• Title/Summary/Keyword: Etching Process

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Study on the Flame Retardation and Thermal Resistance for CPE Rubber Material Added Etching By-product of Aluminum (알루미늄 엣칭부산물을 첨가한 CPE 고무재료의 난연성 및 내열성 연구)

  • Kim, Kyung Hwan;Lee, Chang Seop
    • Journal of the Korean Chemical Society
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    • v.45 no.4
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    • pp.341-350
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    • 2001
  • Aluminum Hydroxide was employed as a thermal retardent and flame retardent for Chloropolyethylene (CPE) rubbery materials which is the construction material of automotive oil cooler hose. and then cure characteristics, physical properties, thermal resistance and flame retardation of compounded rubber were investigated, and optimum mixing conditions of rubber and flame retarding agent were deduced from the experimental results. CPE rubber material which has excellent properties of chemical corrosion resistance and cold resistance and inexpensive in price was used to prepare rubber specimen. The by-product of ething, produced from the process of surface treatment of aluminum was processed to aluminum hydroxide via crushing and purification, which is characterized by XRD, PSA, SEM and ICP-AES techniques in terms of phase, size, distribution, morphology and components of particles and then mixed to CPE rubber materials in the range of 0~80 phr. Hardness, tensile strength, elongation and thermal properties of compounded rubber specimens were tested. The optimum mixing ratio of rubber to additives to give maximum effect on thermal resistance and flame retardation, within the range of tolerable specification for rubber materials, was determined to be 40 phr. The flame retardation of CPE rubber materials was found to be increased by 5 times at this mixing ratio.

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Structural characterization of $Al_2O_3$ layer coated with plasma sprayed method (플라즈마 스프레이 방법으로 코팅 된 $Al_2O_3$막의 구조적 특성)

  • Kim, Jwa-Yeon;Yu, Jae-Keun;Sul, Yong-Tae
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.16 no.3
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    • pp.116-120
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    • 2006
  • We have investigated plasma spray coated $Al_2O_3$ layers on Al-60 series substrates for development of wafer electrostatic chuck in semiconductor dry etching system. Samples were prepared without/with cooling bar on backside of samples, at various distances, and with different powder feed rates. There were many cracks and pores in the $Al_2O_3$ layers coated on Al-60 series substrates without cooling bar on the backside of samples. But the cracks and pores were almost disappeared in the $Al_2O_3$ layers on Al-60 series substrates coated with cooling bar on the back side of samples, 15 g/min. powder feed rate and various 60, 70, 80 mm working distances. Then the surface morphology was not changed with various working distances of 60, 70, 80 mm. When the powder feed rate was changed from 15 g/min to 20 g/min, the crack did not appear, but few pores appeared. Also the $Al_2O_3$ layer was coated with many small splats compared with $Al_2O_3$ layer coated with 15 g/min powder feed rate. The deposited rate of $Al_2O_3$ layer was higher when the process was done without cooling bar on the back side of sample than that with cooling bar on the back side of sample.

A Schottky Type Ultraviolet Photo-detector using RUO$_2$/GaN Contact (RUO$_2$/GaN 쇼트키 다이오드 형 자외선 수광소자)

  • Sin, Sang-Hun;Jeong, Byeong-Gwon;Bae, Seong-Beom;Lee, Yong-Hyeon;Lee, Jeong-Hui;Ham, Seong-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.10
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    • pp.671-677
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    • 2001
  • A RuO$_2$ Schottky photo-detector was designed and fabricated with GaN layers on the sapphire substrate. For good absorption of UV light, an epitaxial structure with undoped GaN(0.5 ${\mu}{\textrm}{m}$)/n ̄-GaN(0.1${\mu}{\textrm}{m}$)/n+-GaN(1.5${\mu}{\textrm}{m}$) was grown by MOCVD. The structure had the carrier concentrations of 3.8$\times$10$^{18}$ cm ̄$^3$, the mobility of 283$\textrm{cm}^2$/V.s. After ECR etching process for mesa structure with the diameter of about 500${\mu}{\textrm}{m}$, Al ohmic contact was formed on GaN layer. After proper passivation between the contacts with Si$_3$/N$_4$, was formed on undoped GaN layer. The fabricated Schottky diode had a specific contact resistance of 1.15$\times$10$^{-5}$$\Omega$.$\textrm{cm}^2$]. It has a low leakage current of 305 pA at -5 V, which was attributed by stable characteristics of RuO$_2$ Schottky contact. In optical measurement, it showed the high UV to visible extinction ratio of 10$^{5}$ and very high responsivity of 0.23 A/W at the wavelength of 365nm.

