디스플레이용 유리를 통해 문자나 이미지를 뚜렷하고 빠르게 인식하기 위해서는 유리의 눈부심 현상(glare)을 억제해야 한다. 본 연구 연구에서는 에칭공정을 통해 유리 표면 형상 및 광학 특성 변화를 분석하여 눈부심 현상을 낮추고자 하였다. 에칭 공정은 에칭 용액인 BOE 및 HF의 농도를 변수로 수행하였다. 에칭과정에서 유리 표면에 F 이온이 포함된 화합물이 생성되어 돌기(projection) 형태로 불규칙한 패턴을 형성되었고, 이로 인해 유리의 광학적 특성이 변화되었다; 반사율은 2.5~4.6 %, 탁도는 4.5~6.6 %, 투과율은 77~9 2 %, 그리고 광택도는 82~107 GU 범위. 그 결과 유리의 눈부심 현상을 억제하면서도 다른 광학적 특성의 손실을 최소화하는 에칭 조건을 확보하였다.

디스플레이 커버 글라스의 표면 처리에 의한 광학요소 제어 (Optical Properties Control by Surface Treatment on Display Cover Glass)

  • 김성수;황재석;전법주
    • 한국전기전자재료학회논문지
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    • 제28권9호
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    • pp.607-614
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    • 2015
  • To provide the clear images from the direct light on electrical board and display devices, anti glare treatment of display cover glass is needed. In this study, the effects of surface treatment temperature, concentration, and etching solution coating thickness of the gel phase on optical elements control such as gloss, haze of reflected light and transmittance, were investigated. Cover glasses were treated at different coating thickness and additive concentration. The optical properties were examined using spectrophotometer, gloss and haze meter. The surface morphology and roughness were measured by the optical microscope and Ra measuring instrument. The etching rate and surface morphologies were dramatically affected by the concentration of acid additive in the viscous gel because of re-crystallization of components in the etching solution, hydrogel formation and coagulant after coating on glass substrate. In our experimental range, cover glass which is surface-treated with various optical properties as well as the morphology uniformity was obtained; in particular, optical properties could be controlled by etching solution coating thickness of the gel phase and the concentration of additive. The gloss was depended on the surface roughness and it showed the linear relationship between optical transmittance and haze of reflected light, respectively.

감광성유리를 이용한 마이크로머시닝 기술 (Micromachining technology using photosensitive glass)

  • 조수제
    • 한국레이저가공학회지
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    • 제14권1호
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    • pp.25-29
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    • 2011
  • Micromachining of photosensitive glass by UV exposure, heat treatment, and etching processes is reported. Like photoresist, the photosensitive glass is also classified into positive and negative types by development characteristics. For the positive type, the exposed area is crystallized and etched away during the etching process in HF solution, whereas the unexposed area is crystallized and etched away for the negative type. The crystallized area of the photosensitive glass has an etch rate approximately 30~100 times faster than that of the amorphous area so that it becomes possible to fabricate microstructures in the glass. Based on the unique properties of glass such as high optical transparency, electrical insulation, and chemical/thermal stability, the glass micromachining technique introduced in this work could be widely applied to various devices in the fields of electronics, bio engineering, nanoelectonics and so on.

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Metal Ion Dissolution in Nitric Acid with Lead-Borosilicate Glass for Barrier Ribs in PDP

  • Kim, Jae-Myung;Lee, Chong-Mu;Kim, Hyung-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1252-1254
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    • 2005
  • Recently, PDP barrier ribs require the formation of complex structure so that they are usually formed by etching method. For producing the fine ribs structure, during the etching process the metal ions of matrix (glass) of barrier materials should be understood on the etching mechanism with etching condition. We analyzed the quantity of Pb, Si, and B ions from the etch solution as a function of etching time.

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보로실리케이트 표면의 나노/마이크로 패터닝을 위한 식각 시간, 하중에 따른 유기 힐록의 성장거동 관찰 (Observation of Growth Behavior of Induced Hillock for Nano/Micro Patterning on Surface of Borosilicate with Etching Time and Load)

  • 조상현;윤성원;강충길
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.182-185
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    • 2005
  • Indentation pattern and line pattern were machined on borosilicate(Pyrex 7740 glass) surface using the combination of mechanical machining by $Nanoi-indenter\circledR$ XP and HF wet etching, and a etch-mask effect of the affected layer of the nano-scratched and indented Pyrex 7740 glass surface was investigated. In this study, effects of indentation and scratch process with etching time on the morphologies of the indented and scratched surfaces after isotropic etching were investigated from an angle of deformation energies.

