• Journal of Institute of Control, Robotics and Systems
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• v.4 no.3
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.19 no.7
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• pp.53-59
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• 2005

In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The reposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within 17[${\mu}m$].

• Journal of Biosystems Engineering
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• v.23 no.1
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• pp.67-74
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• 1998

A nondestructive quality inspection technique using acoustic impulse response method was developed for eggshell inspection. An experimental system was built to generate the impact force, to measure the response signal and to analyze the frequency spectrum. This system includes an impulse generating unit, an egg holding seal a microphone with preamplifier, and a DSP board installed on Personal Computer. A simple algorithm .was developed for crack detection. Using the developed system with algorithm, crack detection ability was evaluated and the error rate to estimate the normal egg as cracked was found to be 4% and the error rate to estimate the cracked egg as normal was also found to be 4%. This system could be adopted in industry with some modification.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.47 no.6
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• pp.80-85
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• 2010

BGA 409 chip currently the most as a visual inspection of the exterior inspection is conducted. Human depending on visual inspection of the exterior inspection of the current state of testers, depending on how the test results because the change is difficult to expect reliable results. Therefore, the challenges of visual inspection of BGA solder balls to improve the visual inspection technique was developed. However, BGA solder ball size of the microstructure and the characteristics of the distinction between hard test the accuracy of the fall orientation error has a problem. In this paper BGA solder balls exterior inspection of the accuracy to improve the edge detection algorithm, the complement of features and only the comparison proposed a pattern-matching techniques, based on the characteristics of spatial configuration of the area by improving the standard error of the orientation proposed improvements.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.10 no.1
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• pp.1-9
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• 2006

Three categories such as the design of a machine, control and software are necessary in the development of the photomask inspection machine with high resolution. Among them, the design of a software detects inferiority through the comparison of CAD data and real data read by camera from photomask. The block matching algorithm is used since the domain is large and the comparison of data by pixel is accomplished. To correct the error arising from the assembly of a machine, calibration algorithm is used and prefocusing algorithm is suggested to correct the surface of the photomask.

• Design & Manufacturing
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• v.14 no.2
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• pp.14-20
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• 2020

In OLED panel production process, it is necessary to cut a part of protective film as a preprocess for lighting inspection. The current method is to recognize only the fiducial mark of the cut-out panel. Bare Glass Cutting does not compensate for machining cumulative tolerances. Even though process defects still occur, it is necessary to develop technology to solve this problem because only the Align Mark of the panel that has already been cut is used as the reference point for alignment. There is a lot of defective lighting during panel lighting test because the correct protective film is not cut on the panel power and signal application pad position. In laser cutting process to remove the polarizing film / protective film / TSP film of OLED panel, laser processing is not performed immediately after the panel alignment based on the alignment mark only. Therefore, in this paper, we performed real time inspection which minimizes the mechanism tolerance by correcting the laser cutting path of the protective film in real time using Machine Vision. We have studied calibration algorithm of Vision Software coordinate system and real image coordinate system to minimize inspection resolution and position detection error and edge detection algorithm to accurately measure edge of panel.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.5
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• pp.9-18
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• 1998

The components with J-lead. which are more integrated and smaller than ones with Gull-wing. are rapidly being used in electronic board such as the PCB, for they have the advantage of occupying a small space compared to the other components. However, the development of inspection system for these new components is not so rapid as component development. Component-inspection with J-lead using vision system is difficult because they are hidden from camera optical axis. X-ray inspection, which has the advantage of inspecting the inside of solder state, is used to J-lead inspection. However. it is high cost and dangerous by leaking out X-ray compared to vision system. Therefore, in this paper, we design vision system suited to J-lead inspection and then propose algorithm which have flexibility in mount and rand error.

• Proceedings of the IEEK Conference
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• 2002.06d
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• pp.81-84
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• 2002

This paper presents the real-time PCB(Printed circuit board) inspection system that can detect thin open/short error using the line scan camera. After a overall introduction of our system, the outline of our inspection methods are described. The goal of our inspection system is the real time and detailed inspection using the line scan camera. To perform inspection processing in real-time, we utilize double buffering structure. In order to solve the problem of unexpectable pixels of PCB, we propose melting process which eliminates unexpectable pixels of PCB. The design and development of our prototype of PCB ins- pection system is discussed and test results are presented to show the effectiveness of the developed inspection algorithm.

• Journal of the Korean Society of Industry Convergence
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• v.18 no.4
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• pp.241-249
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• 2015

The purpose of this research is to develop the pattern recognition algorithm based on smart camera for inspection automation, and including external surface state of molding parts or optical parts. By performance verification, this development can be applied to establish for existing reflex data because inputting surface badness degree of scratch's standard specification condition directly. And it is pdssible to distinguish from schedule error of badness product and normalcy product within schedule extent after calculating the error comparing actuality measurement reflex data and standard reflex data mutually. The proposed technology cab be applied to test for masearing of the smallest 10 pixel unit. It is illustrated the relibility pf proposed technology by an experiment.

• Smart Media Journal
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• v.11 no.9
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• pp.47-55
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• 2022

Quality control in the smart factory manufacturing process is an important factor. Currently, quality inspection of home appliance manufacturing parts produced by the mold process is mostly performed with the naked eye of the operator, resulting in a high error rate of inspection. In order to improve the quality competition, an automatic defect detection system was designed and implemented. The proposed system acquires an image by photographing an object with a high-performance scan camera at a specific location, and reads defective products due to scratches, dents, and foreign substances according to the vision inspection algorithm. In this study, the depth-based branch decision algorithm (DBD) was developed to increase the recognition rate of defects due to scratches, and the accuracy was improved.