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Characteristics of MHEMT Devices Having T-Shaped Gate Structure for W-Band MMIC (W-Band MMIC를 위한 T-형태 게이트 구조를 갖는 MHMET 소자 특성)

  • Lee, Jong-Min;Min, Byoung-Gue;Chang, Sung-Jae;Chang, Woo-Jin;Yoon, Hyung Sup;Jung, Hyun-Wook;Kim, Seong-Il;Kang, Dong Min;Kim, Wansik;Jung, Jooyong;Kim, Jongpil;Seo, Mihui;Kim, Sosu
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.2
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    • pp.99-104
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    • 2020
  • In this study, we fabricated a metamorphic high-electron-mobility transistor (mHEMT) device with a T-type gate structure for the implementation of W-band monolithic microwave integrated circuits (MMICs) and investigated its characteristics. To fabricate the mHEMT device, a recess process for etching of its Schottky layer was applied before gate metal deposition, and an e-beam lithography using a triple photoresist film for the T-gate structure was employed. We measured DC and RF characteristics of the fabricated device to verify the characteristics that can be used in W-band MMIC design. The mHEMT device exhibited DC characteristics such as a drain current density of 747 mA/mm, maximum transconductance of 1.354 S/mm, and pinch-off voltage of -0.42 V. Concerning the frequency characteristics, the device showed a cutoff frequency of 215 GHz and maximum oscillation frequency of 260 GHz, which provide sufficient performance for W-band MMIC design and fabrication. In addition, active and passive modeling was performed and its accuracy was evaluated by comparing the measured results. The developed mHEMT and device models could be used for the fabrication of W-band MMICs.

Robust Design for Showerhead Thermal Deformation

  • Gong, Dae-Wi;Kim, Ho-Jun;Lee, Seung-Mu;Won, Je-Hyeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.150.1-150.1
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    • 2014
  • Showerhead is used as a main part in the semiconductor equipment. The face plate flatness should remain constant and the cleaning performance must be gained to keep the uniformity level of etching or deposition in chemical vapor deposition process. High operating temperature or long period of thermal loading could lead the showerhead to be deformed thermally. In some case, the thermal deformation appears very sensitive to showerhead performance. This paper describes the methods for robust design using computational fluid dynamics. To reveal the influence of the post distribution on flow pattern in the showerhead cavity, numerical simulation was performed for several post distributions. The flow structure appears similar to an impinging flow near a centered baffle in showerhead cavity. We took the structure as an index to estimate diffusion path. A robust design to reduce the thermal deformation of showerhead can be achieved using post number increase without ill effect on flow. To prevent the showerhead deformation by heat loading, its face plate thickness was determined additionally using numerical simulation. The face plate has thousands of impinging holes. The design key is to keep pressure drop distribution on the showerhead face plate with the holes. This study reads the methodology to apply to a showerhead hole design. A Hagen-Poiseuille equation gives the pressure drop in a fluid flowing through such hole. The assumptions of the equation are the fluid is viscous-incompressible and the flow is laminar fully developed in a through hole. An equation can be expressed with radius R and length L related to the volume flow rate Q from the Hagen-Poiseuille equation, $Q={\pi}R4{\Delta}p/8{\mu}L$, where ${\mu}$ is the viscosity and ${\Delta}p$ is the pressure drop. In present case, each hole has steps at both the inlet and the outlet, and the fluid appears compressible. So we simplify the equation as $Q=C(R,L){\Delta}p$. A series of performance curves for a through hole with geometric parameters were obtained using two-dimensional numerical simulation. We obtained a relation between the hole diameter and hole length from the test cases to determine hole diameter at fixed hole length. A numerical simulation has been performed as a tool for enhancing showerhead robust design from flow structure. Geometric parameters for the design were post distribution and face plate thickness. The reinforced showerhead has been installed and its effective deposition profile is being shown in factory.

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Characteristics of InGaAs/GaAs/AlGaAs Double Barrier Quantum Well Infrared Photodetectors