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Glass ionomer cement 표면의 산부식 효과에 관한 연구 (THE EFFECT OF ACID ETCHING ON GLASS IONOMER CEMENT SURFACES)

  • 한승원;박상진;민병순;최호영;최기운
    • Restorative Dentistry and Endodontics
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    • 제18권1호
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    • pp.1-26
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    • 1993
  • The purpose of this study was to investigate the effect of acid etching on the surface appearance and fracture toughness of five glass ionomer cements. Five kinds of commercially available glass ionomer cements including chemical curing filling type, chemical curing lining type, chemical curing metal reinforced type, light curing tilling type and light curing lining type were used for this study. The specimens for SEM study were fabricated by treating each glass ionomer cement with either visible light curing or self curing after being inserted into a rubber mold (diameter 4mm, depth 1mm). Some of the specimens were etched with 37% phosphoric acid for 0, 15, 30, 60, go seconds, at 5 minutes, 1 hour and 1 day after mixing of powder and liquid. Unetched ones comprised the control group and the others were the experimental groups. The surface texture was examined by using scanning electron microscope at 20 kV. (S-2300, Hitachi Co., Japan). The specimens for fracture toughness were fabricated by curing of each glass ionomer cement previously inserted into a metal mold for the single edge notch specimen according to the ASTME399. They were subjected to a three-point bend test after etching for 0, 30, 60, and 90 seconds at 5 minutes-, 1 hour-and 1 day-lapse after the fabrication of the specimens. The plane strain fracture toughness ($K_{IC}$) was determined by three-point bend test which was conducted with cross-head speed of 0.5 mm/min using Instron universal testing machine (Model No. 1122) following seven days storage of the etched specimens under $37^{\circ}C$, 100% humidity condition. Following conclusions were drawn. 1. In unetched control group, crack was present, but the surface was generally smooth. 2. Deterioration of the surface appearance such as serious dissolving of gel matrix and loss of glass particles occured as the etching time was increased beyond 15 s following Immediate etching of chemical curing type of glass ionomer cements. 3. Etching after 1 h, and 1 d reduced surface damage, 15 s, and 30s etch gave rough surface appearance without loss of glass particle of chemical curing type of glass ionomer cements. 4. Light curing type glass ionomer cement was etched by acid, but there was no difference in surface appearances according to various waiting periods. 5. It was found that the value of plane stram fracture toughness of glass ionomer cements was highest in the light curing filling type as $1.79\;MNm^{-1.5}$ followed by the light curing lining type, chemical curing metal reinforced type, chemical curing filling type and chemical curing lining type. 6. The value of plane stram fracture toughness of the chemical curing lining type glass ionomer cement etched after 5 minutes was lower than those of the cement etched after 1 hour or day or unetched (P < 0.05). 7. Light curing glass ionomer cement showed Irregular fractured surface and chemical curing cement showed smooth fractured surface.

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Effects of Chemical Etching with Sulfuric Acid on Glass Surface

  • Jang, H.K.;Chung, Y.L.;S.W.Whangbo;C.N.Whang;Lee, S.J.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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    • pp.165-165
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    • 2000
  • Glass slides were chemically etched with sulfuric acid using five different methods. we investigated the effects of the chemical etching conditions on such properties as chemical composition, surface roughness, and the thermal stability of the glass. Sodium and carbon atoms in the surface of the glass are effectively eliminated by chemical etching with sulfuric acid. The glass slides were boiled for 30 min in 95% sulfuric acid and were depth profiled at room temperature with X-ray photoelectron spectroscopy (XPS), the Na ls signal was not detected in the detection limit of XPS. Surface morphology of the glass was very different depending on the concentration of sulfuric acid. The surface of the glass etched with 50% sulfuric acid was rougher than that of glass etched with 95% sulfuric acid. The sodium concentration of the glass boiled for 30 min in 95% sulfuric acid was nearly zero at the glass surface, and the sodium composition changed very little with annealing temperatures up to 35$0^{\circ}C$ in a vacuum environment. However the sulfur concentration at the glass surface due to the sulfuric acid increased with increasing temperature.

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Transparent Plasma Display using Transparent Glass Barrier Ribs

  • Lee, Sung-Min;Kim, Seung-Hun;Oh, Seung-Hwa;Shin, Bhum-Jae;Choi, Kyung-Cheol
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.339-341
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    • 2009
  • A transparent plasma display was developed using transparent glass barrier ribs. Glass barrier ribs were fabricated via a wet etching process. Glass barrier ribs created using a top and bottom etching process showed better transparency compared to those created through only a top etching process. A see-through phosphor layer was obtained by coating the sidewall of the barrier ribs with a conventional opaque phosphor. A fabricated prototype of a transparent plasma display was clear enough to see the background beyond the panel and was well operated by a conventional driving scheme. The maximum luminance was 1150 cd/$m^2$ and the maximum luminous efficacy was 1.35 lm/W in a Ne+13.5%Xe gas-mixture and green cells.

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폴리머와 금속을 이용한 유리 식각 마스크의 저작 및 이를 이용한 유리 가공 (Fabrication of Glass Etching Mask using Various Polymers and Metals and Test of it in Glass Micromaching)

  • 전도한;심우영;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2004년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.268-270
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    • 2004
  • This paper reports a novel masking method with various mask materials for wet etching of glass. Various mask materials such as Cr/Au, Ti/Au, Polyimide and thick SU-8 photoresist were investigated for borosilicate glass (Borofloat33) etching in concentrated hydrofluoric acid (48% HF). Polyimide and thick SU-8 photoresist are not suitable as masking material due to its poor adhesion to glass surfaces. Titanium has good adhesion is suitable as the first layer to make multi-protective layers. The best protection was obtained with a combination of Ti/Au, polyimide and Ti/Au as masking material with etch depth of $350{\mu}m$ achieved.

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