• Journal of KSNVE
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• v.9 no.6
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• pp.1227-1233
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• 1999

Modern technology depends on the reliability of extremely high technology equipments. In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a nanometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. This paper deals with the structural dynamic design in high class semiconductor factory in order to be satisfied more strict vibration criteria for high sensitive equipment.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.11-15
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• 2004

Scales, accumulated on some parts of semiconductor equipments such as sputters and CVD during the device fabrication processes, often lower the lifetime of the equipments and production yields. Thus, many equipment parts have be cleaned regularly. In this study, an attempt to establish an effective process to remove scales on the sidewall of collimators located inside the chamber of the sputter was made. The EDX analysis revealed that the scales were composed of Ti and TiN with the columnar structure. Through the trial-and-error experiments, it was found that the etching in the $HNO_3$:$H_2SO_4$:$H_2O$=4:2:4 solution for 5.5 hrs at $67^{\circ}C$, after the oxide removal in the HF solution, and the heat-treatment at $700^{\circ}C$ for 1 min., was the most effective process for the scale removal.

• International Journal of Quality Innovation
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• v.6 no.1
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• pp.58-73
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• 2005

The objective of this study is to evaluate the equipment risk before and after SEMI S2-93A implementation, thus providing a guideline for safety improvement. Semiconductor Plant A located in Taiwan's Hsinchu Science Based Industrial Park with 147 manufacturing machines was used for risk assessment. This study was carried out in three steps. First, a preliminary hazard analysis was conducted. A detailed process safety evaluation was conducted (Hazard and Operability Study, HAZOP); and finally, the equipment risk comparison before and after Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation. The preliminary hazard analysis results showed high risk in 21.77% of the manufacturing machines under risk assessment at Plant A. The largest percentage existed in the Diffusion Department. The machine types specified by the hazardous work site review and inspection according to Article 26 of Labor Inspection Regulation (the machines that use such chemicals as, $SiH_4$, HF, HCL, etc. and that are determined to be highly hazardous through preliminary hazard analysis) were added to the detailed process analysis and evaluation. In the third part of this evaluation, the machines at Plant A used for detailed process safety assessment were divided into two groups based on the manufacturing data before and after 1993. The severity, possibility, and actual accident analysis before and after SEMI S2-93A implementation were compared. The Semiconductor Equipment Manufacturing Instruction (SEMI S2-93A) implementation can reduce the severity and possibility of hazard occurrence.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3319-3325
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• 2012

This paper describes the development of the TrackSim, which is a discrete event simulation tool for photolithography equipment of semiconductor industry. The TrackSim is focused on the accurate simulation model of the photolithography equipment and easy-to-use user interfaces. TrackSim provides 3D simulation environment for evaluating, validating, and scheduling the photolithography process. One of the major characteristics of TrackSim is in that it is developed based on Applied Materials' AutoMod, a discrete event simulation software broadly used in semiconductor industry. Accordingly, the photolithography model of TrackSim can be used to perform simulation connected with other simulation models built with AutoMod.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.154-159
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• 2003

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

• Journal of Advanced Navigation Technology
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• v.15 no.6
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• pp.1104-1110
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• 2011

The conventional semiconductor equipment has adopted SRAM module as the test pattern memory, which has a simple design and does not require refreshing. However, SRAM has its disadvantages as it takes up more space as its capacity becomes larger, making it difficult to meet the requirements of large memories and compact size. if DRAM is adopted as the semiconductor inspection equipment, it takes up less space and costs less than SRAM. However, DRAM is also disadvantageous because it requires the memory cell refresh, which is not suitable for the semiconductor examination equipments that require correct timing. Therefore, In this paper, we will proposed an algorithm for punctuality guarantee of memory-free inspection equipment using DDR2 SDRAM. And we will Developed memory controller using punctuality guarantee algorithm. As the results, show that when we adopt the DDR2 SDRAM, we can get the benefits of saving 13.5 times and 5.3 times in cost and space, respectively, compared to the SRAM.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.6-13
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• 2021

Cases and studies on the selection method of CTQ are relatively active, but there are few cases or studies on the selection method of CTP which is important in the device industry. In fact, many companies simply select and manage CTP from the point of contact based on their experience and intuition. The purpose of this study is to present an evaluation model and a mathematical decision model for rational and systematic CTP selection to improve the process quality of semiconductor equipment lines. In the evaluation model, AHP (Analytic Hierarchy Process) analysis technique was applied to show objective and quantitative figures, and Fuzzy decision-making model was used to solve the ambiguity and uncertainty in the decision-making process. Decision Value (DV) was presented. The subjects were 22 process factors managed in the Plating Process that the representative equipment line can do. As a result, the evaluation model proposed in this study can support more efficient and effective decision-making for process quality improvement by more objectively measuring the problem of subjective CTP selection in manufacturing sites.

• Journal of the Semiconductor & Display Technology
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• v.12 no.2
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• pp.39-43
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• 2013

The semiconductor equipments generate necessary data through communication networks for the effective manufacturing processes and automation of semiconductor equipments. For transferring data between semiconductor equipments and sending data to monitor equipments, several standards for communication protocols have been proposed. Communication networks in semiconductor manufacturing systems will transmit a lot of data traffic, which can be vulnerable in data delay and network failure. Therefore, it is required that data traffic need to be distributed. To accomplish this objective, we recommend the use of a redundant and valuable communication path which is constructed by a wireless sensor network. In this paper, the directed diffusion method for wireless sensor networking is suggested for networking semiconductor equipments. It is shown that how the directed diffusion is employed to connect semiconductor equipments. Also, we show how to implement the SECS of semiconductor equipments communication protocols based on the directed diffusion.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.168-173
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• 2022

As the function of a product is advanced and the process is refined, the yield in the fine manufacturing process becomes an important variable that determines the cost and quality of the product. Since a fine manufacturing process generally produces a product through many steps, it is difficult to find which process or equipment has a defect, and thus it is practically difficult to ensure a high yield. This paper presents the system architecture of how to build a smart manufacturing system to analyze the big data of the manufacturing plant, and the equipment factor analysis methodology to increase the yield of products in the smart manufacturing system. In order to improve the yield of the product, it is necessary to analyze the defect factor that causes the low yield among the numerous factors of the equipment, and find and manage the equipment factor that affects the defect factor. This study analyzed the key factors of abnormal equipment that affect the yield of products in the manufacturing process using the data mining technique. Eventually, a methodology for finding key factors of abnormal equipment that directly affect the yield of products in smart manufacturing systems is presented. The methodology presented in this study was applied to the actual manufacturing plant to confirm the effect of key factors of important facilities on yield.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.143-148
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• 2019

Numerous pipe lines can be found on various plant-based industrial sites. These pipelines should be periodically checked for defects. Most of these pipelines are internally inaccessible and difficult to visually inspect. Therefore, the inspection is being carried out with the help of non-contact inspection equipment such as ultrasonic flaw detection equipment. The use of ultrasonic flaw detection equipment can raise time and efficiency issues. In order to solve this problem, we will study the basic technology necessary for the development of automated inspection system equipped with ultrasonic measuring equipment and verify the validity through the fabrication of the demonstration device.