  • Park, Min-Su;Kim, Ho-Seong;Yang, Hyeon-Deok;Song, Jin-Dong;Kim, Sang-Hyeok;Yun, Ye-Seul;Choe, Won-Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.324-325
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    • 2014
  • Quantum wells infrared photodetectors (QWIPs) have been used to detect infrared radiations through the principle based on the localized stated in quantum wells (QWs) [1]. The mature III-V compound semiconductor technology used to fabricate these devices results in much lower costs, larger array sizes, higher pixel operability, and better uniformity than those achievable with competing technologies such as HgCdTe. Especially, GaAs/AlGaAs QWIPs have been extensively used for large focal plane arrays (FPAs) of infrared imaging system. However, the research efforts for increasing sensitivity and operating temperature of the QWIPs still have pursued. The modification of heterostructures [2] and the various fabrications for preventing polarization selection rule [3] were suggested. In order to enhance optical performances of the QWIPs, double barrier quantum well (DBQW) structures will be introduced as the absorption layers for the suggested QWIPs. The DBWQ structure is an adequate solution for photodetectors working in the mid-wavelength infrared (MWIR) region and broadens the responsivity spectrum [4]. In this study, InGaAs/GaAs/AlGaAs double barrier quantum well infrared photodetectors (DB-QWIPs) are successfully fabricated and characterized. The heterostructures of the InGaAs/GaAs/AlGaAs DB-QWIPs are grown by molecular beam epitaxy (MBE) system. Photoluminescence (PL) spectroscopy is used to examine the heterostructures of the InGaAs/GaAs/AlGaAs DB-QWIP. The mesa-type DB-QWIPs (Area : $2mm{\times}2mm$) are fabricated by conventional optical lithography and wet etching process and Ni/Ge/Au ohmic contacts were evaporated onto the top and bottom layers. The dark current are measured at different temperatures and the temperature and applied bias dependence of the intersubband photocurrents are studied by using Fourier transform infrared spectrometer (FTIR) system equipped with cryostat. The photovoltaic behavior of the DB-QWIPs can be observed up to 120 K due to the generated built-in electric field caused from the asymmetric heterostructures of the DB-QWIPs. The fabricated DB-QWIPs exhibit spectral photoresponses at wavelengths range from 3 to $7{\mu}m$. Grating structure formed on the window surface of the DB-QWIP will induce the enhancement of optical responses.

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Characteristics of Memory Windows of MFMIS Gate Structures (MFMIS 게이트 구조에서의 메모리 윈도우 특성)

  • Park, Jun-Woong;Kim, Ik-Soo;Shim, Sun-Il;Youm, Min-Soo;Kim, Yong-Tae;Sung, Man-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.319-322
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    • 2003
  • To match the charge induced by the insulators $CeO_2$ with the remanent polarization of ferro electric SBT thin films, areas of Pt/SBT/Pt (MFM) and those of $Pt/CeO_2/Si$ (MIS) capacitors were ind ependently designed. The area $S_M$ of MIS capacitors to the area $S_F$ of MFM capacitors were varied from 1 to 10, 15, and 20. Top electrode Pt and SBT layers were etched with for various area ratios of $S_M\;/\;S_F$. Bottom electrode Pt and $CeO_2$ layers were respectively deposited by do and rf sputtering in-situ process. SBT thin film were prepared by the metal orgnic decomposition (MOD) technique. $Pt(100nm)/SBT(350nm)/Pt(300nm)/CeO_2(40nm)/p-Si$ (MFMIS) gate structures have been fabricated with the various $S_M\;/\;S_F$ ratios using inductively coupled plasma reactive ion etching (ICP-RIE). The leakage current density of MFMIS gate structures were improved to $6.32{\times}10^{-7}\;A/cm^2$ at the applied gate voltage of 10 V. It is shown that in the memory window increase with the area ratio $S_M\;/\;S_F$ of the MFMIS structures and a larger memory window of 3 V can be obtained for a voltage sweep of ${\pm}9\;V$ for MFMIS structures with an area ratio $S_M\;/\;S_F\;=\;6$ than that of 0.9 V of MFS at the same applied voltage. The maximum memory windows of MFMIS structures were 2.28 V, 3.35 V, and 3.7 V with the are a ratios 1, 2, and 6 at the applied gate voltage of 11 V, respectively. It is concluded that ferroelectric gate capacitors of MFMIS are good candidates for nondestructive readout-nonvolatile memories.

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Scanning Electron Microscopic Study of the Effect of Tetracycline-HCl on the Change of Implant Surface Microstructure according to Application Time (염산테트라싸이클린의 적용시간에 따른 임플란트 표면변화에 관한 주사전자현미경적 연구)

  • Kim, Woo-Young;Lee, Man-Sup;Park, Joon-Bong;Herr, Yeek
    • Journal of Periodontal and Implant Science
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    • v.32 no.3
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    • pp.523-537
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    • 2002
  • The present study was performed to evaluate the effect of tetracycline - HCl on the change of implant surface microstructure according to application time. Implants with pure titanium machined surface, SLA surface and $TiO_2blasted$ surface were used. Implant surface was rubbed with 5Omg/ml tetracycline - HCl solution for ${\frac}{1}{2}$ min., 1 min., $1{\frac}{1}{2}$ min., 2 min., and 3min. respectively in the test group and with no conditioning in the control group. Then, the specimens were processed for scanning electron microscopic observation. The following results were obtained. 1. In the pure titanium machined surfaces, the control specimen showed a more or less rough machined surface composed of alternating positive and negative lines corresponding to grooves and ridges. After treatment, machining line was more pronounced for the control specimens. but in general, test specimens were similar to control. 2. In the SLA surfaces, the control specimen showed that the macro roughness was achieved by large-grit sandblasting. subsequently, the acid-etching process crated the micro roughness, which thus was superimposed on the macro roughness. 3. In the SLA surfaces, irrespective of the application time of 50mg/ml tetracycline-HCl solution, in general, test specimens were similar to control. 4. In the $TiO_2blasted$ surfaces the control specimen showed the rough surface with small pits. The irregularity of the $TiO_2blasted$ surfaces with 50mg/ml tetracycline-HCl solution was lessened and the flattened areas were wider relative to the application time of tetracycline - HCl solution. In conclusion, pure titanium machined surfaces and SLA surfaces weren't changed irrespective of the application time of tetracycline-HCl solution. And the $TiO_2blasted$ surfaces conditioned with tetracycline - HCl solution began to be changed from $1{\frac}{1}{2}$ min. This results are expected to be applied to the regenerative procedures for peri-implantitis treatment.

Fabrication and loss measurement of $P_2O_5-SiO_2$ optical waveguides on Si (Si을 기판으로한 $P_2O_5-SiO_2$ 광도파로의 제작 및 손실측정)

  • 이형종;임기건;정창섭;정환재;김진승
    • Korean Journal of Optics and Photonics
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    • v.3 no.4
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    • pp.258-265
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    • 1992
  • A low loss optical waveguide of $P_{2}O_{5}-SiO_{2}$on Si substrate is produced by using the chemical vapour deposition method of $SiO_2$ thin films used in Si technology. Propagation loss of the waveguide layer was 1.65 dB/cm as produced and reduced down to 0.1 dB/cm after heat treatment at $1100^{\circ}C$. By using laser lithography and reactive ion etching method $P_{2}O_{5}-SiO_{2}$ waveguide was produced and subsequently annealed at $1100^{\circ}C$.As a result of this annealing the shape of the waveguide core was changed from rectangular to semi-circular form, and the propagation loss was reduced as down to 0.03 dB/cm at 0.6328$\mu$m and 0.04dB/cm at 1.53$\mu$m. We think that the mechanism of the reduction in propagation loss during the heat treatment is the following: 1) The hydrogen bonding in waveguide layer, which causes absorption loss, is dissociated and diffused out. 2) The roughness of the interface and the micro-structure of the waveguide layer is removed. 3) The irregularities in the cross-sectional shape of the waveguide which was induced during the lithographic process were disappeared by flowing of the waveguide core.

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Proposition of a Vibration Based Acceleration Sensor for the Fully Implantable Hearing Aid (완전 이식형 보청기를 위한 진동 기반의 가속도 센서 제안)

  • Shin, Dong Ho;Mun, H.J.;Seong, Ki Woong;Cho, Jin-Ho
    • Journal of rehabilitation welfare engineering & assistive technology
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    • v.11 no.2
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    • pp.133-141
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    • 2017
  • The hybrid acoustic sensor for implantable hearing aid has the structure in which a sound pressure based acoustic sensor (ECM) and a vibration based acceleration sensor are combined. This sensor combines the low frequency sensitivity of an acoustic sensor with the high frequency sensitivity of an acceleration sensor, allowing the acquisition of a wide range of sound from low to high frequency. In this paper, an acceleration sensor for use in a hybrid acoustic sensor has been proposed. The acceleration sensor captures the vibration of the tympanic membrane generated by the acoustic signal. The size of the proposed acceleration sensor was determined to diameter of 3.2 mm considering the anatomical structure of the tympanic membrane and the standard of ECM. In order to make the hybrid acoustic sensor have high sensitivity and wide bandwidth characteristics, the aim of the resonance frequency of the acceleration sensor is to be generated at about 3.5 kHz. The membrane of the acceleration sensor derives geometric structure through mathematical model and finite element analysis. Based on the analysis results, the membrane was implemented through a chemical etching process. In order to verify the frequency characteristics of the implemented membrane, vibration measurement experiment using external force was performed. The experiment results showed mechanical resonance of the membrane occurred at 3.4 kHz. Therefore, it is considered that the proposed acceleration sensor can be utilized for a hybrid acoustic sensor.